| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
CuClad 250 laminates are woven fiberglass-reinforced PTFE composite materials engineered for deployment as high-performance printed circuit board (PCB) substrates. Through precise calibration of the fiberglass-to-PTFE ratio, CuClad 250 offers a versatile product portfolio—encompassing grades with ultra-low dielectric constant (Er) and loss tangent, to highly reinforced variants optimized for enhanced dimensional stability.
The woven fiberglass reinforcement integral to all CuClad series materials delivers superior dimensional stability compared to nonwoven fiberglass-reinforced PTFE laminates of equivalent dielectric constant. Rogers’ stringent process control and consistency for PTFE-coated fiberglass cloth enable a broader spectrum of available Er values, while also producing laminates with improved dielectric constant uniformity over comparable nonwoven fiberglass-reinforced alternatives. These key performance attributes position CuClad laminates as a high-value solution for RF filters, couplers and low-noise amplifiers (LNAs).
A defining feature of CuClad laminates is their cross-plied architecture: alternating layers of PTFE-coated fiberglass plies are oriented at 90° to one another. This proprietary design delivers true electrical and mechanical isotropy in the XY plane—a unique performance characteristic exclusive to CuClad laminates, unmatched by any other woven or nonwoven fiberglass-reinforced PTFE laminate on the market. This exceptional level of isotropy has been validated by designers as critical for demanding phased array antenna applications.
With a dielectric constant (Er) range of 2.40–2.60, CuClad 250 utilizes a higher fiberglass-to-PTFE ratio to achieve mechanical performance that approaches that of conventional PCB substrates. Additional core benefits include enhanced dimensional stability and reduced thermal expansion across all axes. For high-criticality performance applications, CuClad products may be specified with the LX testing grade—this designation ensures individual testing of each sheet, with a formal test report included with the order. LX-grade products carry a premium price point, as a section of each sheet is used for destructive testing to validate performance.
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Features & Benefits
Typical Applications
| Properties | Test Method | Condition | CuClad 250 |
| Dielectric Constant @10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 2.40 to 2.55 |
| Dielectric Constant @1MHz | IPC TM-650 2.5.5.3 | C23/50 | 2.40 to 2.60 |
| Dissipation Factor @10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 0.0017 |
| Thermal Coefficient of Er (ppm/°C) | IPC TM-650 2.5.5.5 (Adapted) | -10°C to +140°C | -153 |
| Peel Strength (lbs.per inch) | IPC TM-650 2.4.8 | After Thermal Stress | 14 |
| Volume Resistivity (MΩ-cm) | IPC TM-650 2.5.17.1 | C96/35/90 | 8.0 x 10⁹ |
| Surface Resistivity (MΩ) | IPC TM-650 2.5.17.1 | C96/35/90 | 1.5 x 10⁸ |
| Arc Resistance (seconds) | ASTM D-495 | D48/50 | >180 |
| Tensile Modulus (kpsi) | ASTM D-638 | A, 23°C | 725, 572 |
| Tensile Strength (kpsi) | ASTM D-882 | A, 23°C | 26.0, 20.5 |
| Compressive Modulus (kpsi) | ASTM D-695 | A, 23°C | 342 |
| Flexural Modulus (kpsi) | ASTM D-790 | A, 23°C | 456 |
| Dielectric Breakdown (kV) | ASTM D-149 | D48/50 | >45 |
| Specific Gravity (g/cm³) | ASTM D-792 (Method A) | A, 23°C | 2.31 |
| Water Absorption (%) | MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2 | E1/105 + D24/23 | 0.03 |
| Coefficient of Thermal Expansion (ppm/°C) | IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer | 0°C to 100°C | X Axis: 18 |
| Y Axis: 28 | Y Axis: 24 | Y Axis: 19 | |
| Z Axis: 246 | Z Axis: 194 | Z Axis: 177 | |
| Thermal Conductivity (W/mK) | ASTM E-1225 | 100°C | 0.25 |
| Outgassing Requirements | 125°C, ≤10⁻⁶ torr; NASA SP-R-0022A | - | |
| Total Mass Loss (%) | NASA SP-R-0022A (Maximum 1.00%) | 125°C, ≤10⁻⁶ torr | 0.01 |
| Collected Volatile Condensable Material (%) | NASA SP-R-0022A (Maximum 0.10%) | 125°C, ≤10⁻⁶ torr | 0.00 |
| Water Vapor Regain (%) | NASA SP-R-0022A | 125°C, ≤10⁻⁶ torr | 0.00 |
| Visible Condensate (±) | NASA SP-R-0022A | 125°C, ≤10⁻⁶ torr | NO |
| Flammability | UL 94 Vertical Burn; IPC TM-650 2.3.10 | C48/23/50, E24/125 | Meets requirements of UL94-V0 |
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| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
CuClad 250 laminates are woven fiberglass-reinforced PTFE composite materials engineered for deployment as high-performance printed circuit board (PCB) substrates. Through precise calibration of the fiberglass-to-PTFE ratio, CuClad 250 offers a versatile product portfolio—encompassing grades with ultra-low dielectric constant (Er) and loss tangent, to highly reinforced variants optimized for enhanced dimensional stability.
