F4BME220 PCB Raw Material Copper Clad Laminate Sheet

F4BME220 is manufactured through precise processes using fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. It exhibits superior electrical properties compared to standard F4B, including a broader dielectric constant range, lower dielectric loss, higher insulation resistance, and enhanced stability, making it a viable alternative to comparable international products.

The dielectric layers of F4BM220 and F4BME220 are identical, but they employ different copper foils: F4BM220 uses ED copper foil and is intended for applications where PIM is not specified; F4BME220 utilizes reverse-treated RTF copper foil, delivering excellent PIM performance, more accurate circuit control, and reduced conductor loss.

Both F4BM220 and F4BME220 allow precise adjustment of the dielectric constant by modifying the ratio of PTFE to fiberglass cloth. This optimization achieves low signal loss while improving dimensional stability. A higher dielectric constant corresponds to a greater fiberglass content, resulting in better dimensional stability, a lower coefficient of thermal expansion, improved temperature drift characteristics, and a moderate increase in dielectric loss.

Product Features:

• Dielectric constant (Dk) options from 2.17 to 3.0, with customization available
• Low loss characteristics
• F4BME with RTF copper foil provides excellent PIM performance
• Variety of dimensions to reduce material waste and cost
• Radiation-resistant with low outgassing
• Commercially available in volume at a competitive price

Typical Applications:

• Microwave, RF, and radar systems
• Phase shifters and passive components
• Power dividers, couplers, and combiners
• Feed networks and phased array antennas
• Satellite communications and base station antennas