|
Product Details:
|
| Part Number: | F4BTMS220 | Laminate Thickness: | 0.09mm 0.127mm 0.254mm 0.508mm 0.635mm 0.762mm 0.787mm 1.016mm 1.27mm 1.5mm 1.524mm 1.575mm 2.03mm 2.54mm 3.175mm 4.06mm 5.08mm 6.35mm |
|---|---|---|---|
| Laminate Size: | 18"X12"(457X305mm); 18"X24"(457X610mm); 24"X36"(610X920mm) | Copper Weight: | 0.5OZ(0.018mm)1OZ(0.035mm) |
| Highlight: | RF copper clad laminate,F4BTMS220 copper laminate,high-frequency copper clad board |
||
| Product Features | Test Conditions | Unit | F4BTMS220 |
| Dielectric Constant (Typical) | 10GHz | / | 2.2 |
| Dielectric Constant Tolerance | / | / | ±0.02 |
| Dielectric Constant (Design) | 10GHz | / | 2.2 |
| Loss Tangent (Typical) | 10GHz | / | 0.0009 |
| 20GHz | / | 0.0010 | |
| 40GHz | / | 0.0013 | |
| Dielectric Constant Temperature Coefficient | -55 º~150ºC | PPM/℃ | -130 |
| Peel Strength | 1 OZ RTF copper | N/mm | >2.4 |
| Volume Resistivity | Standard Condition | MΩ.cm | ≥1×10^8 |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^8 |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >26 |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >35 |
| Coefficientof Thermal Expansion (X, Y direction) | -55 º~288ºC | ppm/ºC | 40, 50 |
| Coefficientof Thermal Expansion (Z direction) | -55 º~288ºC | ppm/ºC | 290 |
| Thermal Stress | 260℃, 10s,3 times | / | No delamination |
| Water Absorption | 20±2℃, 24 hours | % | 0.02 |
| Density | Room Temperature | g/cm3 | 2.18 |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55~+260 |
| Thermal Conductivity | Z direction | W/(M.K) | 0.26 |
| Flammability | / | UL-94 | V-0 |
| Material Composition | / | / | PTFE,Ultra-thin and ultra-fine (quartz) fiberglass. |
![]()
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848