PRODUCTS DETAILS

Home > Products >

DiClad 527 PCB Substrate Copper Clad Laminate Sheet

Products

Copper Clad Laminates

Ms. Ivy Deng

sales10@bichengpcb.com

86-755-27374847

Contact Now

DiClad 527 PCB Substrate Copper Clad Laminate Sheet

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-332.V1.0

Part Number:

DiClad 527

Laminate Thickness:

0.508mm 0.762mm 1.524mm

Laminate Size:

12''X18''(305X457mm) 18''X12''(457X305)18''X 24''(475 X 610mm)24''X18''(610X457mm)

Copper Weight:

0.5OZ(0.018MM), 1OZ（0.035mm);

Highlight:

DiClad 527 PCB copper laminate

copper clad laminate sheet

PCB substrate laminate with warranty

Product Description

DiClad 527 laminates are woven fiberglass-reinforced PTFE composite materials engineered for use as high-performance printed circuit board (PCB) substrates. Through precise calibration of the fiberglass-to-PTFE ratio, DiClad 527 offers a versatile product range—spanning variants with ultra-low dielectric constant (Dk) and dissipation factor (Df), to highly reinforced grades optimized for enhanced dimensional stability.

The woven fiberglass reinforcement core to all DiClad series materials delivers superior dimensional stability when compared to nonwoven fiberglass-reinforced PTFE laminates of equivalent dielectric constant. Rogers’ stringent process control and consistency for PTFE-coated fiberglass cloth enable a broader spectrum of available Dk values, while also producing laminates with improved dielectric constant uniformity over comparable nonwoven fiberglass-reinforced alternatives. DiClad materials feature unidirectionally aligned coated fiberglass plies; cross-plied configurations of most grades are available under the CuClad product line.

DiClad 527 laminates are ideally suited for applications where dielectric constant uniformity is a critical performance parameter, including RF filters, couplers, and low-noise amplifiers (LNAs). They are also a high-value choice for power dividers and combiners, where minimal signal loss is paramount. With a dielectric constant (Er) range of 2.40–2.65, DiClad 527 utilizes a higher fiberglass-to-PTFE ratio to achieve mechanical performance that approaches conventional PCB substrates—alongside additional advantages of enhanced dimensional stability and reduced thermal expansion across all axes. The electrical properties of DiClad 527 laminates are validated through rigorous testing at 1 MHz and 10 GHz, respectively.

DiClad 527 PCB Substrate Copper Clad Laminate Sheet 0

Features & Benefits

Ultra-low loss tangent
Exceptional dimensional stability
Consistent product performance
Highly uniform electrical properties across the operating frequency range
Reliable, repeatable mechanical performance
Superior chemical resistance

Typical Applications

Military radar feed networks
Commercial phased array antenna networks
Low-loss base station antennas
Missile guidance systems
Digital radio antennas
RF filters, couplers, and low-noise amplifiers (LNAs)

Properties	DiClad 527	Units	Test Conditions	Test Method
Electrical Properties	-	-	-	-
Dielectric Constant (10 GHz)	2.40-2.60	-	23˚C @ 50% RH 10 GHz	IPC TM-650 [2.5.5.5](2.5.5.5)
Dielectric Constant (1 MHz)	2.40-2.60	-	23˚C @ 50% RH 1 MHz	IPC TM-650 [2.5.5.3](2.5.5.3)
Dissipation Factor (10 GHz)	0.0017	-	23˚C @ 50% RH 10 GHz	IPC TM-650 [2.5.5.5](2.5.5.5)
Dissipation Factor (1 MHz)	0.0010	-	23˚C @ 50% RH 1 MHz	IPC TM-650 [2.5.5.3](2.5.5.3)
Thermal Coefficient of Dielectric Constant	-153	ppm/˚C	-10 to 140˚C 10 GHz	IPC TM-650 [2.5.5.5](2.5.5.5)
Volume Resistivity	1.2 x 10⁹	MΩ-cm	C96/35/90	IPC TM-650 [2.5.17.1](2.5.17.1)
Surface Resistivity	4.5 x 10⁷	MΩ	C96/35/90	IPC TM-650 [2.5.17.1](2.5.17.1)
Dielectric Breakdown	>45	kV	D48/50	ASTM D-149
Arc Resistance	>180	-	-	ASTM D-495
Thermal Properties	-	-	-	-
Coefficient of Thermal Expansion - x	14	ppm/˚C	-50˚C to 150˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y	21	ppm/˚C	-50˚C to 150˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z	173	ppm/˚C	-50˚C to 150˚C	IPC TM-650 2.4.24
Thermal Conductivity	0.26	W/(m.K)	-	ASTM E1461
Mechanical Properties	-	-	-	-
Copper Peel Strength	14	Lbs/in	10s @288˚C 35 μm foil	IPC TM-650 2.4.8
Young’s Modulus	517, 706	kpsi	23˚C @ 50% RH	ASTM D-638
Tensile Strength (MD, CMD)	19.0, 15.0	kpsi	23˚C @ 50% RH	ASTM D-882
Compressive Modulus	359	kpsi	23˚C @ 50% RH	ASTM D-695
Flex Modulus	537	kpsi	23˚C @ 50% RH	ASTM D-3039
Physical Properties	-	-	-	-
Flammability	V-0	-	C48/23/50 & C168/70	UL 94
Moisture Absorption	0.03	%	E1/105+D24/23	IPC TM-650 [2.6.2.2](2.6.2.2)
Density	2.31	g/cm³	C24/23/50 Method A	ASTM D792
NASA Outgassing	-	-	-	-
Total Mass Lost	0.02	%	125°C, ≤ 10⁻⁶ torr	NASA SP-R-0022A
Collected Volatiles	0.00	%	125°C, ≤ 10⁻⁶ torr	NASA SP-R-0022A
Water Vapor Recovered	0.01	%	125°C, ≤ 10⁻⁶ torr	NASA SP-R-0022A

