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CLTE-MW PCB 2-Layer 2.99mil Substrate Low-Loss Solution

CLTE-MW PCB 2-Layer 2.99mil Substrate Low-Loss Solution

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
PCB Material:
CLTE-MW
Layer Count:
2-layer
PCB Thickness:
0.15mm
PCB Size:
76.4mm X 95mm (1PCS)
Solder Mask:
No
Silkscreen:
Black
Copper Weight:
1oz (1.4 Mils) On Outer Layers (35μm)
Surface Finish:
Immersion Gold
Highlight:

F4BME233 copper clad laminate sheet

,

PCB substrate copper laminate

,

copper clad laminate with warranty

Product Description

In search of a high-performance 2-layer rigid PCB tailored for 5G and millimeter wave uses? This 2-layer rigid PCB is constructed with CLTE-MW copper clad laminates—a high-performance, cost-efficient material reinforced with spread glass and high filler content—crafted to meet the needs of applications with thickness restrictions while preserving exceptional signal integrity. Compliant with IPC-Class 2 quality standards, this PCB delivers dependable performance for critical uses such as commercial communications, military/aerospace equipment, and satellite communication systems. Focused on precision, low-loss performance, and cost-effectiveness, it is the perfect choice for engineers and procurement teams seeking a reliable substrate for high-frequency, thickness-constrained projects.

 

PCB Specifications

Construction Item Details
Board Dimensions 76.4mm x 95mm (1PCS), featuring a tight tolerance of +/- 0.15mm to ensure a precise fit in your assemblies
Trace & Space Minimum 6/7 mils, allowing for compact circuit design without sacrificing signal integrity
Minimum Hole Size 0.25mm, compatible with standard component mounting requirements for precision-focused applications
Vias No blind vias, streamlining the manufacturing process while ensuring secure interlayer connections
Finished Board Thickness 0.15mm, perfect for applications subject to physical or electrical thickness limitations
Copper Weight 1oz (1.4 mils) on outer layers (35μm), delivering excellent conductivity for high-frequency signals
Via Plating Thickness 20μm, meeting IPC-Class 2 standards to ensure reliable electrical connections and mechanical durability
Surface Finish Immersion Gold, providing superior solderability, corrosion resistance, and compatibility with modern assembly techniques for high-reliability applications
Silkscreen & Solder Mask Black top silkscreen (no bottom silkscreen); no top or bottom solder mask, ensuring a clean design optimized for high-frequency signal performance
Quality Testing 100% electrical testing conducted before shipment, guaranteeing functionality and eliminating defective units

 

PCB Stack-up Configuration

Stackup Component Specifications & Description
Copper Layer 1 35μm – Ensures efficient signal transmission and thermal conductivity for high-frequency applications
CLTE-MW Core 0.076mm (2.99mil) – The foundation of the PCB’s outstanding low-loss performance, ideal for thickness-constrained projects
Copper Layer 2 35μm – Delivers consistent conductivity and symmetry for balanced signal flow in high-frequency circuits

 

CLTE-MW PCB 2-Layer 2.99mil Substrate Low-Loss Solution 0

 

Quality & Availability

Quality Standard: IPC-Class 2 – Meets the industry’s most common quality requirements for dedicated service electronic products, ensuring reliable performance and an extended service life.

 

Availability: Worldwide – We offer global shipping to meet the needs of engineers and manufacturers around the world, with industry-acceptable delivery times.

 

CLTE-MW Substrate: The Key to Exceptional Performance

CLTE-MW copper clad laminates form the backbone of our PCB’s superior performance, engineered to meet the demands of 5G, millimeter wave, and thickness-constrained high-frequency applications:

 

CLTE-MW laminates provide PCB designers with a high-performance, cost-effective material that is well-suited for applications limited by physical or electrical thickness constraints. This unique laminate system comes in seven thickness options, ranging from 3 to 10 mils, ensuring optimal signal-to-ground spacing for 5G and other millimeter wave applications. Reinforced with spread glass and high filler loading, CLTE-MW laminates help reduce the impact of high-frequency glass weave on electromagnetic wave propagation. As a ceramic-filled PTFE composite, CLTE-MW is specifically developed for the 24GHz to 77+GHz frequency range, delivering low-loss performance without the high cost of premium alternatives.

