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CuClad 250 PCB Substrate Copper Clad Laminate Sheet

CuClad 250 PCB Substrate Copper Clad Laminate Sheet

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
CuClad 250
Laminate Thickness:
0.254mm 0.508mm 0.787mm 1.575mm
Laminate Size:
18''X12''(457X305)18''X 24''(475 X 610mm)
Copper Weight:
0.5OZ(0.018MM), 1OZ(0.035mm);
Highlight:

CuClad 250 PCB substrate sheet

,

copper clad laminate PCB material

,

PCB substrate with copper layer

Product Description

CuClad 250 laminates are woven fiberglass-reinforced PTFE composite materials engineered for deployment as high-performance printed circuit board (PCB) substrates. Through precise calibration of the fiberglass-to-PTFE ratio, CuClad 250 offers a versatile product portfolio—encompassing grades with ultra-low dielectric constant (Er) and loss tangent, to highly reinforced variants optimized for enhanced dimensional stability.


The woven fiberglass reinforcement integral to all CuClad series materials delivers superior dimensional stability compared to nonwoven fiberglass-reinforced PTFE laminates of equivalent dielectric constant. Rogers’ stringent process control and consistency for PTFE-coated fiberglass cloth enable a broader spectrum of available Er values, while also producing laminates with improved dielectric constant uniformity over comparable nonwoven fiberglass-reinforced alternatives. These key performance attributes position CuClad laminates as a high-value solution for RF filters, couplers and low-noise amplifiers (LNAs).


A defining feature of CuClad laminates is their cross-plied architecture: alternating layers of PTFE-coated fiberglass plies are oriented at 90° to one another. This proprietary design delivers true electrical and mechanical isotropy in the XY plane—a unique performance characteristic exclusive to CuClad laminates, unmatched by any other woven or nonwoven fiberglass-reinforced PTFE laminate on the market. This exceptional level of isotropy has been validated by designers as critical for demanding phased array antenna applications.


With a dielectric constant (Er) range of 2.40–2.60, CuClad 250 utilizes a higher fiberglass-to-PTFE ratio to achieve mechanical performance that approaches that of conventional PCB substrates. Additional core benefits include enhanced dimensional stability and reduced thermal expansion across all axes. For high-criticality performance applications, CuClad products may be specified with the LX testing grade—this designation ensures individual testing of each sheet, with a formal test report included with the order. LX-grade products carry a premium price point, as a section of each sheet is used for destructive testing to validate performance.

 

CuClad 250 PCB Substrate Copper Clad Laminate Sheet 0


Features & Benefits

  • Cross-plied woven fiberglass architecture with alternating plies oriented at 90°
  • High PTFE-to-glass ratio
  • Superior dielectric constant uniformity vs. comparable nonwoven fiberglass-reinforced laminates
  • True electrical and mechanical isotropy in the XY plane
  • Ultra-low signal loss
  • Ideal for dielectric constant (Er)-sensitive circuit designs


Typical Applications

  • Military electronics systems (radars, electronic countermeasures [ECM], electronic support measures [ESM])
  • Microwave components (low-noise amplifiers [LNAs], filters, couplers, etc.)

 

Properties Test Method Condition CuClad 250
Dielectric Constant @10 GHz IPC TM-650 2.5.5.5 C23/50 2.40 to 2.55
Dielectric Constant @1MHz IPC TM-650 2.5.5.3 C23/50 2.40 to 2.60
Dissipation Factor @10 GHz IPC TM-650 2.5.5.5 C23/50 0.0017
Thermal Coefficient of Er (ppm/°C) IPC TM-650 2.5.5.5 (Adapted) -10°C to +140°C -153
Peel Strength (lbs.per inch) IPC TM-650 2.4.8 After Thermal Stress 14
Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 8.0 x 10⁹
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 1.5 x 10⁸
Arc Resistance (seconds) ASTM D-495 D48/50 >180
Tensile Modulus (kpsi) ASTM D-638 A, 23°C 725, 572
Tensile Strength (kpsi) ASTM D-882 A, 23°C 26.0, 20.5
Compressive Modulus (kpsi) ASTM D-695 A, 23°C 342
Flexural Modulus (kpsi) ASTM D-790 A, 23°C 456
Dielectric Breakdown (kV) ASTM D-149 D48/50 >45
Specific Gravity (g/cm³) ASTM D-792 (Method A) A, 23°C 2.31
Water Absorption (%) MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2 E1/105 + D24/23 0.03
Coefficient of Thermal Expansion (ppm/°C) IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer 0°C to 100°C X Axis: 18
Y Axis: 28 Y Axis: 24 Y Axis: 19  
Z Axis: 246 Z Axis: 194 Z Axis: 177  
Thermal Conductivity (W/mK) ASTM E-1225 100°C 0.25
Outgassing Requirements 125°C, ≤10⁻⁶ torr; NASA SP-R-0022A -  
Total Mass Loss (%) NASA SP-R-0022A (Maximum 1.00%) 125°C, ≤10⁻⁶ torr 0.01
Collected Volatile Condensable Material (%) NASA SP-R-0022A (Maximum 0.10%) 125°C, ≤10⁻⁶ torr 0.00
Water Vapor Regain (%) NASA SP-R-0022A 125°C, ≤10⁻⁶ torr 0.00
Visible Condensate (±) NASA SP-R-0022A 125°C, ≤10⁻⁶ torr NO
Flammability UL 94 Vertical Burn; IPC TM-650 2.3.10 C48/23/50, E24/125 Meets requirements of UL94-V0

 

