We Are Your RF PCB Solution Provider!
Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB
ISO9001, ISO14001, IATF 16949 certified
We Are Your RF PCB Solution Provider!
Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB
ISO9001, ISO14001, IATF 16949 certified
Product Details:
Payment & Shipping Terms:
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Base Material: | PTFE Ceramic Fiberglass | Layer Count: | Double Layer, Multilayer, Hybrid PCB |
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PCB Thickness: | 10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) | PCB Size: | ≤400mm X 500mm |
Solder Mask: | Green, Black, Blue, Yellow, Red Etc. | Copper Weight: | 0.5oz (17 µm), 1oz (35µm) |
Surface Finish: | Bare Copper, HASL, ENIG, Immersion Silver, Immersoin Tin, OSP Etc.. | ||
High Light: | PTFE Ceramic Fiberglass PCB Board,20mil Fiberglass PCB Board,Power Amplifiers Fiberglass PCB Board |
Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Taconic’s RF-35A2 substrate is designed to have ultra-low fiberglass content to achieve "best in class" insertion loss properties and the uniform dielectric constant 3.5 +/-0.05 throughout the laminate. It is a type of ultra low loss power amplifier material.
The uniform dispersion of ceramics throughout the laminate yields an extremely low X and Y thermal expansion coefficient. Low modulus and low X-Y CTE values make RF-35A2 an attractive material for chip carrier in surface mounting technology.
RF-35A2 is manufactured with a proprietary multi-step process with excellent dielectric performance and excellent copper peel adhesion.The low 0.0015 dissipation factor at 10 GHz allows for maximum power transfer resulting in low heat generation.
Benefits:
Low loss properties
DK tolerance of +/- 0.05
Homogeneous DK
Excellent peel strength
Low moisture absorption
Our PCB Capability (RF-35A2)
PCB Material: | PTFE Ceramic Fiberglass |
Designation: | RF-35A2 |
Dielectric constant: | 3.15 |
Dissipation Factor | 0.0015 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm) |
PCB thickness: | 10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc.. |
Applications:
Power amplifiers
Filters / couplers
High speed digital
Passive components
Wireless antennas
RF-35A2 Typical Values
RF-35A2 Typical Values | |||||
Property | Test Method | Unit | Value | Unit | Value |
Dk @ 10 GHz | IPC-650 2.5.5.5.1 (Modified) | 3.5 | 3.5 | ||
Df @ 10 GHz | IPC-650 2.5.5.5.1 (Modified) | 0.0015 | 0.0015 | ||
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.03 | % | 0.03 |
Dielectric Breakdown | IPC-650 2.5.6/ASTM D 149 | kV | 59 | kV | 59 |
Dielectric Strength | ASTM D 149 | V/mil | 1000 | V/mm | 39,370 |
Volume Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) | Mohm/cm | 10^9 | Mohm/cm | 10^9 |
Surface Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) | Mohm | 10^8 | Mohm | 10^8 |
Arc Resistance | IPC-650 2.5.1 | Seconds | 242 | Seconds | 242 |
Flexural Strength (MD) | IPC-650 2.4.4 | kpsi | 24 | N/mm2 | 165 |
Flexural Strength (CD) | IPC-650 2.4.4 | kpsi | 15 | N/mm2 | 103 |
Tensile Strength (MD) | ASTM D 3039 | psi | 16,800 | N/mm2 | 116 |
Tensile Strength (CD) | ASTM D 3039 | psi | 11,000 | N/mm2 | 75.8 |
Young’s Modulus (MD) | ASTM D 3039 | psi | 106 | N/mm2 | 8,343 |
Young’s Modulus (CD) | ASTM D 3039 | psi | 106 | N/mm2 | 7,171 |
Poisson’s Ratio (MD) | ASTM D 3039 | 0.14 | 0.14 | ||
Poisson’s Ratio (CD) | ASTM D 3039 | 0.1 | 0.1 | ||
Strain at Break (MD) | ASTM D 3039 | % | 1.6 | % | 1.6 |
Strain at Break (CD) | ASTM D 3039 | % | 1.4 | % | 1.4 |
Compressive Modulus (Z axis) | ASTM D 695 (23°C) | kpsi | 385 | N/mm2 | 2,650 |
Peel Strength (1 oz. VLP) | IPC-650 2.4.8 (Thermal Stress) | lbs/in | 12 | N/mm | 2.1 |
Peel Strength (1 oz. VLP) | IPC-650 2.4.8.3 (150°C ) (Elevated Temp.) | lbs/in | 14 | N/mm | 2.5 |
Peel Strength (1 oz. VLP) | IPC-650 2.4.8 Sec. 5.2.3 (Proc. Chemicals) | lbs/in | 11 | N/mm | 2 |
Density (Specific Gravity) | gm/cm3 | 2.28 | gm/cm3 | 2.28 | |
Specific Heat | ASTM E 1269 (DSC) (100°C) | J/g/K | 0.99 | J/g/K | 0.99 |
Thermal Conductivity | ASTM F 433 | W/M*K | 0.29 | W/M*K | 0.29 |
Td | IPC-650 2.4.24.6 2% Weight Loss | °C | 528 | °C | 528 |
Td | IPC-650 2.4.24.6 5% Weight Loss | °C | 547 | °C | 547 |
CTE (x) | IPC-650 2.4.41 (>RT - 125°C) | ppm/°C | 10 | ppm/°C | 10 |
CTE (y) | IPC-650 2.4.41 (>RT - 125°C) | ppm/°C | 13 | ppm/°C | 13 |
CTE (z) | IPC-650 2.4.41 (>RT - 125°C) | ppm/°C | 108 | ppm/°C | 108 |
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