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Double Layer RF-35A2 PCB 20mil Taconic PCB With Immersion Gold

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Double Layer RF-35A2 PCB 20mil Taconic PCB With Immersion Gold

MOQ:	1PCS
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-168.V1.0

Base Material:

PTFE Ceramic Fiberglass

Layer Count:

Double Layer, Multilayer, Hybrid PCB

PCB Thickness:

10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)

PCB Size:

≤400mm X 500mm

Solder Mask:

Green, Black, Blue, Yellow, Red Etc.

Copper Weight:

0.5oz (17 µm), 1oz (35µm)

Surface Finish:

Bare Copper, HASL, ENIG, Immersion Silver, Immersoin Tin, OSP Etc..

Highlight:

PTFE Ceramic Fiberglass PCB Board

20mil Fiberglass PCB Board

Power Amplifiers Fiberglass PCB Board

Product Description

Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Taconic’s RF-35A2 substrate is designed to have ultra-low fiberglass content to achieve "best in class" insertion loss properties and the uniform dielectric constant 3.5 +/-0.05 throughout the laminate. It is a type of ultra low loss power amplifier material.

The uniform dispersion of ceramics throughout the laminate yields an extremely low X and Y thermal expansion coefficient. Low modulus and low X-Y CTE values make RF-35A2 an attractive material for chip carrier in surface mounting technology.

RF-35A2 is manufactured with a proprietary multi-step process with excellent dielectric performance and excellent copper peel adhesion.The low 0.0015 dissipation factor at 10 GHz allows for maximum power transfer resulting in low heat generation.

Double Layer RF-35A2 PCB 20mil Taconic PCB With Immersion Gold 0

Benefits:

- The material has low loss properties, which means that it does not dissipate much energy in the form of heat and can maintain high signal integrity.

- The DK tolerance of +/- 0.05 ensures that the material maintains consistent electrical performance, which is important for high-speed communication applications.

- The homogeneous DK means that the material has uniform electrical properties throughout, which can help to reduce signal distortion and improve electrical performance.

- The excellent peel strength means that the material can maintain strong adhesion between layers, which is important for maintaining the integrity and reliability of the PCB.

- The low moisture absorption means that the material is less likely to be affected by changes in humidity or temperature, which can help to maintain electrical performance and prevent damage to the PCB.

Our PCB Capability (RF-35A2)

PCB Material:	PTFE Ceramic Fiberglass
Designation:	RF-35A2
Dielectric constant:	3.15
Dissipation Factor	0.0015
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm)
PCB thickness:	10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB thickness:
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..

The applications are power amplifiers, filters / couplers, high speed digital, passive components, wireless antennas etc.

RF-35A2 Typical Values

RF-35A2 Typical Values
Property	Test Method	Unit	Value	Unit	Value
Dk @ 10 GHz	IPC-650 2.5.5.5.1 (Modified)		3.5		3.5
Df @ 10 GHz	IPC-650 2.5.5.5.1 (Modified)		0.0015		0.0015
Moisture Absorption	IPC-650 2.6.2.1	%	0.03	%	0.03
Dielectric Breakdown	IPC-650 2.5.6/ASTM D 149	kV	59	kV	59
Dielectric Strength	ASTM D 149	V/mil	1000	V/mm	39,370
Volume Resistivity	IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.)	Mohm/cm	10^9	Mohm/cm	10^9
Surface Resistivity	IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.)	Mohm	10^8	Mohm	10^8
Arc Resistance	IPC-650 2.5.1	Seconds	242	Seconds	242
Flexural Strength (MD)	IPC-650 2.4.4	kpsi	24	N/mm²	165
Flexural Strength (CD)	IPC-650 2.4.4	kpsi	15	N/mm²	103
Tensile Strength (MD)	ASTM D 3039	psi	16,800	N/mm²	116
Tensile Strength (CD)	ASTM D 3039	psi	11,000	N/mm²	75.8
Young’s Modulus (MD)	ASTM D 3039	psi	106	N/mm²	8,343
Young’s Modulus (CD)	ASTM D 3039	psi	106	N/mm²	7,171
Poisson’s Ratio (MD)	ASTM D 3039		0.14		0.14
Poisson’s Ratio (CD)	ASTM D 3039		0.1		0.1
Strain at Break (MD)	ASTM D 3039	%	1.6	%	1.6
Strain at Break (CD)	ASTM D 3039	%	1.4	%	1.4
Compressive Modulus (Z axis)	ASTM D 695 (23°C)	kpsi	385	N/mm²	2,650
Peel Strength (1 oz. VLP)	IPC-650 2.4.8 (Thermal Stress)	lbs/in	12	N/mm	2.1
Peel Strength (1 oz. VLP)	IPC-650 2.4.8.3 (150°C ) (Elevated Temp.)	lbs/in	14	N/mm	2.5
Peel Strength (1 oz. VLP)	IPC-650 2.4.8 Sec. 5.2.3 (Proc. Chemicals)	lbs/in	11	N/mm	2
Density (Specific Gravity)		gm/cm³	2.28	gm/cm³	2.28
Specific Heat	ASTM E 1269 (DSC) (100°C)	J/g/K	0.99	J/g/K	0.99
Thermal Conductivity	ASTM F 433	W/M*K	0.29	W/M*K	0.29
Td	IPC-650 2.4.24.6 2% Weight Loss	°C	528	°C	528
Td	IPC-650 2.4.24.6 5% Weight Loss	°C	547	°C	547
CTE (x)	IPC-650 2.4.41 (>RT - 125°C)	ppm/°C	10	ppm/°C	10
CTE (y)	IPC-650 2.4.41 (>RT - 125°C)	ppm/°C	13	ppm/°C	13
CTE (z)	IPC-650 2.4.41 (>RT - 125°C)	ppm/°C	108	ppm/°C	108

Double Layer RF-35A2 PCB 20mil Taconic PCB With Immersion Gold 1

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