| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
| Item | Requirement | Result | |
| Basic information | Board type | Multilayer PCB | Multilayer PCB |
| Layer count | 4 layers | 4 layers | |
| Board size | 117 x 121mm=1UP | 117 x 121mm=1UP | |
| Laminate | Type | FR-4 | FR-4 |
| Supplier | ITEQ | ITEQ | |
| Board thickness | 0.4+/-10%mm | 0.45mm | |
| Outer copper foil | >=35 um | 36.1 | |
| Inner copper foil | 17um | 17um | |
| Warp-twist | <= 0.75% | 0.06% | |
| Legend | Type | KUANG SHUN | KUANG SHUN |
| Color | White | White | |
| Location | CS | CS | |
| Marking | Co.logo | As requirement | OK |
| UL.logo | As requirement | OK | |
| Date code | As requirement | OK | |
| Marking form | As requirement | OK | |
| Location | NA | ||
| Min line width (mil) | 7.8 | 7.6 | |
| Min line spacing (mil) | 5.5 | 5.7 | |
| Min ring width (mil) | NA | NA | |
| Solder Mask | Type | KUANG SHUN | KUANG SHUN |
| Color | Green | Green | |
| Thickness | >=10 um | 13 um | |
| Pencil Test | 6H OR ABOVE | OK | |
| SOLVENT TEST | NO ATTACK | OK | |
| TAPE TEST | NO PEEL OFF | OK | |
| Surface Treament | ENIG | OK | |
| Special Treament | Silk screen | / | / |
| Location | / | / | |
| Forming | V-cut | OK | |
| Normal Testing | Electrical test | 100% PCB passed | OK |
| Visual inspection | IPC-A-600H&IPC-6012C | OK | |
| Solderability Test | 245℃ 5S 1 Cycle | OK | |
| Drill table (mm) | 1 | Y | 0.300 |
| 2 | N | 1.000 | |
| 3 | N | 3.100 | |
| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
| Item | Requirement | Result | |
| Basic information | Board type | Multilayer PCB | Multilayer PCB |
| Layer count | 4 layers | 4 layers | |
| Board size | 117 x 121mm=1UP | 117 x 121mm=1UP | |
| Laminate | Type | FR-4 | FR-4 |
| Supplier | ITEQ | ITEQ | |
| Board thickness | 0.4+/-10%mm | 0.45mm | |
| Outer copper foil | >=35 um | 36.1 | |
| Inner copper foil | 17um | 17um | |
| Warp-twist | <= 0.75% | 0.06% | |
| Legend | Type | KUANG SHUN | KUANG SHUN |
| Color | White | White | |
| Location | CS | CS | |
| Marking | Co.logo | As requirement | OK |
| UL.logo | As requirement | OK | |
| Date code | As requirement | OK | |
| Marking form | As requirement | OK | |
| Location | NA | ||
| Min line width (mil) | 7.8 | 7.6 | |
| Min line spacing (mil) | 5.5 | 5.7 | |
| Min ring width (mil) | NA | NA | |
| Solder Mask | Type | KUANG SHUN | KUANG SHUN |
| Color | Green | Green | |
| Thickness | >=10 um | 13 um | |
| Pencil Test | 6H OR ABOVE | OK | |
| SOLVENT TEST | NO ATTACK | OK | |
| TAPE TEST | NO PEEL OFF | OK | |
| Surface Treament | ENIG | OK | |
| Special Treament | Silk screen | / | / |
| Location | / | / | |
| Forming | V-cut | OK | |
| Normal Testing | Electrical test | 100% PCB passed | OK |
| Visual inspection | IPC-A-600H&IPC-6012C | OK | |
| Solderability Test | 245℃ 5S 1 Cycle | OK | |
| Drill table (mm) | 1 | Y | 0.300 |
| 2 | N | 1.000 | |
| 3 | N | 3.100 | |