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Product Details:
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| Material: | RO3210 And RO3003 | Layer Count: | 3-layer |
|---|---|---|---|
| PCB Size: | 62.8mm X 62.8 Mm=1PCS, +/- 0.15mm | PCB Thickness: | 3mm |
| Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Tin |
| Highlight: | RO3210 Hybrid PCB,3mm Hybrid PCB,RO3003 Hybrid PCB |
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Introducing our newly shipped hybrid printed circuit board (PCB), designed for high-frequency applications with unmatched performance and reliability. This advanced PCB combines Rogers’ RO3210 and RO3003 materials, providing a unique blend of mechanical stability and excellent electrical characteristics, making it ideal for a wide range of demanding applications.
Key Features
RO3210 Material
- Dielectric Constant (Dk): 10.2 ± 0.5
- Dissipation Factor: 0.0027 at 10 GHz
- Thermal Stability:
- Coefficient of Thermal Expansion (CTE):
- X & Y axes: 13 ppm/°C
- Z axis: 34 ppm/°C
- Decomposition Temperature (Td): 500 °C
- Thermal Conductivity: 0.81 W/mK
- Flammability Rating: V0 (UL 94 standard)
| RO3210 Typical Value | |||||
| Property | RO3210 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 10.2±0.5 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 10.8 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0027 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -459 | Z | ppm/℃ | 10 GHz 0℃to 100℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.8 | X, Y | mm/m | COND A | ASTM D257 |
| Volume Resistivity | 103 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 103 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 579 517 |
MD CMD |
kpsi | 23℃ | ASTM D 638 |
| Water Absorption | ＜0.1 | - | % | D24/23 | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.79 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.81 | W/M/K | 80℃ | ASTM C518 | |
| Coefficient of Thermal Expansion (-55 to 288℃) |
13 34 |
X,Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ | TGA | ASTM D3850 | |
| Density | 3 | gm/cm3 | |||
| Copper Peel Stength | 11 | pli | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
RO3003 Material
- Dielectric Constant (Dk): 3 ± 0.04 at 10 GHz/23°C
- Dissipation Factor: 0.001 at 10 GHz/23°C
- Thermal Stability:
- Td: > 500 °C
- Coefficient of Thermal Expansion:
- X axis: 17 ppm/°C
- Y axis: 16 ppm/°C
- Z axis: 25 ppm/°C
- Moisture Absorption: 0.04%
- Thermal Conductivity: 0.5 W/mK
| RO3003 Typical Value | |||||
| Property | RO3003 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.0±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.001 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -3 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.06 0.07 |
X Y |
mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 107 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 107 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 930 823 |
X Y |
MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.04 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | 0.9 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.5 | W/M/K | 50℃ | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288℃) |
17 16 25 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.1 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 12.7 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
PCB Specifications
- Stackup: 3-layer rigid PCB
- Copper Layer 1: 35 μm
- Rogers RO3003 Core: 1.524 mm (60 mil)
- RO4450F Bondply: 0.101 mm (4 mil)
- Rogers RO3210 Core: 1.27 mm (50 mil)
- Copper Layer 1: 35 μm
- Dimensions: 62.8 mm x 62.8 mm ± 0.15 mm
- Finished Board Thickness: 3.0 mm
- Finished Copper Weight: 1 oz (1.4 mils) on outer layers
- Minimum Trace/Space: 7/9 mils
- Minimum Hole Size: 0.4 mm
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion Tin
- Electrical Testing: 100% electrical test prior to shipment
Application Areas
This hybrid PCB is tailored for various high-performance applications, including:
- Automotive Technologies: Collision avoidance systems and global positioning satellite antennas
- Telecommunications: Wireless systems, microstrip patch antennas, and direct broadcast satellites
- Remote Monitoring: Datalink on cable systems and remote meter readers
- Infrastructure Solutions: Power backplanes, LMDS, wireless broadband, and base station infrastructure
Quality Assurance
Manufactured to IPC-Class 2 standards, this PCB ensures high reliability and performance. The artwork is provided in Gerber RS-274-X format, making it compatible with standard PCB design tools.
Global Availability
Our hybrid PCB is available for worldwide shipping, allowing you to leverage cutting-edge technology in your projects, no matter your location.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
