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| Material: | Rogers Core Kappa 438 | Layer Count: | 2-layer |
|---|---|---|---|
| PCB Size: | 91.17mm X 51.36mm=1PCS, +/- 0.15mm | PCB Thickness: | 1.1mm |
| Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Eelectroless Nickle And Immersion Gold (ENIG) |
| Highlight: | 2-Layer RF Circuit,438 PCB,40mil RF Circuit |
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The Kappa 438 PCB is engineered from Rogers' innovative glass-reinforced hydrocarbon ceramic system, delivering superior high-frequency performance while maintaining a cost-effective fabrication process. This low-loss material is compatible with standard epoxy/glass (FR-4) manufacturing techniques, making it an ideal choice for a wide range of applications. With a UL 94 V-0 flame retardant rating and lead-free solder compatibility, Kappa 438 is designed to meet the demands of modern electronics. Standard thicknesses available include 10, 20, 30, 40, and 60 mils.
Kappa 438 laminates feature dielectric constants (Dk) that align with FR-4 industry norms, facilitating the seamless conversion of existing FR-4 designs to achieve enhanced electrical performance.
Key Features
Kappa 438 offers a robust set of features, including a Dk of 4.38, which is specifically tailored to meet FR-4 standards. The material boasts tighter Dk and thickness tolerances compared to traditional FR-4, ensuring consistent performance.
With a low Z-axis coefficient of thermal expansion (CTE) of 42 ppm/°C and a high glass transition temperature (Tg) of over 280°C, Kappa 438 is engineered for reliability under demanding conditions. The thermal coefficient of dielectric constant is -21 ppm/°C within the temperature range of -50°C to 150°C, further enhancing its suitability for a variety of applications. Additionally, Kappa 438 meets UL 94-V0 requirements for flammability.
| Property | Typical Value Kappa 438 | Direction | Units | Condition | Test Method |
| Dielectric Constant, er Design | 4.38 | Z | - | 2.5 GHz | Differential Phase Length Method |
| Dissipation Factor tan, d | 0.005 | Z | - | 10 GHz/23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of Dielectric Constant e | -21 | - | ppm/°C | 10 GHz (-50 to 150°C) | Modified IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 2.9 x 109 | - | MΩ•cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 6.2 x 107 | - | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 675 | Z | V/mil | - | IPC-TM-650 2.5.6.2 |
| Tensile Strength | 16 12 | MD CMD | kpsi | - | ASTM D3039/D3039-14 |
| Flexural Strength | 25 19 | MD CMD | kpsi | - | IPC-TM-650 2.4.4 |
| Dimensional Stability | -0.48-0.59 | MD CMD | mm/m | - | IPC-TM-650 2.4.39a |
| Coefficient of Thermal Expansion | 13 | X | ppm/°C | -55 to 288°C | IPC-TM-650 2.4.41 |
| 16 | Y | ||||
| 42 | Z | ||||
| Thermal Conductivity | 0.64 | Z | W/(m.K) | 80°C | ASTM D5470 |
| Time to Delamination (T288) | >60 | - | minutes | 288°C | IPC-TM-650 2.4.24.1 |
| Tg | >280 | - | °C TMA | - | IPC-TM-650 2.4.24.3 |
| Td | 414 | - | °C | - | IPC-TM-650 2.3.40 |
| Moisture Absorption | 0.07 | - | % | 24/23 | IPC-TM-650 2.6.2.1 |
| Young’s Modulus | 2264 2098 | MD CMD | kpsi | - | ASTM D3039/D3039-14 |
| Flex Modulus | 2337 2123 | MD CMD | kpsi | - | IPC-TM-650 2.4.4 |
| Bow | 0.03 | - | % | - | IPC-TM-650 2.4.22C |
| Twist | 0.08 | - | % | - | IPC-TM-650 2.4.22C |
| Copper Peel Strength After Thermal Stress | 5.8 | - | lbs/in | 1 oz (35 µm) foil | IPC-TM-650 2.4.8 |
| Flammability | V-0 | - | - | - | UL 94 |
| Specific Gravity | 1.99 | - | g/cm3 | - | ASTM D792 |
| Lead-Free Process Compatible | Yes | - | - | - |
Benefits
The Kappa 438 PCB offers several significant advantages:
- Ease of manufacturing and assembly in line with standard FR-4 processes.
- Design flexibility through a Dk that allows for straightforward conversion of existing FR-4 designs requiring improved electrical performance.
- Consistent circuit performance across a range of applications.
- Enhanced plated through-hole reliability, contributing to overall durability.
- Compatibility with automated assembly processes, streamlining production.
| PCB Material: | Glass Reinforced Hydrocarbon Ceramic |
| Designation: | Kappa 438 |
| Dielectric constant: | 4.38 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm) |
| PCB thickness: | 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Specifications
This PCB stackup consists of a 2-layer rigid design, featuring a Copper Layer 1 of 35 μm, a Rogers Core Kappa 438 measuring 1.016 mm (40 mil), and a Copper Layer 2 also at 35 μm.
The board dimensions are 91.17 mm x 51.36 mm, with a tolerance of +/- 0.15 mm. The minimum trace/space is set at 4/7 mils, and the minimum hole size is 0.25 mm.
The finished board thickness is 1.1 mm, with a finished copper weight of 1 oz (1.4 mils) for the outer layers. The via plating thickness is 20 μm, and the surface finish is electroless nickel with immersion gold (ENIG).
This PCB features a white silkscreen on the top side, while the bottom side has none. The top side is coated with a blue solder mask, and there is no solder mask on the bottom. Each PCB undergoes a 100% electrical test prior to shipment to guarantee reliability.
Standards & Availability
The Kappa 438 PCB is manufactured to high-quality standards, with the artwork type being Gerber RS-274-X. It adheres to IPC-Class-2 quality standards, ensuring reliable performance in various applications. This product is available worldwide, making it suitable for a diverse range of electronic needs.
Typical Applications
The Kappa 438 PCB is ideal for numerous applications, including:
- Carrier Grade WiFi and Licensed Assisted Access (LAA)
- Small Cell and Distributed Antenna Systems (DAS)
- Vehicle-to-Vehicle and Vehicle-to-Infrastructure Communications (V2X)
- Internet of Things (IoT) segments, such as smart home devices and wireless meters
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
