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IsoClad 917 RF Copper Clad Laminate Sheet
  • name

IsoClad 917 RF Copper Clad Laminate Sheet

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
IsoClad 917
Laminate Thickness:
0.787mm 1.575mm
Laminate Size:
12"X18"(305X457mm); 24"X18"(610X457mm);
Copper Weight:
0.5OZ（0.018mm）1OZ（0.035mm）
Highlight:

RF copper clad laminate sheet

,

IsoClad 917 laminate sheet

,

copper clad laminate with warranty

Product Description

IsoClad 917 laminates are nonwoven fiberglass/PTFE composites engineered for printed circuit board substrates. Their nonwoven reinforcement makes them well-suited for applications where the final circuit needs to be formed or bent, such as in conformal or "wrap-around" antennas.

 

Using longer random fibers and a proprietary manufacturing process, IsoClad laminates deliver greater dimensional stability and superior dielectric constant uniformity compared to other nonwoven fiberglass/PTFE materials with similar dielectric properties.

 

IsoClad 917 laminates (Er=2.17, 2.20) feature a low fiberglass-to-PTFE ratio, offering the lowest available dielectric constant and dissipation factor achievable with a PTFE and fiberglass composite.

 

IsoClad 917 RF Copper Clad Laminate Sheet 0

 

Features:
-Nonwoven fiberglass reinforcement
-Low dielectric constant
-Extremely low signal loss

 

Benefits:
-More flexible than woven fiberglass laminates
-Highly isotropic electrical properties in X, Y, and Z axes

 

Typical Applications:
-Conformal antennas
-Stripline and microstrip circuits
-Missile guidance systems
-Radar and electronic warfare systems

 

Property IsoClad 917 Condition Test Method
Dielectric Constant @ 10 GHz 2.17, 2.20 C23/50 IPC TM-650 2.5.5.5
Dissipation Factor @ 10 GHz 0.0013 C23/50 IPC TM-650 2.5.5.5
Thermal Coefficient of Er (ppm/°C) -157 -10°C to +140°C IPC TM-650 2.5.5.5
Adapted
Peel Strength (lbs.per inch) 10 After Thermal IPC TM-650 2.4.8
Volume Resistivity (MΩ-cm) 1.5 x 1010 C96/35/90 IPC TM-650 2.5.17.1
Surface Resistivity (MΩ) 1.0 x 109 C96/35/90 IPC TM-650 2.5.17.1
Arc Resistance (seconds) >180 D48/50 ASTM D-495
Tensile Modulus (kpsi) 133, 120 A, 23°C ASTM D-638
Tensile Strength (kpsi) 4.3, 3.8 A, 23°C ASTM D-882
Compressive Modulus (kpsi) 182 A, 23°C ASTM D-695
Flexural Modulus (kpsi) 213 A, 23°C ASTM D-790
Dielectric Breakdown (kv) >45 D48/50 ASTM D-149
Density (g/cm3) 2.23 A, 23°C ASTM D-792 Method A
Water Absorption (%) 0.04 E1/105 + D24/23 MIL-S-13949H 3.7.7
IPC TM-650 2.6.2.2
Coefficient of Thermal   0°C to 100°C IPC TM-650 2.4.24
Expansion (ppm/°C)   Mettler 3000
X Axis 46 Thermomechanical
Y Axis 47 Analyzer
Z Axis 236  
Thermal Conductivity (W/mK) 0.263 100°C ASTM E-1225
Outgassing   125°C, ≤10-6 torr  
Total Mass Loss (%) 0.02 Maximum 1.00%
Collected Volatile 0.00 Maximum 0.10%
Condensable Material (%)    
Water Vapor Regain (%) 0.02  
Visible Condensate (±) NO  
Flammability Meets requirements of
UL94-V0		 C48/23/50, E24/125 UL 94 Vertical Burn IPC TM-650 2.3.10

 

IsoClad 917 RF Copper Clad Laminate Sheet 1

Tags: 

