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High Speed RT/duroid 5880 Copper Clad Laminate
  • name

High Speed RT/duroid 5880 Copper Clad Laminate

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
RT/duroid 5880
Laminate Thickness:
0.127mm 0.254mm 0.381mm 0.508mm 0.787mm 1.016mm 1.575mm 3.175mm
Laminate Size:
18"X12"(457X305mm); 18"X24"(457X610mm);
Copper Weight:
0.5OZ（0.018mm）1OZ（0.035mm）
Highlight:

High Speed RT/duroid 5880 laminate

,

Copper clad laminate with warranty

,

RT/duroid 5880 high frequency laminate

Product Description

RT/duroid® 5880 laminates, composed of glass microfiber reinforced PTFE composites, are engineered for high-precision stripline and microstrip circuits. Their randomly oriented microfibers ensure outstanding dielectric constant uniformity, which remains consistent across production panels and over a broad frequency spectrum.

 

With a low dissipation factor, RT/duroid 5880 performs reliably into Ku-band and higher frequencies. The material is easily cut, sheared, and machined, and resists common solvents and reagents used in circuit etching and plating.

 

Standard laminates are supplied with electrodeposited copper (½ to 2 oz/ft² or 8 to 70 µm) or reverse-treated EDC on both sides. Rolled copper foil cladding is available for more demanding electrical applications, and cladding with aluminum, copper, or brass plate can also be specified.

 

When ordering, please specify dielectric thickness, tolerance, copper foil type (rolled, electrodeposited, or reverse treated), and foil weight.

 

High Speed RT/duroid 5880 Copper Clad Laminate 0

 

Features:
- Industry-lowest dielectric constant
- Low Z-axis coefficient of thermal expansion (CTE)
- Lightweight / low density
- Stable electrical properties across a wide frequency range

 

Typical Applications:
- Airborne antenna systems
- Lightweight feed networks
- Military radar systems
- Missile guidance systems
- Point-to-point digital radio antennas

 

RT/duroid 5880 Typical Value
Property RT/duroid 5880 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.20
2.20±0.02 spec.		 Z N/A C24/23/50
C24/23/50		 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.2 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0004
0.0009		 Z N/A C24/23/50
C24/23/50		 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -125 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)		 N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1070(156) 450(65) X
860(125) 380(55) Y
Ultimate Stress 29(4.2) 20(2.9) X
27(3.9) 18(2.6) Y
Ultimate Strain 6 7.2 X %
4.9 5.8 Y
Compressive Modulus 710(103) 500(73) X MPa(kpsi) A ASTM D 695
710(103) 500(73) Y
940(136) 670(97) Z
Ultimate Stress 27(3.9) 22(3.2) X
29(5.3) 21(3.1) Y
52(7.5) 43(6.3) Z
Ultimate Strain 8.5 8.4 X %
7.7 7.8 Y
12.5 17.6 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.2 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 31
48
237		 X
Y
Z		 ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃ TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 31.2(5.5) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float		 IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A

 

High Speed RT/duroid 5880 Copper Clad Laminate 1

Tags: 

0.1mm Copper Clad Laminate,  

BME217 Copper Clad Laminate,  

12mm Copper Clad Laminate

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Copper Clad Laminates
High Speed RT/duroid 5880 Copper Clad Laminate
  • name
High Speed RT/duroid 5880 Copper Clad Laminate
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
RT/duroid 5880
Laminate Thickness:
0.127mm 0.254mm 0.381mm 0.508mm 0.787mm 1.016mm 1.575mm 3.175mm
Laminate Size:
18"X12"(457X305mm); 18"X24"(457X610mm);
Copper Weight:
0.5OZ（0.018mm）1OZ（0.035mm）
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

High Speed RT/duroid 5880 laminate

,

Copper clad laminate with warranty

,

RT/duroid 5880 high frequency laminate

Product Description

RT/duroid® 5880 laminates, composed of glass microfiber reinforced PTFE composites, are engineered for high-precision stripline and microstrip circuits. Their randomly oriented microfibers ensure outstanding dielectric constant uniformity, which remains consistent across production panels and over a broad frequency spectrum.

 

With a low dissipation factor, RT/duroid 5880 performs reliably into Ku-band and higher frequencies. The material is easily cut, sheared, and machined, and resists common solvents and reagents used in circuit etching and plating.

 

Standard laminates are supplied with electrodeposited copper (½ to 2 oz/ft² or 8 to 70 µm) or reverse-treated EDC on both sides. Rolled copper foil cladding is available for more demanding electrical applications, and cladding with aluminum, copper, or brass plate can also be specified.

 

When ordering, please specify dielectric thickness, tolerance, copper foil type (rolled, electrodeposited, or reverse treated), and foil weight.

 

High Speed RT/duroid 5880 Copper Clad Laminate 0

 

Features:
- Industry-lowest dielectric constant
- Low Z-axis coefficient of thermal expansion (CTE)
- Lightweight / low density
- Stable electrical properties across a wide frequency range

 

Typical Applications:
- Airborne antenna systems
- Lightweight feed networks
- Military radar systems
- Missile guidance systems
- Point-to-point digital radio antennas

 

RT/duroid 5880 Typical Value
Property RT/duroid 5880 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.20
2.20±0.02 spec.		 Z N/A C24/23/50
C24/23/50		 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.2 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0004
0.0009		 Z N/A C24/23/50
C24/23/50		 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -125 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)		 N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1070(156) 450(65) X
860(125) 380(55) Y
Ultimate Stress 29(4.2) 20(2.9) X
27(3.9) 18(2.6) Y
Ultimate Strain 6 7.2 X %
4.9 5.8 Y
Compressive Modulus 710(103) 500(73) X MPa(kpsi) A ASTM D 695
710(103) 500(73) Y
940(136) 670(97) Z
Ultimate Stress 27(3.9) 22(3.2) X
29(5.3) 21(3.1) Y
52(7.5) 43(6.3) Z
Ultimate Strain 8.5 8.4 X %
7.7 7.8 Y
12.5 17.6 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.2 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 31
48
237		 X
Y
Z		 ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃ TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 31.2(5.5) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float		 IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A

 

High Speed RT/duroid 5880 Copper Clad Laminate 1

Tags: 

0.1mm Copper Clad Laminate,

BME217 Copper Clad Laminate,

12mm Copper Clad Laminate

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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