The 2-layer WL-CT350 PCB is a high-stability, cost-efficient high-frequency circuit board engineered for modern microwave and RF signal transmission applications. Utilizing premium WL-CT350 organic polymer ceramic copper-clad laminate and 1oz outer copper cladding, this ultra-thin 0.2mm rigid PCB features high-reliability Immersion Gold surface finishing, top-only black silkscreen, and a solder-mask-free dual-sided design that optimizes high-frequency electrical performance and thermal dissipation.
What Is WL-CT350? Material Introduction
WL-CT350 is a high-performance thermoset resin-based high-frequency copper-clad laminate reinforced with organic polymer ceramic fillers and fiberglass fabric. Its dielectric layer is formulated with hydrocarbon resin, composite ceramic particles, and fiberglass substrate, delivering exceptional low-loss electrical characteristics optimized for high-frequency circuit designs. Unlike complex and hard-to-process PTFE materials, WL-CT350 adopts FR4-compatible manufacturing workflows, which greatly simplifies PCB fabrication, improves production consistency, and ensures stable batch-to-batch quality, making it an ideal domestic alternative to imported high-frequency laminates.
The proprietary composite combination of hydrocarbon resin and ceramic fillers grants WL-CT350 outstanding high-temperature endurance and robust thermal dielectric stability. This material series maintains steady dielectric constant and loss factor across varying temperatures, features low thermal expansion, and achieves a high glass transition temperature (Tg) above 280°C. These properties guarantee consistent electrical performance and structural integrity under prolonged high-frequency operation and fluctuating thermal conditions.
Core Features of WL-CT350 PCB Material
Engineered to balance low-loss high-frequency performance, reliable thermal stability, and excellent processability, WL-CT350 high-frequency laminates fully satisfy the precision and mass-production requirements of commercial RF and microwave circuits:
| Core Feature |
Technical Parameter |
| Stable Dielectric Constant |
Dk = 3.48 @ 10GHz / 23°C |
| Low Dissipation Factor |
Df = 0.0039 @ 10GHz |
| Excellent Thermal Dk Stability |
TCDK = 52 ppm/°C |
| Efficient Thermal Conductivity |
Thermal conductivity = 0.7 W/MK |
| Ultra-Low Moisture Absorption |
Moisture absorption = 0.05% |
| Copper-Matched CTE |
11ppm/°C (X-axis), 14ppm/°C (Y-axis), 34ppm/°C (Z-axis) |
| High Glass Transition Temperature |
Tg ≥ 280°C |
Key Performance Benefits of WL-CT350 PCB
WL-CT350 organic polymer ceramic high-frequency material integrates premium RF performance, simplified manufacturability, and long-term reliability, offering outstanding comprehensive advantages for commercial high-frequency PCB mass production:
FR4-Compatible Processing: Fully compatible with conventional FR4 fabrication procedures, featuring simpler processing workflows compared to PTFE-based materials and effectively reducing manufacturing complexity and operational costs
Superior Batch Consistency: Adopts a stabilized composite formulation that delivers uniform dielectric parameters and mechanical performance across mass production batches
Excellent Environmental Stability: Ultra-low moisture absorption paired with robust thermal resistance maintains stable circuit performance in complex and harsh working environments
Cost-Effective Import Substitution: Matches the high-frequency performance of premium imported laminates at a lower cost, serving as an optimal cost-effective solution for large-scale commercial RF applications
Key PCB Construction Specifications
| Parameter Item |
Specific Specification |
| Base Material |
WL-CT350 organic polymer ceramic fiberglass copper clad laminate |
| Layer Count |
2 layers (double-sided rigid PCB structure) |
| Board Dimensions |
56.8mm × 78.09mm, dimensional tolerance: ±0.15mm (1 piece) |
| Minimum Trace/Space |
6/7 mils, supporting compact and precise high-frequency circuit routing |
| Minimum Hole Size |
0.3mm, enabling dense and compact component layout design |
| Via Design |
Through-hole structure only, no blind vias, |
| Finished Board Thickness |
0.2mm ultra-thin profile |
| Finished Copper Weight |
1oz (1.4 mils) outer copper layers |
| Via Plating Thickness |
20μm copper plating thickness |
| Surface Finish |
Immersion Gold |
| Silkscreen |
Top layer: black silkscreen; Bottom layer: no silkscreen |
| Solder Mask |
No solder mask on both top and bottom layers |
| Quality Test Standard |
100% full electrical testing implemented before shipment |
2-Layer WL-CT350 PCB Stack-up Structure
| Layer Sequence |
Material Specification |
Thickness |
| Outer Layer 1 (Top) |
Conductive copper foil |
35μm |
| Core Dielectric Layer |
WL-CT350 organic polymer ceramic composite substrate |
0.102mm (4mil) |
| Outer Layer 2 (Bottom) |
Conductive copper foil |
35μm |
PCB Circuit & Component Statistics
| Parameter Item |
Specific Value |
| Components |
19 |
| Total Pads |
32 |
| Thru Hole Pads |
18 |
| Top SMT Pads |
14 |
| Bottom SMT Pads |
0 |
| Vias |
11 |
| Nets |
2 |
Accepted Artwork Format: Customers from the global can standard Gerber RS-274-X design files for quotation and manufacturing.
Quality Standard: All custom PCBs are manufactured and inspected in strict accordance with IPC-Class-2 industry standards to ensure stable batch quality and long-term operational reliability.
Global Service: We provide worldwide quotation support, professional technical consultation, and global shipping services for all PCB orders.
Typical Application Scenarios
- Base station antennas and satellite antennas
- Automotive radar, sensors, and navigation systems
- Power amplifiers
- Satellite high-frequency heads
- RF devices and filters
- WIMAX antennas and distributed antennas
In summary, the ultra-thin 2-layer WL-CT350 rigid PCB leverages advanced organic polymer ceramic composite technology to deliver low dielectric loss, stable thermal dielectric coefficients, ultra-low moisture absorption, and high Tg performance. Featuring FR4-friendly processing, copper-matched thermal expansion, and outstanding cost performance, this high-frequency PCB serves as a premium alternative to imported materials, ideal for base station communications, satellite equipment, automotive radar, and a wide range of RF and microwave devices.
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