 

Engineered for cost-effectiveness and versatility, CLTE-MW addresses the critical need for low-loss, thin-substrate solutions in modern high-frequency electronics. Its spread glass reinforcement and high filler loading not only reduce signal distortion but also enhance mechanical stability, making it ideal for demanding environments such as military and aerospace applications.

 

Key Features of the CLTE-MW PCB

Our CLTE-MW 2-layer PCB offers industry-leading features that distinguish it for 5G, millimeter wave, and thickness-constrained applications:

 

Low Loss Tangent: 0.0015 at 10GHz – Reduces signal loss to ensure reliable high-frequency and millimeter wave performance, on par with premium PTFE materials

 

Low Z-axis CTE: 30ppm/°C – Ensures excellent plated through hole (PTH) reliability and dimensional stability across temperature fluctuations

 

Thermal Conductivity: 0.42 W/(mK) – Improves heat dissipation in demanding designs, preventing overheating in high-power applications

 

Flammability Rating: UL94 V-0 – Meets strict safety standards for electronic devices used in commercial, military, and aerospace applications

 

Benefits of Choosing the CLTE-MW PCB

Our PCB provides tangible advantages for engineers, manufacturers, and procurement teams working on high-frequency, thickness-constrained projects:

 

Enables Low Loss Designs – Reduces signal distortion, ensuring reliable performance in 5G and millimeter wave applications

 

Excellent Plated Through Hole (PTH) Reliability – Lowers the risk of connection failure, which is critical for high-reliability applications like military and aerospace

 

Good Heat Dissipation – Supports demanding designs by efficiently dissipating heat, extending the service life of electronic components

 

Compatible with Commercial Applications – Offers a cost-effective solution without compromising performance for commercial communications and avionics

 

Reliable Mechanical Performance – Maintains stability in thermally challenging environments, making it ideal for harsh operating conditions

 

Applications

Our CLTE-MW 2-layer PCB is specifically designed for high-frequency, high-reliability, and thickness-constrained applications, including:

 

  • Commercial Communications and Avionics
  • Military/ Aerospace Applications
  • Microwave Feed Networks
  • Phase Sensitive Electronic Structures
  • Satellite Communication Systems
  • Passive Components (couplers, filters & baluns)

CLTE-MW PCB 2-Layer 2.99mil Substrate Low-Loss Solution 1

 

Products
PRODUCTS DETAILS
CLTE-MW PCB 2-Layer 2.99mil Substrate Low-Loss Solution
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
PCB Material:
CLTE-MW
Layer Count:
2-layer
PCB Thickness:
0.15mm
PCB Size:
76.4mm X 95mm (1PCS)
Solder Mask:
No
Silkscreen:
Black
Copper Weight:
1oz (1.4 Mils) On Outer Layers (35μm)
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

F4BME233 copper clad laminate sheet

,

PCB substrate copper laminate

,

copper clad laminate with warranty

Product Description

In search of a high-performance 2-layer rigid PCB tailored for 5G and millimeter wave uses? This 2-layer rigid PCB is constructed with CLTE-MW copper clad laminates—a high-performance, cost-efficient material reinforced with spread glass and high filler content—crafted to meet the needs of applications with thickness restrictions while preserving exceptional signal integrity. Compliant with IPC-Class 2 quality standards, this PCB delivers dependable performance for critical uses such as commercial communications, military/aerospace equipment, and satellite communication systems. Focused on precision, low-loss performance, and cost-effectiveness, it is the perfect choice for engineers and procurement teams seeking a reliable substrate for high-frequency, thickness-constrained projects.

 

PCB Specifications

Construction Item Details
Board Dimensions 76.4mm x 95mm (1PCS), featuring a tight tolerance of +/- 0.15mm to ensure a precise fit in your assemblies
Trace & Space Minimum 6/7 mils, allowing for compact circuit design without sacrificing signal integrity
Minimum Hole Size 0.25mm, compatible with standard component mounting requirements for precision-focused applications
Vias No blind vias, streamlining the manufacturing process while ensuring secure interlayer connections
Finished Board Thickness 0.15mm, perfect for applications subject to physical or electrical thickness limitations
Copper Weight 1oz (1.4 mils) on outer layers (35μm), delivering excellent conductivity for high-frequency signals
Via Plating Thickness 20μm, meeting IPC-Class 2 standards to ensure reliable electrical connections and mechanical durability
Surface Finish Immersion Gold, providing superior solderability, corrosion resistance, and compatibility with modern assembly techniques for high-reliability applications
Silkscreen & Solder Mask Black top silkscreen (no bottom silkscreen); no top or bottom solder mask, ensuring a clean design optimized for high-frequency signal performance
Quality Testing 100% electrical testing conducted before shipment, guaranteeing functionality and eliminating defective units

