6-layer RO4003C PCB 1.74mm Thick High TG Circuit IPC-Class-3

This custom 6-layer hybrid rigid PCB adopts RO4003C hydrocarbon ceramic substrate combined with Tg170℃ FR4 dielectric materials. With 1oz finished copper on each conductive layer and 1.74mm finished lamination thickness, the PCB features dual-side green solder mask with white legend and hard electrolytic gold plating. Sized 127mm×103mm (1pcs, including process edge), it complies with IPC-Class-3 standard with 25μm hole copper thickness, configured with L1-L2 & L5-L6 blind vias and full controlled impedance circuitry. It combines premium RF performance and standard FR-4 processability for broadband RF and microwave electronic systems.
 
PCB Specifications

 
RO4003C Material Introduction
RO4003C is a glass-reinforced hydrocarbon ceramic thermoset laminate with premium high-frequency performance and affordable PCB fabrication cost. It supports standard FR-4 manufacturing processes, serving high-frequency circuits operating above 500MHz where conventional FR-4 cannot meet RF electrical requirements.
 
RO4003C owns ultra-low temperature coefficient of dielectric constant, plus stable Dk performance across broad frequency ranges. Optional LoPro® copper foil helps minimize insertion loss for broadband use. Its CTE value matches copper foil closely, ensuring great dimensional stability for mixed-dielectric multilayer PCB structures. Low Z-axis CTE secures intact plated hole performance under severe thermal shock. With Tg above 280°C, it maintains stable thermal properties throughout the whole PCB fabrication thermal cycle.
 
Unlike PTFE-based high-frequency substrates, RO4003C needs no specialized sodium etching via pretreatment. Compatible with automated PCB handling and copper scrubbing equipment, this rigid laminate is available with 1080 and 1674 glass fabric variants with identical electrical performance. It complies with IPC-4103 /10 specification, acting as a qualified direct replacement for standard RO4003C substrates.
 
Core Material Features
Low High-Frequency Dielectric Loss: Stable electrical performance for RF microwave and impedance-controlled transmission lines
 
Excellent Dielectric Stability: Minimal Dk fluctuation under varied temperature and frequency conditions
 
Copper-Matched CTE: Optimized X/Y/Z-axis expansion for high dimensional stability and reliable hole copper structure
 
Ultra-High Thermal Resistance: Tg＞280°C, stable performance during multilayer lamination and thermal cycling
 
FR-4 Compatible Process: No specialized PTFE via etching treatment needed, lowering overall fabrication cost
 
Customizable Copper Foil: Optional LoPro® low-profile foil to reduce signal insertion loss
 
Standard Compliance: Conforms to IPC-4103 /10 industry specification
 
Typical Applications

• Broadband RF and microwave communication circuits
• Controlled impedance transmission lines and signal matching networks
• Commercial radar, antenna and wireless transceiver modules
• Base station radio units and wireless communication infrastructure equipment
• Multi-layer mixed-dielectric high-frequency PCBs
• High-frequency sensing and industrial radio frequency devices