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IsoClad 933 PCB Substrate Copper Clad Laminate Sheet

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Copper Clad Laminates

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IsoClad 933 PCB Substrate Copper Clad Laminate Sheet

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-332.V1.0

Part Number:

IsoClad 933

Laminate Thickness:

0.381mm 0.787mm 1.575mm

Laminate Size:

305X460mm(12X18''); 24X18''(610X457mm)

Copper Weight:

0.5OZ(0.018MM), 1OZ（0.035mm);

Highlight:

IsoClad 933 PCB substrate

copper clad laminate sheet

PCB substrate with warranty

Product Description

IsoClad® 933 laminates are nonwoven fiberglass-reinforced PTFE composite materials tailored for deployment as printed circuit board (PCB) substrates. The nonwoven reinforcement architecture imparts enhanced flexural capability, making these laminates ideally suited for applications requiring post-fabrication circuit bending—conformal or “wrap-around” antennas represent a prime use case for this attribute.

Unlike standard nonwoven fiberglass/PTFE alternatives, IsoClad series laminates incorporate longer randomly oriented fibers and leverage a proprietary manufacturing process to deliver superior dimensional stability and enhanced dielectric constant (Dk) uniformity, even when compared to competitive products with equivalent dielectric constant values.

With a dielectric constant (Er) of 2.33, IsoClad 933 laminates utilize a higher fiberglass-to-PTFE ratio to form a highly reinforced composite structure. This optimized formulation achieves improved dimensional stability alongside elevated mechanical strength, without compromising core electrical performance.

IsoClad 933 PCB Substrate Copper Clad Laminate Sheet 0

Features

Nonwoven fiberglass reinforcement
Low dielectric constant (Er = 2.33)
Ultra-low signal loss

Benefits

Reduced rigidity versus woven fiberglass-reinforced laminates
Exceptional isotropy across the X, Y, and Z axes

Typical Applications

Conformal antennas
Stripline and microstrip circuits
Missile guidance systems
Radar and electronic warfare systems

Property	Test Method	Condition	IsoClad 933
Dielectric Constant @ 10 GHz	IPC TM-650 2.5.5.5	C23/50	2.33
Dissipation Factor @ 10 GHz	IPC TM-650 2.5.5.5	C23/50	0.0016
Thermal Coefficient of Er (ppm/°C)	IPC TM-650 2.5.5.5 (Adapted)	-10°C to +140°C	-132
Peel Strength (lbs.per inch)	IPC TM-650 2.4.8	After Thermal	10
Volume Resistivity (MΩ-cm)	IPC TM-650 2.5.17.1	C96/35/90	3.5 x 10⁸
Surface Resistivity (MΩ)	IPC TM-650 2.5.17.1	C96/35/90	1.0 x 10⁸
Arc Resistance (seconds)	ASTM D-495	D48/50	>180
Tensile Modulus (kpsi)	ASTM D-638	A, 23°C	173, 147
Tensile Strength (kpsi)	ASTM D-882	A, 23°C	6.8, 5.3
Compressive Modulus (kpsi)	ASTM D-695	A, 23°C	197
Flexural Modulus (kpsi)	ASTM D-790	A, 23°C	239
Dielectric Breakdown (kV)	ASTM D-149	D48/50	>45
Density (g/cm³)	ASTM D-792 (Method A)	A, 23°C	2.27
Water Absorption (%)	MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2	E1/105 + D24/23	0.05
Coefficient of Thermal Expansion (ppm/°C)	IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer	0°C to 100°C	X Axis: 31
Y Axis: 47	Y Axis: 35
Z Axis: 236	Z Axis: 203
Thermal Conductivity (W/mK)	ASTM E-1225	100°C	0.263
Outgassing Requirements	125°C, ≤10⁻⁶ torr	-
Total Mass Loss (%)	Maximum 1.00%	125°C, ≤10⁻⁶ torr	0.03
Collected Volatile Condensable Material (%)	Maximum 0.10%	125°C, ≤10⁻⁶ torr	0.00
Water Vapor Regain (%)	-	125°C, ≤10⁻⁶ torr	0.02
Visible Condensate	±	125°C, ≤10⁻⁶ torr	NO
Flammability	UL 94 Vertical Burn; IPC TM-650 2.3.10	C48/23/50, E24/125	Meets requirements of UL94-V0