DiClad 527 PCB Substrate Copper Clad Laminate Sheet 1

Tags:

Products

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Detail Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-332.V1.0

Part Number:

DiClad 527

Laminate Thickness:

0.508mm 0.762mm 1.524mm

Laminate Size:

12''X18''(305X457mm) 18''X12''(457X305)18''X 24''(475 X 610mm)24''X18''(610X457mm)

Copper Weight:

0.5OZ(0.018MM), 1OZ（0.035mm);

Minimum Order Quantity:

1PCS

Price:

USD9.99-99.99

Packaging Details:

Vacuum bags+Cartons

Delivery Time:

8-9 working days

Payment Terms:

T/T

Supply Ability:

5000PCS per month

Highlight

DiClad 527 PCB copper laminate

copper clad laminate sheet

PCB substrate laminate with warranty

Product Description

DiClad 527 PCB Substrate Copper Clad Laminate Sheet 0

Features & Benefits

Ultra-low loss tangent
Exceptional dimensional stability
Consistent product performance
Highly uniform electrical properties across the operating frequency range
Reliable, repeatable mechanical performance
Superior chemical resistance

Typical Applications

Military radar feed networks
Commercial phased array antenna networks
Low-loss base station antennas
Missile guidance systems
Digital radio antennas
RF filters, couplers, and low-noise amplifiers (LNAs)

Properties	DiClad 527	Units	Test Conditions	Test Method
Electrical Properties	-	-	-	-
Dielectric Constant (10 GHz)	2.40-2.60	-	23˚C @ 50% RH 10 GHz	IPC TM-650 [2.5.5.5](2.5.5.5)
Dielectric Constant (1 MHz)	2.40-2.60	-	23˚C @ 50% RH 1 MHz	IPC TM-650 [2.5.5.3](2.5.5.3)
Dissipation Factor (10 GHz)	0.0017	-	23˚C @ 50% RH 10 GHz	IPC TM-650 [2.5.5.5](2.5.5.5)
Dissipation Factor (1 MHz)	0.0010	-	23˚C @ 50% RH 1 MHz	IPC TM-650 [2.5.5.3](2.5.5.3)
Thermal Coefficient of Dielectric Constant	-153	ppm/˚C	-10 to 140˚C 10 GHz	IPC TM-650 [2.5.5.5](2.5.5.5)
Volume Resistivity	1.2 x 10⁹	MΩ-cm	C96/35/90	IPC TM-650 [2.5.17.1](2.5.17.1)
Surface Resistivity	4.5 x 10⁷	MΩ	C96/35/90	IPC TM-650 [2.5.17.1](2.5.17.1)
Dielectric Breakdown	>45	kV	D48/50	ASTM D-149
Arc Resistance	>180	-	-	ASTM D-495
Thermal Properties	-	-	-	-
Coefficient of Thermal Expansion - x	14	ppm/˚C	-50˚C to 150˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y	21	ppm/˚C	-50˚C to 150˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z	173	ppm/˚C	-50˚C to 150˚C	IPC TM-650 2.4.24
Thermal Conductivity	0.26	W/(m.K)	-	ASTM E1461
Mechanical Properties	-	-	-	-
Copper Peel Strength	14	Lbs/in	10s @288˚C 35 μm foil	IPC TM-650 2.4.8
Young’s Modulus	517, 706	kpsi	23˚C @ 50% RH	ASTM D-638
Tensile Strength (MD, CMD)	19.0, 15.0	kpsi	23˚C @ 50% RH	ASTM D-882
Compressive Modulus	359	kpsi	23˚C @ 50% RH	ASTM D-695
Flex Modulus	537	kpsi	23˚C @ 50% RH	ASTM D-3039
Physical Properties	-	-	-	-
Flammability	V-0	-	C48/23/50 & C168/70	UL 94
Moisture Absorption	0.03	%	E1/105+D24/23	IPC TM-650 [2.6.2.2](2.6.2.2)
Density	2.31	g/cm³	C24/23/50 Method A	ASTM D792
NASA Outgassing	-	-	-	-
Total Mass Lost	0.02	%	125°C, ≤ 10⁻⁶ torr	NASA SP-R-0022A
Collected Volatiles	0.00	%	125°C, ≤ 10⁻⁶ torr	NASA SP-R-0022A
Water Vapor Recovered	0.01	%	125°C, ≤ 10⁻⁶ torr	NASA SP-R-0022A

DiClad 527 PCB Substrate Copper Clad Laminate Sheet 1

Tags:

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Copper Clad Laminates

DiClad 527 PCB Substrate Copper Clad Laminate Sheet

DiClad 527 PCB copper laminate

copper clad laminate sheet

PCB substrate laminate with warranty

0.1mm Copper Clad Laminate,

BME217 Copper Clad Laminate,

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Copper Clad Laminates

DiClad 527 PCB copper laminate

copper clad laminate sheet

PCB substrate laminate with warranty

0.1mm Copper Clad Laminate,

BME217 Copper Clad Laminate,