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Single Layer Flexible Printed Circuit on Polyimide with 2oz Copper Yellow Coverlay and Immersion Gold for Capacitive Scr

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Single Layer Flexible Printed Circuit on Polyimide with 2oz Copper Yellow Coverlay and Immersion Gold for Capacitive Scr

Single Layer Flexible Printed Circuit on Polyimide with 2oz Copper Yellow Coverlay and Immersion Gold for Capacitive Scr
Single Layer Flexible Printed Circuit on Polyimide with 2oz Copper Yellow Coverlay and Immersion Gold for Capacitive Scr Single Layer Flexible Printed Circuit on Polyimide with 2oz Copper Yellow Coverlay and Immersion Gold for Capacitive Scr Single Layer Flexible Printed Circuit on Polyimide with 2oz Copper Yellow Coverlay and Immersion Gold for Capacitive Scr Single Layer Flexible Printed Circuit on Polyimide with 2oz Copper Yellow Coverlay and Immersion Gold for Capacitive Scr Single Layer Flexible Printed Circuit on Polyimide with 2oz Copper Yellow Coverlay and Immersion Gold for Capacitive Scr Single Layer Flexible Printed Circuit on Polyimide with 2oz Copper Yellow Coverlay and Immersion Gold for Capacitive Scr

Large Image :  Single Layer Flexible Printed Circuit on Polyimide with 2oz Copper Yellow Coverlay and Immersion Gold for Capacitive Scr

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-292.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: Polyimide Layer Count: 1 Layer
PCB Thickness: 0.25mm PCB Size: 61.61 X 70.37mm
Coverlay: Yellow Silkscreen: N/A
Copper Weight: 2oz Surface Finish: Immersion Gold

 

Single Layer Flexible Printed Circuit on Polyimide with 2oz Copper Yellow Coverlay and Immersion Gold for Capacitive Screen

(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)

 

General description

This is a type of flexible printed circuit for the application of Power Electronics. It’s a single layer FPC at 0.25mm thick with 2oz copper. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data.

 

Parameter and data sheet

Size of Flexible PCB 61.61 X 70.37mm
Number of Layers 1
Board Type Flexible PCB
Board Thickness 0.25mm
Board Material Polymide 50µm
Board Material Supplier ITEQ
Tg Value of Board Material 60℃
 
PTH Cu thickness N/A
Inner Iayer Cu thicknes N/A
Surface Cu thickness 70 µm (2 oz)
   
Coverlay Colour Yellow
Number of Coverlay 2
Thickness of Coverlay 25 µm
Stiffener Material no
Stiffener Thickness N/A
   
Type of Silkscreen Ink N/A
Supplier of Silkscreen N/A
Color of Silkscreen N/A
Number of Silkscreen N/A
 
Peeling test of Coverlay No peelable
Legend Adhesion 3M 90℃ No peeling after Min. 3 times test
 
Surface Finish Immersion Gold
Thickness of Nickle/Gold Au: 0.03µm(Min.); Ni 2-4µm
RoHS Required Yes
Famability 94-V0
 
Thermal Shock Test Pass, -25℃±125℃, 1000 cycles.
Thermal Stress Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6013C Class 2

 

Single Layer Flexible Printed Circuit on Polyimide with 2oz Copper Yellow Coverlay and Immersion Gold for Capacitive Scr 0

 

Features and benefits

Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

The end can be whole soldered

Low cost

Continuity of processing

Focus on low to medium volume production

DDU Door to door shipment with competitive shipping cost.

 

Applications

Telephone receiver / earphone FPC, consumer game consoles, Tablet PC capacitive screen soft board

 

Structure of FPC

According to the number of layers of conductive copper foil, FPC can be divided into single layer circuit, double layer circuit, multi-layer circuit, double sided and so on.

 

Single-layer structure: the flexible circuit of this structure is the simplest structure of the flexible PCB. Usually the base material (dielectric substrates) + transparent rubber(adhesive) + copper foil is a set of purchased raw materials(semi-manufactures), the protective film and transparent glue are another kind of bought raw material. First, copper foil must be etched to obtain the required circuit, and the protective film should be drilled to reveal the corresponding pad. After cleaning, the two are combined by rolling. Then the exposed part of the pad electroplated gold or tin to protect. In this way, the big panel board will be ready. Generally also it’s stamped into the corresponding shape of the small circuit board. There is also no protective film directly on the copper foil, but printed resistance soldering coating, so that the cost will be lower, but the mechanical strength of the circuit board will become worse. Unless the strength requirement is not high and the price needs to be as low as possible, it is best to apply the protective film method.

 

Double layer structure: when the circuit is too complex to be wired, or copper foil is needed to shield the ground, it is necessary to choose a double layer or even a multilayer. The most typical difference between a multilayer and a single plate is the addition of a perforated structure to connect the layers of copper foil. The first process of transparent rubber + base material + copper foil is to make holes. Drill holes in the base material and copper foil first, clean and then plated with a certain thickness of copper. The subsequent fabrication process is almost the same as the single-layer circuit.

 

Double sided structure: both sides of the double sided FPC have pads, mainly used to connect other circuit boards. Although it and monolayer structure is similar, but the manufacturing process is very different. Its raw material is copper foil, protective film and transparent glue. The protective film should be drilled according to the position of the pad first, then the copper foil should be affixed, the pad and track lines should be etched and then the protective film of another drilled hole should be affixed.

 

Single Layer Flexible Printed Circuit on Polyimide with 2oz Copper Yellow Coverlay and Immersion Gold for Capacitive Scr 1

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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