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Double Layer RF-35A2 PCB 20mil Taconic PCB With Immersion Gold

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China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Double Layer RF-35A2 PCB 20mil Taconic PCB With Immersion Gold

Double Layer RF-35A2 PCB 20mil Taconic PCB With Immersion Gold
Double Layer RF-35A2 PCB 20mil Taconic PCB With Immersion Gold Double Layer RF-35A2 PCB 20mil Taconic PCB With Immersion Gold

Large Image :  Double Layer RF-35A2 PCB 20mil Taconic PCB With Immersion Gold

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-168.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: PTFE Ceramic Fiberglass Layer Count: Double Layer, Multilayer, Hybrid PCB
PCB Thickness: 10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) PCB Size: ≤400mm X 500mm
Solder Mask: Green, Black, Blue, Yellow, Red Etc. Copper Weight: 0.5oz (17 µm), 1oz (35µm)
Surface Finish: Bare Copper, HASL, ENIG, Immersion Silver, Immersoin Tin, OSP Etc..
High Light:

PTFE Ceramic Fiberglass PCB Board

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20mil Fiberglass PCB Board

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Power Amplifiers Fiberglass PCB Board

 

Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Taconic’s RF-35A2 substrate is designed to have ultra-low fiberglass content to achieve "best in class" insertion loss properties and the uniform dielectric constant 3.5 +/-0.05 throughout the laminate. It is a type of ultra low loss power amplifier material.

 

The uniform dispersion of ceramics throughout the laminate yields an extremely low X and Y thermal expansion coefficient. Low modulus and low X-Y CTE values make RF-35A2 an attractive material for chip carrier in surface mounting technology.

 

RF-35A2 is manufactured with a proprietary multi-step process with excellent dielectric performance and excellent copper peel adhesion.The low 0.0015 dissipation factor at 10 GHz allows for maximum power transfer resulting in low heat generation.

 

Double Layer RF-35A2 PCB 20mil Taconic PCB With Immersion Gold 0

 

Benefits:

Low loss properties

DK tolerance of +/- 0.05

Homogeneous DK

Excellent peel strength

Low moisture absorption

 

Our PCB Capability (RF-35A2)

PCB Material: PTFE Ceramic Fiberglass
Designation: RF-35A2
Dielectric constant: 3.15
Dissipation Factor 0.0015
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm)
PCB thickness: 10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..

 

Applications:

Power amplifiers

Filters / couplers

High speed digital

Passive components

Wireless antennas

 

RF-35A2 Typical Values

RF-35A2 Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   3.5   3.5
Df @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   0.0015   0.0015
Moisture Absorption IPC-650 2.6.2.1 % 0.03 % 0.03
Dielectric Breakdown IPC-650 2.5.6/ASTM D 149 kV 59 kV 59
Dielectric Strength ASTM D 149 V/mil 1000 V/mm 39,370
Volume Resistivity IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) Mohm/cm 10^9 Mohm/cm 10^9
Surface Resistivity IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) Mohm 10^8 Mohm 10^8
Arc Resistance IPC-650 2.5.1 Seconds 242 Seconds 242
Flexural Strength (MD) IPC-650 2.4.4 kpsi 24 N/mm2 165
Flexural Strength (CD) IPC-650 2.4.4 kpsi 15 N/mm2 103
Tensile Strength (MD) ASTM D 3039 psi 16,800 N/mm2 116
Tensile Strength (CD) ASTM D 3039 psi 11,000 N/mm2 75.8
Young’s Modulus (MD) ASTM D 3039 psi 106 N/mm2 8,343
Young’s Modulus (CD) ASTM D 3039 psi 106 N/mm2 7,171
Poisson’s Ratio (MD) ASTM D 3039   0.14   0.14
Poisson’s Ratio (CD) ASTM D 3039   0.1   0.1
Strain at Break (MD) ASTM D 3039 % 1.6 % 1.6
Strain at Break (CD) ASTM D 3039 % 1.4 % 1.4
Compressive Modulus (Z axis) ASTM D 695 (23°C) kpsi 385 N/mm2 2,650
Peel Strength (1 oz. VLP) IPC-650 2.4.8 (Thermal Stress) lbs/in 12 N/mm 2.1
Peel Strength (1 oz. VLP) IPC-650 2.4.8.3 (150°C ) (Elevated Temp.) lbs/in 14 N/mm 2.5
Peel Strength (1 oz. VLP) IPC-650 2.4.8 Sec. 5.2.3 (Proc. Chemicals) lbs/in 11 N/mm 2
Density (Specific Gravity)   gm/cm3 2.28 gm/cm3 2.28
Specific Heat ASTM E 1269 (DSC) (100°C) J/g/K 0.99 J/g/K 0.99
Thermal Conductivity ASTM F 433 W/M*K 0.29 W/M*K 0.29
Td IPC-650 2.4.24.6 2% Weight Loss °C 528 °C 528
Td IPC-650 2.4.24.6 5% Weight Loss °C 547 °C 547
CTE (x) IPC-650 2.4.41 (>RT - 125°C) ppm/°C 10 ppm/°C 10
CTE (y) IPC-650 2.4.41 (>RT - 125°C) ppm/°C 13 ppm/°C 13
CTE (z) IPC-650 2.4.41 (>RT - 125°C) ppm/°C 108 ppm/°C 108

 

Double Layer RF-35A2 PCB 20mil Taconic PCB With Immersion Gold 1

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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