CuClad 250 PCB Substrate Copper Clad Laminate Sheet 1

products
PRODUCTS DETAILS
CuClad 250 PCB Substrate Copper Clad Laminate Sheet
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
CuClad 250
Laminate Thickness:
0.254mm 0.508mm 0.787mm 1.575mm
Laminate Size:
18''X12''(457X305)18''X 24''(475 X 610mm)
Copper Weight:
0.5OZ(0.018MM), 1OZ(0.035mm);
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

CuClad 250 PCB substrate sheet

,

copper clad laminate PCB material

,

PCB substrate with copper layer

Product Description

CuClad 250 laminates are woven fiberglass-reinforced PTFE composite materials engineered for deployment as high-performance printed circuit board (PCB) substrates. Through precise calibration of the fiberglass-to-PTFE ratio, CuClad 250 offers a versatile product portfolio—encompassing grades with ultra-low dielectric constant (Er) and loss tangent, to highly reinforced variants optimized for enhanced dimensional stability.


The woven fiberglass reinforcement integral to all CuClad series materials delivers superior dimensional stability compared to nonwoven fiberglass-reinforced PTFE laminates of equivalent dielectric constant. Rogers’ stringent process control and consistency for PTFE-coated fiberglass cloth enable a broader spectrum of available Er values, while also producing laminates with improved dielectric constant uniformity over comparable nonwoven fiberglass-reinforced alternatives. These key performance attributes position CuClad laminates as a high-value solution for RF filters, couplers and low-noise amplifiers (LNAs).


A defining feature of CuClad laminates is their cross-plied architecture: alternating layers of PTFE-coated fiberglass plies are oriented at 90° to one another. This proprietary design delivers true electrical and mechanical isotropy in the XY plane—a unique performance characteristic exclusive to CuClad laminates, unmatched by any other woven or nonwoven fiberglass-reinforced PTFE laminate on the market. This exceptional level of isotropy has been validated by designers as critical for demanding phased array antenna applications.


With a dielectric constant (Er) range of 2.40–2.60, CuClad 250 utilizes a higher fiberglass-to-PTFE ratio to achieve mechanical performance that approaches that of conventional PCB substrates. Additional core benefits include enhanced dimensional stability and reduced thermal expansion across all axes. For high-criticality performance applications, CuClad products may be specified with the LX testing grade—this designation ensures individual testing of each sheet, with a formal test report included with the order. LX-grade products carry a premium price point, as a section of each sheet is used for destructive testing to validate performance.

 

CuClad 250 PCB Substrate Copper Clad Laminate Sheet 0


Features & Benefits

  • Cross-plied woven fiberglass architecture with alternating plies oriented at 90°
  • High PTFE-to-glass ratio
  • Superior dielectric constant uniformity vs. comparable nonwoven fiberglass-reinforced laminates
  • True electrical and mechanical isotropy in the XY plane
  • Ultra-low signal loss
  • Ideal for dielectric constant (Er)-sensitive circuit designs


Typical Applications

  • Military electronics systems (radars, electronic countermeasures [ECM], electronic support measures [ESM])
  • Microwave components (low-noise amplifiers [LNAs], filters, couplers, etc.)

 

Properties Test Method Condition CuClad 250
Dielectric Constant @10 GHz IPC TM-650 2.5.5.5 C23/50 2.40 to 2.55
Dielectric Constant @1MHz IPC TM-650 2.5.5.3 C23/50 2.40 to 2.60
Dissipation Factor @10 GHz IPC TM-650 2.5.5.5 C23/50 0.0017
Thermal Coefficient of Er (ppm/°C) IPC TM-650 2.5.5.5 (Adapted) -10°C to +140°C -153
Peel Strength (lbs.per inch) IPC TM-650 2.4.8 After Thermal Stress 14
Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 8.0 x 10⁹
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 1.5 x 10⁸
Arc Resistance (seconds) ASTM D-495 D48/50 >180
Tensile Modulus (kpsi) ASTM D-638 A, 23°C 725, 572
Tensile Strength (kpsi) ASTM D-882 A, 23°C 26.0, 20.5
Compressive Modulus (kpsi) ASTM D-695 A, 23°C 342
Flexural Modulus (kpsi) ASTM D-790 A, 23°C 456
Dielectric Breakdown (kV) ASTM D-149 D48/50 >45
Specific Gravity (g/cm³) ASTM D-792 (Method A) A, 23°C 2.31
Water Absorption (%) MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2 E1/105 + D24/23 0.03
Coefficient of Thermal Expansion (ppm/°C) IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer 0°C to 100°C X Axis: 18
Y Axis: 28 Y Axis: 24 Y Axis: 19  
Z Axis: 246 Z Axis: 194 Z Axis: 177  
Thermal Conductivity (W/mK) ASTM E-1225 100°C 0.25
Outgassing Requirements 125°C, ≤10⁻⁶ torr; NASA SP-R-0022A -  
Total Mass Loss (%) NASA SP-R-0022A (Maximum 1.00%) 125°C, ≤10⁻⁶ torr 0.01
Collected Volatile Condensable Material (%) NASA SP-R-0022A (Maximum 0.10%) 125°C, ≤10⁻⁶ torr 0.00
Water Vapor Regain (%) NASA SP-R-0022A 125°C, ≤10⁻⁶ torr 0.00
Visible Condensate (±) NASA SP-R-0022A 125°C, ≤10⁻⁶ torr NO
Flammability UL 94 Vertical Burn; IPC TM-650 2.3.10 C48/23/50, E24/125 Meets requirements of UL94-V0

 

CuClad 250 PCB Substrate Copper Clad Laminate Sheet 1

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