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10.9mm Wangling TP2200 Double-Layer High Frequency PCB High Dk Circuit Board

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China Bicheng Electronics Technology Co., Ltd certification
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Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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10.9mm Wangling TP2200 Double-Layer High Frequency PCB High Dk Circuit Board

10.9mm Wangling TP2200 Double-Layer High Frequency PCB High Dk Circuit Board
10.9mm Wangling TP2200 Double-Layer High Frequency PCB High Dk Circuit Board 10.9mm Wangling TP2200 Double-Layer High Frequency PCB High Dk Circuit Board

Large Image :  10.9mm Wangling TP2200 Double-Layer High Frequency PCB High Dk Circuit Board

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-292.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month

10.9mm Wangling TP2200 Double-Layer High Frequency PCB High Dk Circuit Board

Description
Base Material: Wangling TP2200 Thermoplastic PPO Ceramic Substrate Layer Count: 2 Layer
PCB Thickness: 10.9mm PCB Size: 35.65mm × 87mm (±0.15mm Tolerance, 1PCS)
Solder Mask: No Silkscreen: No
Copper Weight: 1oz (1.4 Mils) Surface Finish: Immersion Gold
Highlight:

2oz Copper Flexible Printed Circuit

Tailored for high-reliability miniaturized RF and precision navigation applications, this custom 2-layer rigid PCB adopts premium Wangling TP2200 thermoplastic PPO ceramic substrate. Boasting an ultra-thick 10.9mm finished board thickness and a 35.65mm × 87mm dimensional footprint with strict ±0.15mm tolerance, the board features pure immersion gold surface finishing, with no solder mask or silkscreen layered on either side. Built with a full through-hole structure and zero blind vias, it supports precise 4/7 mil minimum trace/space routing and 0.4mm micro-hole fabrication to adapt to compact high-density circuit layout demands. Every unit undergoes 100% comprehensive electrical testing prior to shipment, complies with IPC-Class-2 industrial quality standards, and supports stable worldwide supply and customized services for specialized high-frequency electronic projects.

 

PCB Specifications

Engineered with industry-unique thermoplastic dielectric structure, this TP2200 2-layer PCB delivers exceptional dielectric stability and mechanical robustness for high-Dk RF circuit design. Eliminating glass fiber reinforcement interference, its standardized fabrication parameters ensure consistent signal transmission performance and long-term operational reliability in extreme working environments.

Specification Item Parameter Details
Base Material Wangling TP2200 thermoplastic PPO ceramic substrate
Layer Configuration 2-layer rigid PCB
Board Dimensions 35.65mm × 87mm (±0.15mm tolerance, 1PCS)
Minimum Trace / Space 4/7 mils
Minimum Hole Size 0.4mm
Via Type Through-hole only, no blind vias
Finished Board Thickness 10.9mm
Outer Copper Weight 1oz (1.4 mils)
Via Plating Thickness 20μm
Surface Finish Immersion Gold
Silkscreen Top & Bottom: No
Solder Mask Top & Bottom: No
Pre-Shipment Test 100% electrical test prior to shipment

 

PCB Stack-up Structure

This 2-layer PCB adopts a symmetrical and compact stackup layout, centered on a 0.8mm Wangling TP2200 core dielectric substrate. Double-sided 35μm pure copper layers are evenly laminated on both sides of the core, forming a balanced structural design. This rational stackup configuration delivers uniform thermal conductivity and stable dielectric performance, effectively avoiding signal deviation and structural deformation under extreme temperature conditions.

Layer Structure Material & Thickness
Copper_layer_1 35 μm
TP2200 Core 0.8 mm
Copper_layer_2 35 μm

 

PCB Statistic

Optimized for miniaturized high-frequency circuit assembly, this PCB features a streamlined layout with 34 integrated components and scientific distribution of pads and vias, perfectly matching high-Dk compact circuit design requirements. All production design files are provided in standard Gerber RS-274-X format, ensuring full compatibility with mainstream PCB manufacturing and testing equipment for precise prototyping and stable batch production.

Statistical Item Quantity
Components 34
Total Pads 29
Thru Hole Pads 22
Top SMT Pads 7
Bottom SMT Pads 0
Vias 16
Nets 1

 

10.9mm Wangling TP2200 Double-Layer High Frequency PCB High Dk Circuit Board

 

Introduction of Wangling TP Series Material

The Wangling TP series represents a distinctive high-frequency thermoplastic substrate solution in the industry. Its dielectric layer is formulated with ceramic filler and polyphenylene oxide (PPO) resin, completely free of woven glass fabric reinforcement to eliminate glass weave signal interference. Engineers can precisely adjust the dielectric constant by modifying the mixing ratio of ceramic and PPO resin, realizing customized dielectric performance for diverse circuit designs. Manufactured via exclusive specialized processes, the TP series delivers excellent dielectric stability and superior long-term reliability. For product specification definition, TP stands for unclad smooth substrate, TP-1 for single-sided copper clad laminate, and TP-2 for double-sided copper clad laminate.

 

10.9mm Wangling TP2200 Double-Layer High Frequency PCB High Dk Circuit Board

 

Core Performance Features of TP2200

TP2200 is a high-Dk thermoplastic ceramic substrate tailored for extreme-environment high-frequency applications. It integrates ultra-low dielectric loss, outstanding temperature resistance and exceptional structural stability, making it irreplaceable for miniaturized navigation and special military RF equipment:

Performance Parameter Specification
Dielectric Constant (Dk @5GHz) 22 ± 0.88
Dissipation Factor (Df @5GHz) 0.002 ~ 0.0025
Thermal Coefficient of Dk (TCDK) -55 ppm/℃
CTE (X/Y/Z Axis) 35ppm/℃, 35ppm/℃, 40ppm/℃
Long-term Operating Temperature -100°C to +150°C
Water Absorption ≤0.01%
Thermal Conductivity 0.9W/MK
Special Material Properties Radiation resistance, low outgassing

 

Typical Applications

Benefiting from its ultra-high Dk value, ultra-low water absorption, extreme temperature adaptability and radiation-resistant performance, this TP2200 2-layer PCB is widely applied in high-precision, high-reliability special RF and navigation fields:

 

  • Beidou navigation systems
  • Missile-borne electronic equipment
  • Precision fuzes
  • Miniaturized high-frequency antennas

 

Conclusion

Featuring premium immersion gold surface treatment and a robust 10.9mm thick body, this custom Wangling TP2200 PCB delivers high-Dk, low-loss and thermally stable performance for extreme-environment high-frequency applications. Its glass-free PPO ceramic structure, ultra-low water absorption, excellent radiation resistance and wide temperature tolerance enable stable operation in military, navigation and precision antenna scenarios. Fully inspected with 100% electrical testing and certified to IPC-Class-2 standards, this PCB provides reliable customized solutions and global delivery for specialized high-frequency electronic engineering projects worldwide.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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