 

PCB Stack-up Configuration

Stackup Component Specifications & Description
Copper Layer 1 35μm – Ensures efficient signal transmission and thermal conductivity for high-frequency applications
CLTE-MW Core 0.076mm (2.99mil) – The foundation of the PCB’s outstanding low-loss performance, ideal for thickness-constrained projects
Copper Layer 2 35μm – Delivers consistent conductivity and symmetry for balanced signal flow in high-frequency circuits

 

CLTE-MW PCB 2-Layer 2.99mil Substrate Low-Loss Solution 0

 

Quality & Availability

Quality Standard: IPC-Class 2 – Meets the industry’s most common quality requirements for dedicated service electronic products, ensuring reliable performance and an extended service life.

 

Availability: Worldwide – We offer global shipping to meet the needs of engineers and manufacturers around the world, with industry-acceptable delivery times.

 

CLTE-MW Substrate: The Key to Exceptional Performance

CLTE-MW copper clad laminates form the backbone of our PCB’s superior performance, engineered to meet the demands of 5G, millimeter wave, and thickness-constrained high-frequency applications:

 

CLTE-MW laminates provide PCB designers with a high-performance, cost-effective material that is well-suited for applications limited by physical or electrical thickness constraints. This unique laminate system comes in seven thickness options, ranging from 3 to 10 mils, ensuring optimal signal-to-ground spacing for 5G and other millimeter wave applications. Reinforced with spread glass and high filler loading, CLTE-MW laminates help reduce the impact of high-frequency glass weave on electromagnetic wave propagation. As a ceramic-filled PTFE composite, CLTE-MW is specifically developed for the 24GHz to 77+GHz frequency range, delivering low-loss performance without the high cost of premium alternatives.

 

Engineered for cost-effectiveness and versatility, CLTE-MW addresses the critical need for low-loss, thin-substrate solutions in modern high-frequency electronics. Its spread glass reinforcement and high filler loading not only reduce signal distortion but also enhance mechanical stability, making it ideal for demanding environments such as military and aerospace applications.

 

Key Features of the CLTE-MW PCB

Our CLTE-MW 2-layer PCB offers industry-leading features that distinguish it for 5G, millimeter wave, and thickness-constrained applications:

 

Low Loss Tangent: 0.0015 at 10GHz – Reduces signal loss to ensure reliable high-frequency and millimeter wave performance, on par with premium PTFE materials

 

Low Z-axis CTE: 30ppm/°C – Ensures excellent plated through hole (PTH) reliability and dimensional stability across temperature fluctuations

 

Thermal Conductivity: 0.42 W/(mK) – Improves heat dissipation in demanding designs, preventing overheating in high-power applications

 

Flammability Rating: UL94 V-0 – Meets strict safety standards for electronic devices used in commercial, military, and aerospace applications

 

Benefits of Choosing the CLTE-MW PCB

Our PCB provides tangible advantages for engineers, manufacturers, and procurement teams working on high-frequency, thickness-constrained projects:

 

Enables Low Loss Designs – Reduces signal distortion, ensuring reliable performance in 5G and millimeter wave applications

 

Excellent Plated Through Hole (PTH) Reliability – Lowers the risk of connection failure, which is critical for high-reliability applications like military and aerospace

 

Good Heat Dissipation – Supports demanding designs by efficiently dissipating heat, extending the service life of electronic components

 

Compatible with Commercial Applications – Offers a cost-effective solution without compromising performance for commercial communications and avionics

 

Reliable Mechanical Performance – Maintains stability in thermally challenging environments, making it ideal for harsh operating conditions

 

Applications

Our CLTE-MW 2-layer PCB is specifically designed for high-frequency, high-reliability, and thickness-constrained applications, including:

 

  • Commercial Communications and Avionics
  • Military/ Aerospace Applications
  • Microwave Feed Networks
  • Phase Sensitive Electronic Structures
  • Satellite Communication Systems
  • Passive Components (couplers, filters & baluns)

CLTE-MW PCB 2-Layer 2.99mil Substrate Low-Loss Solution 1

 

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