The woven fiberglass reinforcement integral to all CuClad series materials delivers superior dimensional stability compared to nonwoven fiberglass-reinforced PTFE laminates of equivalent dielectric constant. Rogers’ stringent process control and consistency for PTFE-coated fiberglass cloth enable a broader spectrum of available Er values, while also producing laminates with improved dielectric constant uniformity over comparable nonwoven fiberglass-reinforced alternatives. These key performance attributes position CuClad laminates as a high-value solution for RF filters, couplers and low-noise amplifiers (LNAs).
A defining feature of CuClad laminates is their cross-plied architecture: alternating layers of PTFE-coated fiberglass plies are oriented at 90° to one another. This proprietary design delivers true electrical and mechanical isotropy in the XY plane—a unique performance characteristic exclusive to CuClad laminates, unmatched by any other woven or nonwoven fiberglass-reinforced PTFE laminate on the market. This exceptional level of isotropy has been validated by designers as critical for demanding phased array antenna applications.
With a dielectric constant (Er) range of 2.40–2.60, CuClad 250 utilizes a higher fiberglass-to-PTFE ratio to achieve mechanical performance that approaches that of conventional PCB substrates. Additional core benefits include enhanced dimensional stability and reduced thermal expansion across all axes. For high-criticality performance applications, CuClad products may be specified with the LX testing grade—this designation ensures individual testing of each sheet, with a formal test report included with the order. LX-grade products carry a premium price point, as a section of each sheet is used for destructive testing to validate performance.
![]()
Features & Benefits
Typical Applications
| Properties | Test Method | Condition | CuClad 250 |
| Dielectric Constant @10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 2.40 to 2.55 |
| Dielectric Constant @1MHz | IPC TM-650 2.5.5.3 | C23/50 | 2.40 to 2.60 |
| Dissipation Factor @10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 0.0017 |
| Thermal Coefficient of Er (ppm/°C) | IPC TM-650 2.5.5.5 (Adapted) | -10°C to +140°C | -153 |
| Peel Strength (lbs.per inch) | IPC TM-650 2.4.8 | After Thermal Stress | 14 |
| Volume Resistivity (MΩ-cm) | IPC TM-650 2.5.17.1 | C96/35/90 | 8.0 x 10⁹ |
| Surface Resistivity (MΩ) | IPC TM-650 2.5.17.1 | C96/35/90 | 1.5 x 10⁸ |
| Arc Resistance (seconds) | ASTM D-495 | D48/50 | >180 |
| Tensile Modulus (kpsi) | ASTM D-638 | A, 23°C | 725, 572 |
| Tensile Strength (kpsi) | ASTM D-882 | A, 23°C | 26.0, 20.5 |
| Compressive Modulus (kpsi) | ASTM D-695 | A, 23°C | 342 |
| Flexural Modulus (kpsi) | ASTM D-790 | A, 23°C | 456 |
| Dielectric Breakdown (kV) | ASTM D-149 | D48/50 | >45 |
| Specific Gravity (g/cm³) | ASTM D-792 (Method A) | A, 23°C | 2.31 |
| Water Absorption (%) | MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2 | E1/105 + D24/23 | 0.03 |
| Coefficient of Thermal Expansion (ppm/°C) | IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer | 0°C to 100°C | X Axis: 18 |
| Y Axis: 28 | Y Axis: 24 | Y Axis: 19 | |
| Z Axis: 246 | Z Axis: 194 | Z Axis: 177 | |
| Thermal Conductivity (W/mK) | ASTM E-1225 | 100°C | 0.25 |
| Outgassing Requirements | 125°C, ≤10⁻⁶ torr; NASA SP-R-0022A | - | |
| Total Mass Loss (%) | NASA SP-R-0022A (Maximum 1.00%) | 125°C, ≤10⁻⁶ torr | 0.01 |
| Collected Volatile Condensable Material (%) | NASA SP-R-0022A (Maximum 0.10%) | 125°C, ≤10⁻⁶ torr | 0.00 |
| Water Vapor Regain (%) | NASA SP-R-0022A | 125°C, ≤10⁻⁶ torr | 0.00 |
| Visible Condensate (±) | NASA SP-R-0022A | 125°C, ≤10⁻⁶ torr | NO |
| Flammability | UL 94 Vertical Burn; IPC TM-650 2.3.10 | C48/23/50, E24/125 | Meets requirements of UL94-V0 |
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