This 2-layer rigid F4BM245 high-frequency PCB is a cost-effective, low-attenuation circuit solution tailored for commercial radio frequency hardware and wireless communication infrastructure. Adopting upgraded fiberglass-reinforced PTFE composite dielectric, this board delivers optimized dielectric consistency and minimized signal attenuation compared with conventional F4B245-grade substrates. Built with a 0.6mm final thickness and 1 oz outer copper layer, it features premium immersion gold surface treatment to sustain stable conductivity and long-term oxidation resistance. Engineered with 4/5 mil fine line capability and 0.3mm micro-hole precision, the board adopts a non-blind-via structure with fully exposed copper without solder mask or silkscreen coverage. Manufactured per IPC-Class-2 requirements and based on standard Gerber RS-274-X fabrication data, every finished unit undergoes 100% electrical testing before delivery, with global supply coverage for scalable RF communication deployment.
PCB Specification
| Specification Item |
Details |
| Base Material |
F4BM245 fiberglass-reinforced PTFE composite substrate |
| Layer Count |
2 layers (rigid PCB) |
| Finished Board Thickness |
0.6mm |
| Board Dimensions |
100mm x 80mm (1PCS), tolerance +/-0.15mm |
| Finished Copper Weight |
1 oz (1.4 mils) outer layers |
| Via Plating Thickness |
20 μm |
| Minimum Trace/Space |
4/5 mils |
| Minimum Hole Size |
0.3mm |
| Blind Vias |
None |
| Surface Finish |
Immersion Gold |
| Silkscreen |
No top & bottom silkscreen |
| Solder Mask |
No top & bottom solder mask |
| Quality Standard |
IPC-Class-2 |
| Testing Process |
100% electrical test prior to shipment |
| Artwork Format |
Gerber RS-274-X |
| Availability |
Worldwide shipping & technical support |
PCB Stack-up Structure
This symmetrical 2-layer rigid stackup balances mechanical structural uniformity and electrical parameter consistency, delivering steady signal transmission performance and excellent production repeatability for general-purpose RF circuit hardware.
| Stack-up Layer |
Specification Details |
| Copper Layer 1 |
35 μm ED copper foil |
| F4BM245 Substrate Core |
20mil (0.508mm) fiberglass & PTFE composite dielectric core |
| Copper Layer 2 |
35 μm ED copper foil |
PCB Statistic
This F4BM245 high-frequency circuit board features streamlined component layout and rational via distribution, supporting compact assembly and stable electrical signal output for mainstream wireless and RF functional modules.
| Statistical Item |
Quantity |
| Total Components |
24 |
| Total Pads |
36 |
| Thru Hole Pads |
21 |
| Top SMT Pads |
15 |
| Bottom SMT Pads |
0 |
| Vias Quantity |
28 |
| Nets Quantity |
2 |
F4BM245 High-Frequency Substrate Introduction
F4BM245 is a commercial-grade fiberglass-reinforced PTFE dielectric laminate, produced via calibrated material proportioning and high-precision lamination of glass fiber cloth, PTFE resin and polymer film layers. It presents comprehensive electrical upgrades over traditional F4B245 substrates, featuring lower signal attenuation, enhanced insulation resistance and improved operational stability, serving as a viable alternative to imported commercial high-frequency dielectric materials.
F4BM245 shares identical dielectric composition with F4BME245 but differs in copper foil configuration. Equipped with standard ED copper foil, F4BM245 targets conventional RF application scenarios that do not require strict PIM suppression. By tuning the mixing ratio of PTFE resin and glass fiber filler, the material achieves accurate dielectric constant calibration, balanced low-loss characteristics and improved dimensional stability. Moderately increased glass fiber content strengthens structural rigidity and temperature drift tolerance with negligible dielectric loss variation, enabling flexible performance adaptation for diversified high-frequency circuit designs.
F4BM245 Core Electrical & Thermal Features
| Performance Parameter |
Specification & Description |
| Dielectric Constant (Dk) |
2.45 at 10GHz, delivering stable dielectric performance for commercial RF signal processing |
| Dissipation Factor (Df) |
0.0012 at 10GHz, ensuring minimal signal attenuation for high-frequency wireless transmission |
| Coefficient of Thermal Expansion (CTE) |
X-axis: 20 ppm/°C; Y-axis: 25 ppm/°C; Z-axis: 187 ppm/°C (-55°C to 288°C) |
| Thermal Coefficient of Dk |
-120 ppm/°C (-55°C to 150°C), stabilizing electrical parameters under fluctuating ambient temperatures |
| Moisture Absorption |
≤0.08%, maintaining consistent electrical performance in humid working environments |
| Flammability Rating |
UL-94 V0, fulfilling universal safety criteria for commercial electronic hardware |
Typical Applications
Benefiting from low dielectric attenuation, stable temperature characteristics and cost-effective manufacturability, F4BM245 circuit boards are widely deployed in commercial radio frequency hardware, wireless infrastructure and high-frequency signal processing systems:
- General RF signal processing and radar sensing hardware
- High-frequency phase tuning components
- RF power distribution, signal coupling and signal synthesis modules
- Antenna feed network and signal transmission assemblies
- Phase-adjustable antenna arrays and phased array antenna systems
- Satellite communication terminal hardware
- Macro and micro base station antenna systems for cellular communication
Quality & Service Guarantee
All F4BM245 high-frequency circuit boards are manufactured in full adherence to IPC-Class-2 industrial quality standards. Produced based on standard Gerber RS-274-X fabrication data, the circuits maintain precise dimensional accuracy and stable electrical reproducibility, meeting rigorous manufacturing requirements for commercial high-frequency circuit applications. Each finished unit undergoes comprehensive electrical performance testing before delivery to ensure zero functional defects and consistent batch reliability. Backed by global supply capabilities and standardized technical support, these low-loss circuit solutions provide stable, high-reliability performance for commercial RF production and wireless communication infrastructure projects across the globe.
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