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High Temperature 8 Layer FR4 PCB Board For Satellite Radio

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High Temperature 8 Layer FR4 PCB Board For Satellite Radio

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-479.V1.0

Base Material:

Layer Count:

8 Layers

PCB Thickness:

1.6mm ±0.16

PCB Size:

215 X 212mm=1PCS

Solder Mask:

Green

Silkscreen:

White

Copper Weight:

Surface Finish:

Immersion Gold

Highlight:

Satellite Radio FR4 PCB Board

8 Layer FR4 PCB Board

FR4 8 Layer PCB

Product Description

Via in Pad PCB High Temperature VIP PCB 8-Layer Circuit Board on FR-4 with Immersion Gold for Satellite Radio

1.1 General description

This is a type of 8 layer printed circuit board built on FR-4 Tg170 substrate for the application of Satellite Radio. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and immersion gold on pads. The base material is from Taiwan ITEQ supplying 1 up PCB per panel. Vias with 0.2mm are resin filled and capped (via in pad). They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed for shipment.

1.2 Features and benefits

(1) RoHS compliant and suitable for high thermal reliability needs

(2) High solderability, no stressing of circuit boards and less contamination of PCB surface.

(3) Delivery on time. Higher than 98% on-time-delivery rate.

(4) 30000 square meter month capability

(5) More than 15 years of experience

(6) Volume Production capability

1.3 Applications

(1) Satellite Communication

(2) Solar Panel Inverter

(3) Embedded Processor

1.4 Parameter and data sheet

PCB SIZE	215 x 212mm=1PCS
BOARD TYPE	Multilayer PCB
Number of Layers	8 layers
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 18um(0.5oz)+plate TOP layer
	Prepreg 7628(43%) 0.195mm
	copper ------- 35um(1oz) MidLayer 1
	FR-4 0.2mm
	copper ------- 35um(1oz) MidLayer 2
	Prepreg 7628(43%) 0.195mm
	copper ------- 35um(1oz) MidLayer 3
	FR-4 0.2mm
	copper ------- 35um(1oz) MidLayer 4
	Prepreg 7628(43%) 0.195mm
	copper ------- 35um(1oz) MidLayer 5
	FR-4 0.2mm
	copper ------- 35um(1oz) MidLayer 6
	Prepreg 7628(43%) 0.195mm
	copper ------- 18um(0.5oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	4mil/4mil
Minimum / Maximum Holes:	0.3/3.2mm
Number of Different Holes:	18
Number of Drill Holes:	11584
Number of Milled Slots:	2
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	FR-4 TG170℃, er<5.4.IT-180, ITEQ Supplied
Final foil external:	1oz
Final foil internal:	1oz
Final height of PCB:	1.6mm ±0.16
PLATING AND COATING
Surface Finish	Immersion gold (32.1% ) 0.05µm over 3µm nickel
Solder Mask Apply To:	TOP and Bottom, 12micron Minimum
Solder Mask Color:	Green, PSR-2000 KX700G, Taiyo Supplied.
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing, stamp holes.
MARKING
Side of Component Legend	TOP and Bottom.
Colour of Component Legend	White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

1.5 Design For Manufacture (3)

Serial NO.	Procedure	Item	Manufacturing capability
			Large volume (S<100 m²)	Middle volume (S<10 m²)	Prototype(S<1m²)
			Large volume (S<100 m²)	Middle volume (S<10 m²)	Prototype(S<1m²)
31	Solder mask (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )	Maximum via-plug diameter	0.5mm	0.5mm	0.5mm
32		Min.width of solder mask bridge	Green:5mil(35um)	Green:4mil(35um)	Green:4mil(35um)
33			Yellow:5mil(35um)	Yellow:4mil(35um)	Yellow:4mil(35um)
34			Blue:5mil(35um)	Blue:4mil(35um)	Blue:4mil(35um)
35			Black:6mil(35um)	Black:6mil(35um)	Black:6mil(35um)
36			White:6mil(35um)	White:6mil(35um)	White:6mil(35um)
37			All of Matt:6mil	All of Matt:6mil	All of Matt:6mil
38			Green:5mil(70um)	Green:4mil(70um)	Green:4mil(70um)
39			Yellow:5mil(70um)	Yellow:4mil(70um)	Yellow:4mil(70um)
40			Blue:5mil(70um)	Blue:4mil(70um)	Blue:4mil(70um)
41			Black:6mil(70um)	Black:6mil(70um)	Black:6mil(70um)
42			White:6mil(70um)	White:6mil(70um)	White:6mil(70um)
43		Open solder mask	4mil(35um)	4mil(35um)	3mil(35um)
44		Solder mask coverage	4mil(35um)	4mil(35um)	3mil(35um)
45		Min.width of solder mask text	9mil(35um)	9mil(35um)	8mil(35um)
46		Min.thickness of Solder mask	9um(35um)	9um(35um)	9um(35um)
47		Max.thickness of solder mask	30um(35um)	30um(35um)	30um(35um)

High Temperature 8 Layer FR4 PCB Board For Satellite Radio 1

Tags:

Products

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Detail Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-479.V1.0

Base Material:

FR-4

Layer Count:

8 Layers

PCB Thickness:

1.6mm ±0.16

PCB Size:

215 X 212mm=1PCS

Solder Mask:

Green

Silkscreen:

White

Copper Weight:

1oz

Surface Finish:

Immersion Gold

Minimum Order Quantity:

1PCS

Price:

USD9.99-99.99

Packaging Details:

Vacuum bags+Cartons

Delivery Time:

8-9 working days

Payment Terms:

T/T

Supply Ability:

5000PCS per month

Highlight

Satellite Radio FR4 PCB Board

8 Layer FR4 PCB Board

FR4 8 Layer PCB

Product Description

Via in Pad PCB High Temperature VIP PCB 8-Layer Circuit Board on FR-4 with Immersion Gold for Satellite Radio

1.1 General description

1.2 Features and benefits

(1) RoHS compliant and suitable for high thermal reliability needs

(2) High solderability, no stressing of circuit boards and less contamination of PCB surface.

(3) Delivery on time. Higher than 98% on-time-delivery rate.

(4) 30000 square meter month capability

(5) More than 15 years of experience

(6) Volume Production capability

1.3 Applications

(1) Satellite Communication

(2) Solar Panel Inverter

(3) Embedded Processor

1.4 Parameter and data sheet

PCB SIZE	215 x 212mm=1PCS
BOARD TYPE	Multilayer PCB
Number of Layers	8 layers
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 18um(0.5oz)+plate TOP layer
	Prepreg 7628(43%) 0.195mm
	copper ------- 35um(1oz) MidLayer 1
	FR-4 0.2mm
	copper ------- 35um(1oz) MidLayer 2
	Prepreg 7628(43%) 0.195mm
	copper ------- 35um(1oz) MidLayer 3
	FR-4 0.2mm
	copper ------- 35um(1oz) MidLayer 4
	Prepreg 7628(43%) 0.195mm
	copper ------- 35um(1oz) MidLayer 5
	FR-4 0.2mm
	copper ------- 35um(1oz) MidLayer 6
	Prepreg 7628(43%) 0.195mm
	copper ------- 18um(0.5oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	4mil/4mil
Minimum / Maximum Holes:	0.3/3.2mm
Number of Different Holes:	18
Number of Drill Holes:	11584
Number of Milled Slots:	2
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	FR-4 TG170℃, er<5.4.IT-180, ITEQ Supplied
Final foil external:	1oz
Final foil internal:	1oz
Final height of PCB:	1.6mm ±0.16
PLATING AND COATING
Surface Finish	Immersion gold (32.1% ) 0.05µm over 3µm nickel
Solder Mask Apply To:	TOP and Bottom, 12micron Minimum
Solder Mask Color:	Green, PSR-2000 KX700G, Taiyo Supplied.
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing, stamp holes.
MARKING
Side of Component Legend	TOP and Bottom.
Colour of Component Legend	White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

1.5 Design For Manufacture (3)

Serial NO.	Procedure	Item	Manufacturing capability
			Large volume (S<100 m²)	Middle volume (S<10 m²)	Prototype(S<1m²)
			Large volume (S<100 m²)	Middle volume (S<10 m²)	Prototype(S<1m²)
31	Solder mask (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )	Maximum via-plug diameter	0.5mm	0.5mm	0.5mm
32		Min.width of solder mask bridge	Green:5mil(35um)	Green:4mil(35um)	Green:4mil(35um)
33			Yellow:5mil(35um)	Yellow:4mil(35um)	Yellow:4mil(35um)
34			Blue:5mil(35um)	Blue:4mil(35um)	Blue:4mil(35um)
35			Black:6mil(35um)	Black:6mil(35um)	Black:6mil(35um)
36			White:6mil(35um)	White:6mil(35um)	White:6mil(35um)
37			All of Matt:6mil	All of Matt:6mil	All of Matt:6mil
38			Green:5mil(70um)	Green:4mil(70um)	Green:4mil(70um)
39			Yellow:5mil(70um)	Yellow:4mil(70um)	Yellow:4mil(70um)
40			Blue:5mil(70um)	Blue:4mil(70um)	Blue:4mil(70um)
41			Black:6mil(70um)	Black:6mil(70um)	Black:6mil(70um)
42			White:6mil(70um)	White:6mil(70um)	White:6mil(70um)
43		Open solder mask	4mil(35um)	4mil(35um)	3mil(35um)
44		Solder mask coverage	4mil(35um)	4mil(35um)	3mil(35um)
45		Min.width of solder mask text	9mil(35um)	9mil(35um)	8mil(35um)
46		Min.thickness of Solder mask	9um(35um)	9um(35um)	9um(35um)
47		Max.thickness of solder mask	30um(35um)	30um(35um)	30um(35um)

High Temperature 8 Layer FR4 PCB Board For Satellite Radio 1

Tags:

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High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

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8 Layer FR4 PCB Board

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FR4 PCB Board,

6 Layer FR4 PCB Board,