IsoClad 933 PCB Substrate Copper Clad Laminate Sheet 1

Tags:

Products

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Detail Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-332.V1.0

Part Number:

IsoClad 933

Laminate Thickness:

0.381mm 0.787mm 1.575mm

Laminate Size:

305X460mm(12X18''); 24X18''(610X457mm)

Copper Weight:

0.5OZ(0.018MM), 1OZ（0.035mm);

Minimum Order Quantity:

1PCS

Price:

USD9.99-99.99

Packaging Details:

Vacuum bags+Cartons

Delivery Time:

8-9 working days

Payment Terms:

T/T

Supply Ability:

5000PCS per month

Highlight

IsoClad 933 PCB substrate

copper clad laminate sheet

PCB substrate with warranty

Product Description

IsoClad 933 PCB Substrate Copper Clad Laminate Sheet 0

Features

Nonwoven fiberglass reinforcement
Low dielectric constant (Er = 2.33)
Ultra-low signal loss

Benefits

Reduced rigidity versus woven fiberglass-reinforced laminates
Exceptional isotropy across the X, Y, and Z axes

Typical Applications

Conformal antennas
Stripline and microstrip circuits
Missile guidance systems
Radar and electronic warfare systems

Property	Test Method	Condition	IsoClad 933
Dielectric Constant @ 10 GHz	IPC TM-650 2.5.5.5	C23/50	2.33
Dissipation Factor @ 10 GHz	IPC TM-650 2.5.5.5	C23/50	0.0016
Thermal Coefficient of Er (ppm/°C)	IPC TM-650 2.5.5.5 (Adapted)	-10°C to +140°C	-132
Peel Strength (lbs.per inch)	IPC TM-650 2.4.8	After Thermal	10
Volume Resistivity (MΩ-cm)	IPC TM-650 2.5.17.1	C96/35/90	3.5 x 10⁸
Surface Resistivity (MΩ)	IPC TM-650 2.5.17.1	C96/35/90	1.0 x 10⁸
Arc Resistance (seconds)	ASTM D-495	D48/50	>180
Tensile Modulus (kpsi)	ASTM D-638	A, 23°C	173, 147
Tensile Strength (kpsi)	ASTM D-882	A, 23°C	6.8, 5.3
Compressive Modulus (kpsi)	ASTM D-695	A, 23°C	197
Flexural Modulus (kpsi)	ASTM D-790	A, 23°C	239
Dielectric Breakdown (kV)	ASTM D-149	D48/50	>45
Density (g/cm³)	ASTM D-792 (Method A)	A, 23°C	2.27
Water Absorption (%)	MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2	E1/105 + D24/23	0.05
Coefficient of Thermal Expansion (ppm/°C)	IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer	0°C to 100°C	X Axis: 31
Y Axis: 47	Y Axis: 35
Z Axis: 236	Z Axis: 203
Thermal Conductivity (W/mK)	ASTM E-1225	100°C	0.263
Outgassing Requirements	125°C, ≤10⁻⁶ torr	-
Total Mass Loss (%)	Maximum 1.00%	125°C, ≤10⁻⁶ torr	0.03
Collected Volatile Condensable Material (%)	Maximum 0.10%	125°C, ≤10⁻⁶ torr	0.00
Water Vapor Regain (%)	-	125°C, ≤10⁻⁶ torr	0.02
Visible Condensate	±	125°C, ≤10⁻⁶ torr	NO
Flammability	UL 94 Vertical Burn; IPC TM-650 2.3.10	C48/23/50, E24/125	Meets requirements of UL94-V0

IsoClad 933 PCB Substrate Copper Clad Laminate Sheet 1

Tags:

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Copper Clad Laminates

IsoClad 933 PCB Substrate Copper Clad Laminate Sheet

IsoClad 933 PCB substrate

copper clad laminate sheet

PCB substrate with warranty

0.1mm Copper Clad Laminate,

BME217 Copper Clad Laminate,

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Copper Clad Laminates

IsoClad 933 PCB substrate

copper clad laminate sheet

PCB substrate with warranty

0.1mm Copper Clad Laminate,

BME217 Copper Clad Laminate,