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High Speed DiClad 880 Copper Clad Laminate

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High Speed DiClad 880 Copper Clad Laminate

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-332.V1.0

Part Number:

DiClad 880

Laminate Thickness:

0.508mm 0.762mm 1.524mm

Laminate Size:

12"X18"(305X457mm); 18"X12"(457X305mm); 18"X24"(457X610mm); 24"X18"(610X457mm);

Copper Weight:

0.5OZ（0.018mm）1OZ（0.035mm）

Highlight:

High Speed DiClad 880 laminate

Copper clad laminate with warranty

DiClad 880 high frequency laminate

Product Description

DiClad 880 laminates are woven fiberglass/PTFE composite substrates designed for printed circuit boards. By precisely controlling the fiberglass-to-PTFE ratio, these laminates provide a spectrum of options—from the lowest available dielectric constant and dissipation factor to more heavily reinforced versions with enhanced dimensional stability.

The woven fiberglass reinforcement in DiClad materials delivers superior dimensional stability compared to non-woven fiberglass PTFE laminates with similar dielectric constants. Rogers' controlled process for coating and aligning the fiberglass cloth plies enables a wider selection of dielectric constants and ensures exceptional dielectric constant uniformity.

DiClad 880 laminates are ideal for applications requiring precise electrical performance, such as filters, couplers, and low-noise amplifiers, where dielectric uniformity is essential. They are also well-suited for power dividers and combiners, where low signal loss is critical.

High Speed DiClad 880 Copper Clad Laminate 0

Features & Benefits:
- Extremely low loss tangent
- Excellent dimensional stability
- High product performance uniformity
- Stable electrical properties across frequency
- Consistent mechanical performance
- Excellent chemical resistance

Typical Applications:
- Military radar feed networks
- Commercial phased array networks
- Low-loss base station antennas
- Missile guidance systems
- Digital radio antennas
- Filters, couplers, and low-noise amplifiers (LNAs)

Properties	DiClad 880	Units	Test Conditions	Test Method
Electrical Properties	-	-	-	-
Dielectric Constant (10 GHz)	2.17, 2.20	-	23˚C @ 50% RH 10 GHz	IPC TM-650 [2.5.5.5](2.5.5.5)
Dielectric Constant (1 MHz)	2.17, 2.20	-	23˚C @ 50% RH 1 MHz	IPC TM-650 [2.5.5.3](2.5.5.3)
Dissipation Factor (10 GHz)	0.0009	-	23˚C @ 50% RH 10 GHz	IPC TM-650 [2.5.5.5](2.5.5.5)
Dissipation Factor (1 MHz)	0.0008	-	23˚C @ 50% RH 1 MHz	IPC TM-650 [2.5.5.3](2.5.5.3)
Thermal Coefficient of Dielectric Constant	-160	ppm/˚C	-10 to 140˚C 10 GHz	IPC TM-650 [2.5.5.5](2.5.5.5)
Volume Resistivity	1.4 x 10⁹	MΩ-cm	C96/35/90	IPC TM-650 [2.5.17.1](2.5.17.1)
Surface Resistivity	2.9 x 10⁶	MΩ	C96/35/90	IPC TM-650 [2.5.17.1](2.5.17.1)
Dielectric Breakdown	>45	kV	D48/50	ASTM D-149
Arc Resistance	>180	-	-	ASTM D-495
Thermal Properties	-	-	-	-
Coefficient of Thermal Expansion - x	25	ppm/˚C	-50˚C to 150˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y	34	ppm/˚C	-50˚C to 150˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z	252	ppm/˚C	-50˚C to 150˚C	IPC TM-650 2.4.24
Thermal Conductivity	0.25	W/(m.K)	-	ASTM E1461
Mechanical Properties	-	-	-	-
Copper Peel Strength	14	Lbs/in	10s @288˚C 35 μm foil	IPC TM-650 2.4.8
Young’s Modulus	267, 202	kpsi	23˚C @ 50% RH	ASTM D-638
Tensile Strength (MD, CMD)	8.1, 7.5	kpsi	23˚C @ 50% RH	ASTM D-882
Compressive Modulus	237	kpsi	23˚C @ 50% RH	ASTM D-695
Flex Modulus	357	kpsi	23˚C @ 50% RH	ASTM D-3039
Physical Properties	-	-	-	-
Flammability	V-0	-	C48/23/50 & C168/70	UL 94
Moisture Absorption	0.02	%	E1/105+D24/23	IPC TM-650 [2.6.2.2](2.6.2.2)
Density	2.23	g/cm³	C24/23/50 Method A	ASTM D792
NASA Outgassing	-	-	-	-
Total Mass Lost	0.01	%	125°C, ≤ 10⁻⁶ torr	NASA SP-R-0022A
Collected Volatiles	0.01	%	125°C, ≤ 10⁻⁶ torr	NASA SP-R-0022A
Water Vapor Recovered	0.0	%	125°C, ≤ 10⁻⁶ torr	NASA SP-R-0022A

