This 2-layer F4BTM298 rigid RF PCB is a low-loss, high-stability microwave circuit board designed for RF, microwave, radar and satellite communication systems. Built with Wangling F4BTM298 nano-ceramic filled PTFE substrate and 1oz ED copper foil, this ultra-thin 0.3mm PCB features reliable immersion gold surface finish and strict IPC-Class-2 quality compliance. All boards undergo 100% electrical testing before shipment, delivering stable dielectric performance, low thermal expansion and excellent insulation for high-frequency applications. We accept global Gerber RS-274-X files for custom PCB orders and provide worldwide shipping and technical support.
What Is F4BTM298? Advanced Substrate Introduction
F4BTM298 is a high-performance modified PTFE composite laminate formulated with fiberglass cloth, low-loss nano-ceramic fillers and PTFE resin, manufactured via precision high-pressure processing. Upgraded from classic F4BM materials, this substrate integrates high-dielectric nano-ceramic components to optimize comprehensive performance, balancing low dielectric loss, high dielectric constant, heat resistance, low thermal expansion and high insulation resistance.
F4BTM298 shares the same premium dielectric layer as F4BTME298, differing only in copper foil configuration. Equipped with standard ED copper foil, F4BTM298 is ideal for conventional RF projects without strict PIM requirements, while F4BTME298 adopts RTF reverse-treated copper foil for low-PIM, high-precision circuit scenarios. This flexible material matching meets diverse high-frequency PCB design and application needs.
Core Performance Features of F4BTM298
F4BTM298 substrate features stable low-loss electrical performance, reliable thermal dimensional stability and high safety, fully supporting long-term stable operation of industrial and civilian RF microwave systems with standardized core parameters:
Stable Dielectric Constant (Dk): 2.98±0.06 at 10GHz, ensuring accurate impedance matching and consistent high-frequency signal transmission
Low Dielectric Loss (Df): 0.0018 at 10GHz, effectively reducing high-frequency signal attenuation and improving microwave transmission efficiency
Low Thermal Expansion: X-axis 15 ppm/°C, Y-axis 16 ppm/°C, Z-axis 78 ppm/°C (-55°C to 288°C), preventing PCB warpage and deformation under extreme temperature cycles
Stable Temperature Dielectric Performance: Thermal coefficient of Dk at -78 ppm/°C (-55°C to 150°C), avoiding dielectric parameter drift in variable thermal environments
Ultra-Low Moisture Absorption: ≤0.05%, maintaining stable electrical performance in humid working conditions
High Flame Retardancy: UL-94 V0 grade, guaranteeing safe operation of high-frequency electronic equipment
Key PCB Construction Specifications
| Parameter Item |
Specific Specification |
| Base Material |
Wangling F4BTM298 nano-ceramic filled low-loss PTFE high-frequency substrate |
| Layer Count |
2 layers (double-sided rigid PCB structure) |
| Board Dimensions |
109mm × 54.5mm (±0.15mm tolerance, 1 piece) |
| Minimum Trace/Space |
6/9 mils, suitable for fine-line high-frequency circuit layout |
| Minimum Hole Size |
0.4mm, supporting compact component layout and precise hole processing |
| Via Design |
No blind vias, pure through-hole structure for stable structure and reliable electrical performance |
| Finished Board Thickness |
0.3mm ultra-thin design, lightweight for miniaturized RF equipment applications |
| Finished Copper Weight |
1oz (1.4 mils) outer ED copper layers for stable high-frequency signal transmission |
| Via Plating Thickness |
20μm via plating thickness for stable conductivity and long-term reliability |
| Surface Finish |
Immersion gold surface finish with excellent solderability and corrosion resistance |
| Silkscreen |
White top silkscreen, no bottom silkscreen for clear component marking |
| Solder Mask |
Black top solder mask, no bottom solder mask for optimized heat dissipation |
| Quality Test Standard |
100% electrical testing before shipment to eliminate open/short circuit defects |
2-Layer F4BTM298 PCB Stack-up Structure
This 2-layer rigid PCB stackup adopts F4BTM298 nano-ceramic PTFE core and ED copper foil. The ultra-thin, balanced structure delivers low-loss performance and structural stability, ideal for miniaturized RF and microwave circuits.
| Layer Sequence |
Material Specification |
Thickness |
Core Function |
| Outer Layer 1 (Top) |
ED conductive copper foil |
35μm |
High-frequency signal transmission and SMT component soldering layer |
| Core Dielectric Layer |
F4BTM298 nano-ceramic modified PTFE core substrate |
0.254mm (10mil) |
Low-loss dielectric isolation, stable temperature-resistant dielectric performance for miniaturized high-frequency circuits |
| Outer Layer 2 (Bottom) |
ED conductive copper foil |
35μm |
Auxiliary circuit layer to balance overall PCB structural stability |
PCB Circuit & Component Statistics
| Parameter Item |
Specific Value |
| Components |
26 |
| Total Pads |
87 |
| Thru Hole Pads |
49 |
| Top SMT Pads |
38 |
| Bottom SMT Pads |
0 |
| Vias |
31 |
| Nets |
2 |
Accepted Artwork Format: We support standard Gerber RS-274-X files for custom F4BTM298 PCB manufacturing, ensuring accurate production and efficient technical cooperation for global clients.
Quality Standard: All F4BTM298 high-frequency PCBs comply with IPC-Class-2 industrial standards, with strict quality control to ensure stable batch performance and high precision.
Global Service: We provide worldwide custom PCB quotation, professional technical support and global shipping services for all F4BTM298 PCB orders.
Typical Application Scenarios
With low dielectric loss, low thermal expansion, high insulation and strong environmental adaptability, F4BTM298 ultra-thin PCBs are widely used in high-frequency microwave, RF communication and radar systems:
Microwave, RF & Radar Systems: High-frequency microwave modules, RF signal circuits and precision radar detection equipment
RF Phase Shifters: High-precision phase shifter components for wireless communication systems
RF Power Components: Power dividers, couplers and combiners for microwave transmission systems
Antenna Feed Networks: Professional feed network modules for high-frequency communication antennas
Phased Array Antennas: Phase-sensitive antennas and phased array antenna systems for industrial and military communication
Satellite & Base Station Communication: Satellite communication terminals and high-stability base station antenna equipment
Your message must be between 20-3,000 characters!
English
