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Based Material: | RF-60A | Thickness: | 25mil |
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PCB Size: | 12'x18', 18'x24'... | Surface: | Bare Copper |
High Light: | Bare Copper PCB Board,1oz Taconic PCB,RF-60A Taconic PCB |
High Frequency PCB RF-60A 1oz 25mil Bare Copper PCB
The woven glass reinforcing in RF-60A ensures superior three-dimensional stability and increases flexural strength. Because of its limited Z-axis expansion, it can reliably be plated through holes in extremely hot settings. It is the optimum high DK product for applications needing decreased circuit size and weight, with a dielectric constant of roughly 6.15. It is a great option for RF circuits due to the low electrical loss factor.
Typical Applications:
Power Amplifiers
Filters & Couplers
Passive Components
Antennas
Data Sheet of Taconic RF-60A
Property | Test Method | Unit | Value | Unit | Value |
Dk @ 10 GHz | IPC-650 2.5.5.6 | 6.15 | 6.15 | ||
Df @ 10 GHz | IPC-650 2.5.5.5.1 | 0.0038 | 0.0038 | ||
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
Dielectric Breakdown | IPC-650 2.5.6 | kV | 53 | kV | 53 |
Dielectric Strength | ASTM D 149 | V/mil | 880 | kV/mm | 35 |
Volume Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm/cm | 9.0 x 108 | Mohm/cm | 9.0 x 108 |
Surface Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm | 2.28 x 108 | Mohm | 2.28 x 108 |
Arc Resistance | IPC-650 2.5.1 | Seconds | 193 | Seconds | 193 |
Flexural Strength (MD) | ASTM D 790 | psi | 18,300 | N/mm2 | 126.2 |
Flexural Strength (CD) | ASTM D 790 | psi | 14,600 | N/mm2 | 100.7 |
Tensile Strength (MD) | ASTM D 3039 | psi | 19,500 | N/mm2 | 134.4 |
Tensile Strength (CD) | ASTM D 3039 | psi | 16,300 | N/mm2 | 112.4 |
Young’s Modulus | ASTM D 3039 | kpsi | 1,590 | N/mm2 | 11,000 |
Poisson’s Ratio | ASTM D 3039 | 0.068 | N/mm2 | 0.068 | |
Compressive Modulus | ASTM D 695 (23°C) | kpsi | 338 | 2,330 | |
Peel Strength (1 oz. ED) | IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress) | lbs/in | 8 | N/mm | 1.4 |
Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.68 | mm/M | 0.68 |
Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 1.05 | mm/M | 1.05 |
Density (Specific Gravity) | ASTM D 792 | g/cm3 | 2.79 | g/cm3 | 2.79 |
Thermal Conductivity | ASTM F 433 | W/M*K | 0.4 | W/M*K | 0.4 |
CTE (X axis) | ASTM D 3386 (-30°C - 125°C) | ppm/°C | 9 | ppm/°C | 9 |
CTE (Y axis) | ASTM D 3386 (-30°C - 125°C) | ppm/°C | 8 | ppm/°C | 8 |
CTE (Z axis) | ASTM D 3386 (-30°C - 125°C) | ppm/°C | 69 | ppm/°C | 69 |
Outgassing (% TML) | ASTM E 595* | % | 0.02 | % | 0.02 |
Outgassing (% CVCM) | ASTM E 595* | % | 0.00 | % | 0.00 |
Outgassing (% WVR) | ASTM E 595* | % | 0.01 | % | 0.01 |
Flammability Rating | UL 94 | V-0 | V-0 |
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848