F4BME233 PCB Substrate Copper Clad Laminate Sheet

F4BME233 is a composite material produced via a carefully engineered formulation and precise manufacturing process, using fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. Compared to standard F4B laminates, it exhibits improved electrical properties, including a broader dielectric constant range, lower dielectric loss, higher insulation resistance, and greater overall stability. This makes it a suitable alternative to similar international products.

This material is supplied with reverse-treated RTF copper foil, delivering excellent passive intermodulation (PIM) performance, superior etching control for precision circuitry, and reduced conductor loss.

The dielectric constant of F4BME233 is accurately controlled by adjusting the ratio of PTFE to fiberglass reinforcement. This balance ensures both low signal loss and enhanced dimensional stability. Higher dielectric constant variants incorporate a greater fiberglass content, resulting in improved dimensional stability, lower thermal expansion, better temperature-dependent performance, and a corresponding increase in dielectric loss.

Product Features

• Dielectric constant (Dk) range: 2.17–3.0, with custom Dk available
• Low loss performance
• Excellent PIM characteristics with RTF foil
• Multiple size options for material optimization and cost savings
• Resistant to radiation with low outgassing properties
• Commercially available in volume at a competitive price

Typical Applications

• Microwave, radio frequency, and radar systems
• Phase shifters and passive components
• Power dividers, couplers, and combiners
• Feed networks and phased array antennas
• Satellite communications and base station antennas