High Speed DiClad 880 Copper Clad Laminate 1

Tags:

Products

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Detail Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-332.V1.0

Part Number:

DiClad 880

Laminate Thickness:

0.508mm 0.762mm 1.524mm

Laminate Size:

12"X18"(305X457mm); 18"X12"(457X305mm); 18"X24"(457X610mm); 24"X18"(610X457mm);

Copper Weight:

0.5OZ（0.018mm）1OZ（0.035mm）

Minimum Order Quantity:

1PCS

Price:

USD9.99-99.99

Packaging Details:

Vacuum bags+Cartons

Delivery Time:

8-9 working days

Payment Terms:

T/T

Supply Ability:

5000PCS per month

Highlight

High Speed DiClad 880 laminate

Copper clad laminate with warranty

DiClad 880 high frequency laminate

Product Description

High Speed DiClad 880 Copper Clad Laminate 0

Properties	DiClad 880	Units	Test Conditions	Test Method
Electrical Properties	-	-	-	-
Dielectric Constant (10 GHz)	2.17, 2.20	-	23˚C @ 50% RH 10 GHz	IPC TM-650 [2.5.5.5](2.5.5.5)
Dielectric Constant (1 MHz)	2.17, 2.20	-	23˚C @ 50% RH 1 MHz	IPC TM-650 [2.5.5.3](2.5.5.3)
Dissipation Factor (10 GHz)	0.0009	-	23˚C @ 50% RH 10 GHz	IPC TM-650 [2.5.5.5](2.5.5.5)
Dissipation Factor (1 MHz)	0.0008	-	23˚C @ 50% RH 1 MHz	IPC TM-650 [2.5.5.3](2.5.5.3)
Thermal Coefficient of Dielectric Constant	-160	ppm/˚C	-10 to 140˚C 10 GHz	IPC TM-650 [2.5.5.5](2.5.5.5)
Volume Resistivity	1.4 x 10⁹	MΩ-cm	C96/35/90	IPC TM-650 [2.5.17.1](2.5.17.1)
Surface Resistivity	2.9 x 10⁶	MΩ	C96/35/90	IPC TM-650 [2.5.17.1](2.5.17.1)
Dielectric Breakdown	>45	kV	D48/50	ASTM D-149
Arc Resistance	>180	-	-	ASTM D-495
Thermal Properties	-	-	-	-
Coefficient of Thermal Expansion - x	25	ppm/˚C	-50˚C to 150˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y	34	ppm/˚C	-50˚C to 150˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z	252	ppm/˚C	-50˚C to 150˚C	IPC TM-650 2.4.24
Thermal Conductivity	0.25	W/(m.K)	-	ASTM E1461
Mechanical Properties	-	-	-	-
Copper Peel Strength	14	Lbs/in	10s @288˚C 35 μm foil	IPC TM-650 2.4.8
Young’s Modulus	267, 202	kpsi	23˚C @ 50% RH	ASTM D-638
Tensile Strength (MD, CMD)	8.1, 7.5	kpsi	23˚C @ 50% RH	ASTM D-882
Compressive Modulus	237	kpsi	23˚C @ 50% RH	ASTM D-695
Flex Modulus	357	kpsi	23˚C @ 50% RH	ASTM D-3039
Physical Properties	-	-	-	-
Flammability	V-0	-	C48/23/50 & C168/70	UL 94
Moisture Absorption	0.02	%	E1/105+D24/23	IPC TM-650 [2.6.2.2](2.6.2.2)
Density	2.23	g/cm³	C24/23/50 Method A	ASTM D792
NASA Outgassing	-	-	-	-
Total Mass Lost	0.01	%	125°C, ≤ 10⁻⁶ torr	NASA SP-R-0022A
Collected Volatiles	0.01	%	125°C, ≤ 10⁻⁶ torr	NASA SP-R-0022A
Water Vapor Recovered	0.0	%	125°C, ≤ 10⁻⁶ torr	NASA SP-R-0022A

High Speed DiClad 880 Copper Clad Laminate 1

Tags:

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Copper Clad Laminates

High Speed DiClad 880 Copper Clad Laminate

High Speed DiClad 880 laminate

Copper clad laminate with warranty

DiClad 880 high frequency laminate

0.1mm Copper Clad Laminate,

BME217 Copper Clad Laminate,

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Copper Clad Laminates

High Speed DiClad 880 laminate

Copper clad laminate with warranty

DiClad 880 high frequency laminate

0.1mm Copper Clad Laminate,

BME217 Copper Clad Laminate,