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Hybrid PCB Organic Ceramic Laminate RF-35 Taconic PCB 30mil 60mil

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Hybrid PCB Organic Ceramic Laminate RF-35 Taconic PCB 30mil 60mil

Hybrid PCB Organic Ceramic Laminate RF-35 Taconic PCB 30mil 60mil
Hybrid PCB Organic Ceramic Laminate RF-35 Taconic PCB 30mil 60mil Hybrid PCB Organic Ceramic Laminate RF-35 Taconic PCB 30mil 60mil

Large Image :  Hybrid PCB Organic Ceramic Laminate RF-35 Taconic PCB 30mil 60mil

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-171.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: PTFE Ceramic Fiberglass Layer Count: Double Layer, Multilayer, Hybrid PCB
PCB Thickness: 10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) PCB Size: ≤400mm X 500mm
Solder Mask: Green, Black, Blue, Yellow, Red Etc. Copper Weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish: Bare Copper, HASL, ENIG, Immersion Silver, Immersoin Tin, OSP Etc..
High Light:

60mil RF Taconic PCB

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Hybrid RF Taconic PCB

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Organic Ceramic Laminate Taconic PCB

 

RF-35 Taconic High Frequency PCB with DK 3.5 Tg 315 10mil 20mil 30mil 60mil RF PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RF-35 is an organic-ceramic laminate material in the ORCER (Organic Ceramic) family of Taconic products. It is based on woven glass reinforcement. RF-35 is the result of Taconic's expertise in both ceramic filling technology and coated polytetrafluoride (PTFE) fiberglass.

 

RF-35 is the best choice for low cost, high volume commercial microwave and radio frequency applications.It has an excellent peel strength for 1/2 ounce and 1 ounce copper (even compared to standard epoxy glass), a key aspect of the need for rework.

 

RF-35's Tg exceeds 315 ℃. Its ultra low moisture absorption rate and low dissipation factor minimize phase shift with frequency. RF-35 used woven fabrics in the design result in the stable dimension. The laminates are usually orderly clad on one side or both sides with 1/2,1 and 2 ounces electrodeposited copper respectively.

 

So we benefit from its low cost, excellent peel strength, exceptionally low dissipation factor, low moisture absorption and enhanced surface smoothness.

 

Applications

Power Amplifiers

Filters and Couplers

Passive Components

 

Our PCB Capability (RF-35)

PCB Material: PTFE Ceramic Fiberglass
Designation: RF-35
Dielectric constant: 3.5
Dissipation Factor 0.0018
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..

 

 

RF-35 Typical Value

Property Test Method Unit Value Unit Value
Dielectric Constant @ 1.9 GHz IPC-TM 650 2.5.5   3.5   3.5
Dissipation Factor @ 1.9 GHz IPC-TM 650 2.5.5   0.0018   0.0018
Moisture Absorption (.060") IPC-TM 650 2.6.2.1 % 0.02 % 0.02
Peel Strength (1/2 oz. copper) IPC-TM 650 2.4.8 lbs./linear inch >8.0 N/mm >1.5
Peel Strength (1 oz. copper) IPC-TM 650 2.4.8 lbs./linear inch >10.0 N/mm >1.8
Dielectric Breakdown IPC-TM 650 2.5.6 kV 41 kV 41
Volume Resistivity IPC-TM 650 2.5.17.1 Mohm/cm 1.26 x 109 Mohm/cm 1.26 x 109
Surface Resistivity IPC-TM 650 2.5.17.1 Mohm 1.46 x 108 Mohm 1.46 x 108
Arc Resistance IPC TM 650 2.5.1 seconds >180 seconds >180
Flexural Strength Lengthwise ASTM D 790 psi >22,000 N/mm2 >152
Flexural Strength Crosswise ASTM D 790 psi >18,000 N/mm2 >124
Thermal Conductivity ASTM F 433 W/m/K 0.24 W/m/K 0.24
Tensile Strength Lengthwise ASTM D 638 psi 27,000 N/mm2 187
Tensile Strength Crosswise ASTM D 638 psi 21,000 N/mm2 145
Dimensional Stability Lengthwise IPC-TM 650 2.4.39 in/in 0.00004 mm/mm 0.00004
Dimensional Stability Crosswise IPC-TM 650 2.4.39 in/in -0.0001 mm/mm -0.0001
x-y CTE ASTM D 3386 (TMA) ppm/°C 19-24 ppm/°C 19-24
z CTE ASTM D 3386 (TMA) ppm/°C 64 ppm/°C 64
Flammability UL-94   V-0   V-0
Hardness Rockwell M Scale   34   34

 

 

Type Dk
TLY-5A 2.17
TLY-5 2.20
TLY-3 2.33
TLT-0 TLX-0 2.45
TLT-9 TLX-9 2.50
TLT-8 TLX-8 2.55
TLT-7 TLX-7 2.60
TLT-6 TLX-6 2.65
TLE-95 2.95
TLC-27 2.75
TLC-30 3.00
TLC-32 3.20
RF-30 3.00
RF-35 RF-35P 3.50
RF-60 6.15
CER-10 10

 

 

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Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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