Payment & Shipping Terms:
|Base Material:||PTFE Ceramic Fiberglass||Layer Count:||Double Layer, Multilayer, Hybrid PCB|
|PCB Thickness:||10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)||PCB Size:||≤400mm X 500mm|
|Solder Mask:||Green, Black, Blue, Yellow, Red Etc.||Copper Weight:||0.5oz (17 µm), 1oz (35µm)|
|Surface Finish:||Bare Copper, HASL, ENIG, Immersion Silver, Immersoin Tin, OSP Etc..|
PTFE Ceramic Fiberglass PCB Board,
20mil Fiberglass PCB Board,
Power Amplifiers Fiberglass PCB Board
Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Taconic’s RF-35A2 substrate is designed to have ultra-low fiberglass content to achieve "best in class" insertion loss properties and the uniform dielectric constant 3.5 +/-0.05 throughout the laminate. It is a type of ultra low loss power amplifier material.
The uniform dispersion of ceramics throughout the laminate yields an extremely low X and Y thermal expansion coefficient. Low modulus and low X-Y CTE values make RF-35A2 an attractive material for chip carrier in surface mounting technology.
RF-35A2 is manufactured with a proprietary multi-step process with excellent dielectric performance and excellent copper peel adhesion.The low 0.0015 dissipation factor at 10 GHz allows for maximum power transfer resulting in low heat generation.
- The material has low loss properties, which means that it does not dissipate much energy in the form of heat and can maintain high signal integrity.
- The DK tolerance of +/- 0.05 ensures that the material maintains consistent electrical performance, which is important for high-speed communication applications.
- The homogeneous DK means that the material has uniform electrical properties throughout, which can help to reduce signal distortion and improve electrical performance.
- The excellent peel strength means that the material can maintain strong adhesion between layers, which is important for maintaining the integrity and reliability of the PCB.
- The low moisture absorption means that the material is less likely to be affected by changes in humidity or temperature, which can help to maintain electrical performance and prevent damage to the PCB.
Our PCB Capability (RF-35A2)
|PCB Material:||PTFE Ceramic Fiberglass|
|Layer count:||Double Layer, Multilayer, Hybrid PCB|
|Copper weight:||0.5oz (17 µm), 1oz (35µm)|
|PCB thickness:||10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)|
|PCB size:||≤400mm X 500mm|
|Solder mask:||Green, Black, Blue, Yellow, Red etc.|
|Surface finish:||Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..|
The applications are power amplifiers, filters / couplers, high speed digital, passive components, wireless antennas etc.
RF-35A2 Typical Values
|RF-35A2 Typical Values|
|Dk @ 10 GHz||IPC-650 188.8.131.52.1 (Modified)||3.5||3.5|
|Df @ 10 GHz||IPC-650 184.108.40.206.1 (Modified)||0.0015||0.0015|
|Moisture Absorption||IPC-650 220.127.116.11||%||0.03||%||0.03|
|Dielectric Breakdown||IPC-650 2.5.6/ASTM D 149||kV||59||kV||59|
|Dielectric Strength||ASTM D 149||V/mil||1000||V/mm||39,370|
|Volume Resistivity||IPC-650 18.104.22.168 Sec. 5.2.1 (Humidity Cond.)||Mohm/cm||10^9||Mohm/cm||10^9|
|Surface Resistivity||IPC-650 22.214.171.124 Sec. 5.2.1 (Humidity Cond.)||Mohm||10^8||Mohm||10^8|
|Arc Resistance||IPC-650 2.5.1||Seconds||242||Seconds||242|
|Flexural Strength (MD)||IPC-650 2.4.4||kpsi||24||N/mm2||165|
|Flexural Strength (CD)||IPC-650 2.4.4||kpsi||15||N/mm2||103|
|Tensile Strength (MD)||ASTM D 3039||psi||16,800||N/mm2||116|
|Tensile Strength (CD)||ASTM D 3039||psi||11,000||N/mm2||75.8|
|Young’s Modulus (MD)||ASTM D 3039||psi||106||N/mm2||8,343|
|Young’s Modulus (CD)||ASTM D 3039||psi||106||N/mm2||7,171|
|Poisson’s Ratio (MD)||ASTM D 3039||0.14||0.14|
|Poisson’s Ratio (CD)||ASTM D 3039||0.1||0.1|
|Strain at Break (MD)||ASTM D 3039||%||1.6||%||1.6|
|Strain at Break (CD)||ASTM D 3039||%||1.4||%||1.4|
|Compressive Modulus (Z axis)||ASTM D 695 (23°C)||kpsi||385||N/mm2||2,650|
|Peel Strength (1 oz. VLP)||IPC-650 2.4.8 (Thermal Stress)||lbs/in||12||N/mm||2.1|
|Peel Strength (1 oz. VLP)||IPC-650 126.96.36.199 (150°C ) (Elevated Temp.)||lbs/in||14||N/mm||2.5|
|Peel Strength (1 oz. VLP)||IPC-650 2.4.8 Sec. 5.2.3 (Proc. Chemicals)||lbs/in||11||N/mm||2|
|Density (Specific Gravity)||gm/cm3||2.28||gm/cm3||2.28|
|Specific Heat||ASTM E 1269 (DSC) (100°C)||J/g/K||0.99||J/g/K||0.99|
|Thermal Conductivity||ASTM F 433||W/M*K||0.29||W/M*K||0.29|
|Td||IPC-650 188.8.131.52 2% Weight Loss||°C||528||°C||528|
|Td||IPC-650 184.108.40.206 5% Weight Loss||°C||547||°C||547|
|CTE (x)||IPC-650 2.4.41 (>RT - 125°C)||ppm/°C||10||ppm/°C||10|
|CTE (y)||IPC-650 2.4.41 (>RT - 125°C)||ppm/°C||13||ppm/°C||13|
|CTE (z)||IPC-650 2.4.41 (>RT - 125°C)||ppm/°C||108||ppm/°C||108|
Contact Person: Ms. Ivy Deng