Heavy Copper PCB High Power Circuit Board Built On FR-4 With 3 Oz Copper

Heavy Copper PCB High Power Circuit Board Built On FR-4 With 3 Oz Copper

(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)

1.1 General description

This is a type of heavy copper PCB built on FR-4 substrate with Tg 135°C for the application of UPS systems . It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and HASL on pads. The base material is from ITEQ supplying 1 up PCB per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed for shipment.

1.2 Features and benefits

1. It's Lead free compatible.

2. Excellent wetting during component soldering and it can avoid copper corrosion.

3. Better heat dissipation of high heat generated by large current

4. UL, ISO14001, IATF16949 certified

5. Reliability test, insulation resistance test and ionic contamination test

6. Quick Lead time: 3-5 days

7. Customer complaint rate: <1%

1.3 PCB Specifications

1.4 Applications

UPS Uninterruptible Power Supply

Cosel Power Supply

Power Supply Inverter

DC To DC Converters

1.5 Heavy Copper

Generally, the PCB copper foil with a nominal thickness of 105 μm or over is collectively referred to as a thick copper foil (including the surface-treated electrolytic copper foil and rolled copper foil). The PCB and copper foil manufacturing industry domestically and abroad are more accustomed to specifically divide the thick copper foil into three varieties based on its nominal thickness, the one with thickness of 105μm (≥ 3oz) ~ 240μm or over is called thick copper foil; the one with thickness of 300μm or over is called super-thick copper foil; the one with thickness of 600μm and above is referred to as super MAX copper foil.

The thick copper foil and super-thick copper foil belong to a kind of special PCB copper foil. In addition to its conventional electrolytic copper foil (or rolled copper foil) performance, it also has such special performance as the conducting layer of high current board or the inner core cooling metal layer of the high-current PCB, and other special performance requirements. These special performance requirements are to meet the application conditions, processing conditions and other aspects from its downstream products. The application performance requirements of it is mostly expressed in the characteristics that the conducting circuit of thick copper can stably carry high current, and can better distribute high heat generated by the loaded high current in a substrate.

In recent years, with the expansion of application field of heavy copper printed circuit board, and the increase of production and sales, the production and sales of thick copper foil has also been significantly improved. According to statistics, its production and sales have accounted for 5 ~ 6% of the world's production and sales of electronic copper foil, which is 17,000 ~ 20,000 tons / year.

1.6 More Displays of Heavy Copper PCB