logo
Home ProductsCustom PCBs

High Speed DiClad 880 Copper Clad Laminate

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

I'm Online Chat Now

High Speed DiClad 880 Copper Clad Laminate

High Speed DiClad 880 Copper Clad Laminate
High Speed DiClad 880 Copper Clad Laminate

Large Image :  High Speed DiClad 880 Copper Clad Laminate

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-332.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month

High Speed DiClad 880 Copper Clad Laminate

Description
Part Number: DiClad 880 Laminate Thickness: 0.508mm 0.762mm 1.524mm
Laminate Size: 12"X18"(305X457mm); 18"X12"(457X305mm); 18"X24"(457X610mm); 24"X18"(610X457mm); Copper Weight: 0.5OZ(0.018mm)1OZ(0.035mm)
Highlight:

High Speed DiClad 880 laminate

,

Copper clad laminate with warranty

,

DiClad 880 high frequency laminate

DiClad 880 laminates are woven fiberglass/PTFE composite substrates designed for printed circuit boards. By precisely controlling the fiberglass-to-PTFE ratio, these laminates provide a spectrum of options—from the lowest available dielectric constant and dissipation factor to more heavily reinforced versions with enhanced dimensional stability.

 

The woven fiberglass reinforcement in DiClad materials delivers superior dimensional stability compared to non-woven fiberglass PTFE laminates with similar dielectric constants. Rogers' controlled process for coating and aligning the fiberglass cloth plies enables a wider selection of dielectric constants and ensures exceptional dielectric constant uniformity.

 

DiClad 880 laminates are ideal for applications requiring precise electrical performance, such as filters, couplers, and low-noise amplifiers, where dielectric uniformity is essential. They are also well-suited for power dividers and combiners, where low signal loss is critical.

 

High Speed DiClad 880 Copper Clad Laminate 0

 

Features & Benefits:
- Extremely low loss tangent
- Excellent dimensional stability
- High product performance uniformity
- Stable electrical properties across frequency
- Consistent mechanical performance
- Excellent chemical resistance

 

Typical Applications:
- Military radar feed networks
- Commercial phased array networks
- Low-loss base station antennas
- Missile guidance systems
- Digital radio antennas
- Filters, couplers, and low-noise amplifiers (LNAs)

 

Properties DiClad 880 Units Test Conditions Test Method
Electrical Properties - - - -
Dielectric Constant (10 GHz) 2.17, 2.20 - 23˚C @ 50% RH 10 GHz IPC TM-650 [2.5.5.5](2.5.5.5)
Dielectric Constant (1 MHz) 2.17, 2.20 - 23˚C @ 50% RH 1 MHz IPC TM-650 [2.5.5.3](2.5.5.3)
Dissipation Factor (10 GHz) 0.0009 - 23˚C @ 50% RH 10 GHz IPC TM-650 [2.5.5.5](2.5.5.5)
Dissipation Factor (1 MHz) 0.0008 - 23˚C @ 50% RH 1 MHz IPC TM-650 [2.5.5.3](2.5.5.3)
Thermal Coefficient of Dielectric Constant -160 ppm/˚C -10 to 140˚C 10 GHz IPC TM-650 [2.5.5.5](2.5.5.5)
Volume Resistivity 1.4 x 10⁹ MΩ-cm C96/35/90 IPC TM-650 [2.5.17.1](2.5.17.1)
Surface Resistivity 2.9 x 10⁶ C96/35/90 IPC TM-650 [2.5.17.1](2.5.17.1)
Dielectric Breakdown >45 kV D48/50 ASTM D-149
Arc Resistance >180 - - ASTM D-495
Thermal Properties - - - -
Coefficient of Thermal Expansion - x 25 ppm/˚C -50˚C to 150˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 34 ppm/˚C -50˚C to 150˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 252 ppm/˚C -50˚C to 150˚C IPC TM-650 2.4.24
Thermal Conductivity 0.25 W/(m.K) - ASTM E1461
Mechanical Properties - - - -
Copper Peel Strength 14 Lbs/in 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Young’s Modulus 267, 202 kpsi 23˚C @ 50% RH ASTM D-638
Tensile Strength (MD, CMD) 8.1, 7.5 kpsi 23˚C @ 50% RH ASTM D-882
Compressive Modulus 237 kpsi 23˚C @ 50% RH ASTM D-695
Flex Modulus 357 kpsi 23˚C @ 50% RH ASTM D-3039
Physical Properties - - - -
Flammability V-0 - C48/23/50 & C168/70 UL 94
Moisture Absorption 0.02 % E1/105+D24/23 IPC TM-650 [2.6.2.2](2.6.2.2)
Density 2.23 g/cm³ C24/23/50 Method A ASTM D792
NASA Outgassing - - - -
Total Mass Lost 0.01 % 125°C, ≤ 10⁻⁶ torr NASA SP-R-0022A
Collected Volatiles 0.01 % 125°C, ≤ 10⁻⁶ torr NASA SP-R-0022A
Water Vapor Recovered 0.0 % 125°C, ≤ 10⁻⁶ torr NASA SP-R-0022A

 

High Speed DiClad 880 Copper Clad Laminate 1

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)