0.1mm Copper Clad Laminate,  

BME217 Copper Clad Laminate,  

12mm Copper Clad Laminate

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Copper Clad Laminates
IsoClad 917 RF Copper Clad Laminate Sheet
  • name
IsoClad 917 RF Copper Clad Laminate Sheet
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
IsoClad 917
Laminate Thickness:
0.787mm 1.575mm
Laminate Size:
12"X18"(305X457mm); 24"X18"(610X457mm);
Copper Weight:
0.5OZ（0.018mm）1OZ（0.035mm）
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

RF copper clad laminate sheet

,

IsoClad 917 laminate sheet

,

copper clad laminate with warranty

Product Description

IsoClad 917 laminates are nonwoven fiberglass/PTFE composites engineered for printed circuit board substrates. Their nonwoven reinforcement makes them well-suited for applications where the final circuit needs to be formed or bent, such as in conformal or "wrap-around" antennas.

 

Using longer random fibers and a proprietary manufacturing process, IsoClad laminates deliver greater dimensional stability and superior dielectric constant uniformity compared to other nonwoven fiberglass/PTFE materials with similar dielectric properties.

 

IsoClad 917 laminates (Er=2.17, 2.20) feature a low fiberglass-to-PTFE ratio, offering the lowest available dielectric constant and dissipation factor achievable with a PTFE and fiberglass composite.

 

IsoClad 917 RF Copper Clad Laminate Sheet 0

 

Features:
-Nonwoven fiberglass reinforcement
-Low dielectric constant
-Extremely low signal loss

 

Benefits:
-More flexible than woven fiberglass laminates
-Highly isotropic electrical properties in X, Y, and Z axes

 

Typical Applications:
-Conformal antennas
-Stripline and microstrip circuits
-Missile guidance systems
-Radar and electronic warfare systems

 

Property IsoClad 917 Condition Test Method
Dielectric Constant @ 10 GHz 2.17, 2.20 C23/50 IPC TM-650 2.5.5.5
Dissipation Factor @ 10 GHz 0.0013 C23/50 IPC TM-650 2.5.5.5
Thermal Coefficient of Er (ppm/°C) -157 -10°C to +140°C IPC TM-650 2.5.5.5
Adapted
Peel Strength (lbs.per inch) 10 After Thermal IPC TM-650 2.4.8
Volume Resistivity (MΩ-cm) 1.5 x 1010 C96/35/90 IPC TM-650 2.5.17.1
Surface Resistivity (MΩ) 1.0 x 109 C96/35/90 IPC TM-650 2.5.17.1
Arc Resistance (seconds) >180 D48/50 ASTM D-495
Tensile Modulus (kpsi) 133, 120 A, 23°C ASTM D-638
Tensile Strength (kpsi) 4.3, 3.8 A, 23°C ASTM D-882
Compressive Modulus (kpsi) 182 A, 23°C ASTM D-695
Flexural Modulus (kpsi) 213 A, 23°C ASTM D-790
Dielectric Breakdown (kv) >45 D48/50 ASTM D-149
Density (g/cm3) 2.23 A, 23°C ASTM D-792 Method A
Water Absorption (%) 0.04 E1/105 + D24/23 MIL-S-13949H 3.7.7
IPC TM-650 2.6.2.2
Coefficient of Thermal   0°C to 100°C IPC TM-650 2.4.24
Expansion (ppm/°C)   Mettler 3000
X Axis 46 Thermomechanical
Y Axis 47 Analyzer
Z Axis 236  
Thermal Conductivity (W/mK) 0.263 100°C ASTM E-1225
Outgassing   125°C, ≤10-6 torr  
Total Mass Loss (%) 0.02 Maximum 1.00%
Collected Volatile 0.00 Maximum 0.10%
Condensable Material (%)    
Water Vapor Regain (%) 0.02  
Visible Condensate (±) NO  
Flammability Meets requirements of
UL94-V0		 C48/23/50, E24/125 UL 94 Vertical Burn IPC TM-650 2.3.10

 

IsoClad 917 RF Copper Clad Laminate Sheet 1

Tags: 

0.1mm Copper Clad Laminate,

BME217 Copper Clad Laminate,

12mm Copper Clad Laminate

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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