This 2-layer rigid PCB complies with international industry standards for reliable performance. It utilizes CER-10 organic-ceramic laminate as its base substrate, engineered to meet the stringent requirements of high-performance microwave and passive component applications with superior mechanical and electrical characteristics.
PCB Specification
| Item |
Details |
| Base Material |
CER-10 (organic-ceramic laminate) |
| Layer Count |
2 layers, no blind vias |
| Board Dimensions |
89.3mm x 56.9mm, 2 Types, 2 Pieces in total |
| Minimum Trace/Space |
5/6 mils |
| Minimum Hole Size |
0.4mm |
| Finished Board Thickness |
0.7mm |
| Finished Copper Weight |
1 oz (1.4 mils) for outer layers |
| Via Plating Thickness |
20 μm |
| Surface Finish |
Immersion Gold |
| Silkscreen |
Black silkscreen on top layer; no silkscreen on bottom layer |
| Solder Mask |
No solder mask on both top and bottom layers |
| Quality Control |
100% Electrical test conducted prior to shipment |
PCB Stack-up
| Layer |
Specifications |
| Copper Layer 1 |
35 μm |
| CER-10 Substrate |
25 mil (0.635 mm) |
| Copper Layer 2 |
35 μm |
Artwork and Accepted Standard
Type of Artwork Supplied: Gerber RS-274-X, which is universally recognized as the industry standard for PCB fabrication.
Accepted Standard: IPC-Class-2, a widely adopted quality benchmark formulated by the Association Connecting Electronics Industries (IPC).
Availability
This PCB is available for worldwide shipping, supporting global logistics to meet the diverse requirements of international projects and ensure timely delivery.
Introduction to CER-10 Base Material
CER-10 is an organic-ceramic laminate belonging to Taconic’s ORCER product family. It features a dielectric constant of 10 and a low dissipation factor of 0.0035 at 10 GHz, making it well-suited for high-frequency applications. The material incorporates a woven glass reinforcement, integrating Taconic’s advanced ceramic fill technology with coated PTFE fiberglass expertise. CER-10 delivers exceptional interlaminar bond strength and solder resistance, thereby positioning it as an ideal substrate for high-performance microwave and passive component applications.
Key Features of CER-10 Material
| Key Features |
Specifications & Descriptions |
| Material Type |
CER-10 organic-ceramic laminate |
| Dielectric Constant (Dk) |
10 at 10 GHz |
| Dissipation Factor |
0.0035 at 10 GHz |
| Moisture Absorption |
0.02% |
| Coefficient of Thermal Expansion (CTE) |
X axis: 13 ppm/°C; Y axis: 15 ppm/°C; Z axis: 46 ppm/°C |
Benefits of Using CER-10 Material
- Exceptional interlaminar bond strength and solder resistance, ensuring structural integrity during fabrication and long-term operation
- Low moisture absorption and stable dielectric constant (Dk) over a wide frequency range, maintaining consistent electrical performance
- Enhanced dimensional stability and increased flexural strength, supporting reliable component mounting and circuit performance
- Low Z-axis CTE, ensuring reliable plated through-holes (PTHs) and reducing thermal stress during temperature cycling
- Supports circuit board miniaturization, enabling the design of compact high-performance electronic components
- Flammability Rating: V-0 (per IPC-TM 650 standard), ensuring compliance with safety requirements
Typical Applications
Leveraging its superior electrical and mechanical properties, this PCB is specifically designed for high-performance microwave and passive component applications, including but not limited to:
-Power amplifiers
-Waveguide filters
-Directional couplers
-Other microwave passive components
Conclusion
This 2-layer rigid PCB exhibits exceptional high-frequency performance, structural stability, and manufacturability, which are supported by the superior properties of CER-10 organic-ceramic laminate and rigorous pre-shipment quality control protocols.
These characteristics make it an ideal, cost-effective, and reliable solution for global manufacturers engaged in high-performance microwave and passive component projects, particularly those requiring stable dielectric properties, robust mechanical strength, and worldwide availability.
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