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Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm
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Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm
  • name
  • name
  • name
  • name
  • name

Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm

MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-506.V1.0
Base Material:
High Tg, Lead Free High Reliability Epoxy Resin
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Thickness:
0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
Surface Finish:
Bare Copper, HASL, ENIG, OSP, Immersion Tin, Immersion Silver Etc..
Highlight:

Multi Layer FR4 PCB Board

,

Lead Free PCB Printed Circuit Board

,

400mmX500mm Printed Circuit Board

Product Description

 

High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

IT-180ATC is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance. It’s suitable for various applications and can pass 260℃ lead free assembly. Thickness ranges 0.5mm to 3.2mm, copper weight 0.5oz to 3oz.

 

Applications

Automotive (Engine room ECU)

Multilayer and HDI PCB

Backplanes

Data Storage

Server and Networking

Telecommunications

Heavy Copper

 

Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm 0

 

Key Features

Low CTE

High heat resistance

Excellent CAF resistance

Good through-hole reliability

 

Our PCB Capability (IT-180ATC)

PCB Material: High Tg, Lead Free High Reliability Epoxy Resin
Designation: IT-180ATC
Dielectric constant: 4.4 at 1GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

General Properties of IT-180ATC

Items IPC TM-650 Typical Value Unit
Peel Strength, minimum 2.4.8   lb/inch
A. Low profile copper foil 5
B. Standard profile copper foil 8
Volume Resistivity 2.5.17.1 1x109 M-cm
Surface Resistivity 2.5.17.1 1x108 M
Moisture Absorption, maximum 2.6.2.1 0.1 %
Permittivity (Dk, 50% resin content)     --
A. 1MHz 2.5.5.9 4.5
B. 1GHz 2.5.5.9 4.4
Loss Tangent (Df, 50% resin content)     --
A. 1MHz 2.5.5.9 0.014
B. 1GHz 2.5.5.9 0.015
Flexural Strength, minimum     N/mm2
A. Length direction 2.4.4 500-530
B. Cross direction   410-440
Thermal Stress 10 s at 288°C      
A. Unetched 2.4.13.1 Pass Rating
B. Etched   Pass  
Flammability UL94 V-0 Rating
Comparative Tracking Index (CTI) IEC 60112 / UL 746 CTI 3 (175-249) Class (Volts)
Glass Transition Temperature(DSC) 2.4.25 175 ˚C
Decomposition Temperature 2.4.24.6 345 ˚C
X/Y Axis CTE (40℃ to 125℃) 2.4.41 11-13 / 13-15 ppm/˚C
Z-Axis CTE      
A. Alpha 1   45 ppm/˚C
B. Alpha 2 2.4.24 210 ppm/˚C
C. 50 to 260 Degrees C   2.7 %
Thermal Resistance      
A. T260 2.4.24.1 >60 Minutes
B. T288   20 Minutes

 

Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm 1

 

Tags: 

FR4 PCB Board,  

6 Layer FR4 PCB Board,  

Mobile Broadband Gold Finger PCB

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm
  • name
  • name
  • name
  • name
  • name
Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm
MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-506.V1.0
Base Material:
High Tg, Lead Free High Reliability Epoxy Resin
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Thickness:
0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
Surface Finish:
Bare Copper, HASL, ENIG, OSP, Immersion Tin, Immersion Silver Etc..
Minimum Order Quantity:
1PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Multi Layer FR4 PCB Board

,

Lead Free PCB Printed Circuit Board

,

400mmX500mm Printed Circuit Board

Product Description

 

High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

IT-180ATC is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance. It’s suitable for various applications and can pass 260℃ lead free assembly. Thickness ranges 0.5mm to 3.2mm, copper weight 0.5oz to 3oz.

 

Applications

Automotive (Engine room ECU)

Multilayer and HDI PCB

Backplanes

Data Storage

Server and Networking

Telecommunications

Heavy Copper

 

Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm 0

 

Key Features

Low CTE

High heat resistance

Excellent CAF resistance

Good through-hole reliability

 

Our PCB Capability (IT-180ATC)

PCB Material: High Tg, Lead Free High Reliability Epoxy Resin
Designation: IT-180ATC
Dielectric constant: 4.4 at 1GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

General Properties of IT-180ATC

Items IPC TM-650 Typical Value Unit
Peel Strength, minimum 2.4.8   lb/inch
A. Low profile copper foil 5
B. Standard profile copper foil 8
Volume Resistivity 2.5.17.1 1x109 M-cm
Surface Resistivity 2.5.17.1 1x108 M
Moisture Absorption, maximum 2.6.2.1 0.1 %
Permittivity (Dk, 50% resin content)     --
A. 1MHz 2.5.5.9 4.5
B. 1GHz 2.5.5.9 4.4
Loss Tangent (Df, 50% resin content)     --
A. 1MHz 2.5.5.9 0.014
B. 1GHz 2.5.5.9 0.015
Flexural Strength, minimum     N/mm2
A. Length direction 2.4.4 500-530
B. Cross direction   410-440
Thermal Stress 10 s at 288°C      
A. Unetched 2.4.13.1 Pass Rating
B. Etched   Pass  
Flammability UL94 V-0 Rating
Comparative Tracking Index (CTI) IEC 60112 / UL 746 CTI 3 (175-249) Class (Volts)
Glass Transition Temperature(DSC) 2.4.25 175 ˚C
Decomposition Temperature 2.4.24.6 345 ˚C
X/Y Axis CTE (40℃ to 125℃) 2.4.41 11-13 / 13-15 ppm/˚C
Z-Axis CTE      
A. Alpha 1   45 ppm/˚C
B. Alpha 2 2.4.24 210 ppm/˚C
C. 50 to 260 Degrees C   2.7 %
Thermal Resistance      
A. T260 2.4.24.1 >60 Minutes
B. T288   20 Minutes

 

Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm 1

 

Tags: 

FR4 PCB Board,

6 Layer FR4 PCB Board,

Mobile Broadband Gold Finger PCB

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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