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RT / Duroid 6006 2 layer board Solution For Low Loss Circuit Projects

RT / Duroid 6006 2 layer board Solution For Low Loss Circuit Projects

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RT/duroid 6006
PCB Size:
65.33mm X 59.89 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Silver
Layer Count:
2-Layer
PCB Thickness:
0.7 Mm
Highlight:

RT 2 layer board

,

Duroid 6006 2 layer board

,

Low Loss Circuit Projects board

Product Description

In the rapidly advancing world of electronics, the need for high-performance printed circuit boards (PCBs) is paramount. The RT/duroid 6006 PCB stands out as an exceptional solution for microwave and electronic circuit applications, designed specifically to meet the demands of high-frequency environments. This article delves into the features, specifications, and advantages of the RT/duroid 6006, emphasizing its importance in modern circuit design.

 

Material Composition and Characteristics
The RT/duroid 6006 is a ceramic-PTFE composite that provides outstanding dielectric properties. With a dielectric constant (Dk) of 6.15 ± 0.15 at 10 GHz, it enables significant reductions in circuit size while maintaining performance. This high Dk allows engineers to design compact circuits without compromising functionality.

 

Key Electrical Properties
Dissipation Factor: The RT/duroid 6006 boasts a low dissipation factor of 0.0027, ensuring minimal signal loss during operation. This characteristic is crucial for applications that demand high efficiency, particularly in RF and microwave circuits.

 

Thermal Stability: With a thermal stability exceeding 500 °C, the RT/duroid 6006 can withstand extreme temperatures, making it suitable for demanding environments. Its thermal coefficient of dielectric constant is -410 ppm/°C, indicating stable performance across a wide temperature range (-50°C to 170°C).
 

Moisture Absorption: The PCB exhibits a moisture absorption rate of just 0.05%, enhancing its reliability, especially in humid conditions. This low moisture absorption contributes to the longevity and performance consistency of the circuits.

 

Property RT/duroid 6006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped stripline
Dielectric Constant,εDesign 6.45 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0027 Z   10 GHz/A IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -410 Z ppm/℃ -50℃-170℃ IPC-TM-650 2.5.5.5
Volume Resistivity 7 x 107   Mohm.cm A IPC 2.5.17.1
Surface Resistivity 2 x 107   Mohm A IPC 2.5.17.1
Tensile Properties ASTM D638 (0.1/min. strain rate)
Young's Modulus 627(91) 517(75) X Y MPa(kpsi) A
Ultimate Stress 20(2.8) 17(2.5) X Y MPa(kpsi) A
Ultimate Strain 12 to 13 4 to 6 X Y % A
Compressive Properties   ASTM D695 (0.05/min. strain rate)
Young's Modulus 1069 (115) Z MPa(kpsi) A
Ultimate Stress 54(7.9) Z MPa(kpsi) A
Ultimate Strain 33 Z %  
Flexural Modulus 2634 (382) 1951 (283) X MPa(kpsi) A ASTM D790
Ultimate Stress 38 (5.5) X Y MPa(kpsi) A
Deformation under load 0.33 2.1 Z Z % 24hr/50℃/7MPa 24hr/150℃/7MPa ASTM D261
Moisture Absorption 0.05   % D48/50℃ 0.050"(1.27mm) thick IPC-TM-650 2.6.2.1
Thermal Conductivity 0.49   W/m/k 80℃ ASTM C518
Coefficient of Thermal Expansion 47
34
117
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.41
Td 500   ℃ TGA   ASTM D3850
Density 2.7   g/cm3   ASTM D792
Specific Heat 0.97(0.231)   j/g/k
(BTU/ib/OF)
  Calculated
Copper Peel 14.3 (2.5)   pli (N/mm) after solder float IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Mechanical Properties
 

The mechanical characteristics of the RT/duroid 6006 further enhance its applicability:

Young's Modulus: With values of 627 MPa in the X-direction and 517 MPa in the Y-direction, the material provides robust mechanical strength.
 

Ultimate Stress: The ultimate stress values of 20 MPa (X) and 17 MPa (Y) indicate its capacity to withstand significant mechanical loads.
 

Coefficient of Thermal Expansion (CTE): The CTE values are 47 ppm/°C (X), 34 ppm/°C (Y), and 117 ppm/°C (Z), ensuring dimensional stability across varying temperatures.

 

PCB Construction and Specifications
This PCB features a well-engineered construction:

Stackup: 2-layer rigid PCB
Copper Layer 1: 35 μm
RT/duroid 6006 Core Thickness: 0.635 mm (25 mil)
Copper Layer 2: 35 μm
Dimensions: 65.33 mm x 59.89 mm (±0.15 mm)
Finished Thickness: 0.7 mm
Surface Finish: Immersion Silver, enhancing solderability and protecting the copper layers.

 

This PCB supports a minimum trace/space of 5/5 mils and a minimum hole size of 0.5 mm, providing flexibility in design and manufacturing.

 

Advantages of RT/duroid 6006 PCBs
The RT/duroid 6006 offers a plethora of advantages:

High Dielectric Constant: Facilitates compact designs without sacrificing performance.
Low Loss Characteristics: Ideal for high-frequency applications, ensuring reliable signal transmission.
Reliable Plated Through-Holes: Enhances connectivity and mechanical integrity in multi-layer board designs.

 

PCB Material: Ceramic-PTFE Composites
Designation: RT/duroid 6006
Dielectric constant: 6.15
Dissipation Factor 0.0027 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil(0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.905mm), 100mil(2.54mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

RT / Duroid 6006 2 layer board Solution For Low Loss Circuit Projects 0

 

Diverse Applications Across Industries
The versatility of the RT/duroid 6006 PCB makes it suitable for various applications, including:

 

Patch Antennas: Perfect for compact designs in wireless communication.
Satellite Communications Systems: Provides reliable signal transmission in space applications.
Power Amplifiers: Enhances performance in RF and microwave circuits.
Aircraft Collision Avoidance Systems: Critical for safety and reliability in aviation technology.
Ground Radar Warning Systems: Ensures accurate information in defense applications.

 

Quality Assurance and Standards
Each PCB undergoes rigorous testing, including a 100% electrical test prior to shipment, adhering to IPC-Class-2 standards. This commitment to quality ensures that every unit delivered meets the highest performance criteria.

 

Conclusion
The RT/duroid 6006 PCB represents a significant advancement in PCB technology, offering unmatched performance for high-frequency applications. Its exceptional dielectric properties, mechanical strength, and reliability make it an essential choice for engineers and designers in various industries. By integrating RT/duroid 6006 into your projects, you can maximize performance, reliability, and efficiency, paving the way for innovation in microwave and electronic circuit design. Explore the possibilities with RT/duroid 6006 and elevate your designs to new heights!

products
PRODUCTS DETAILS
RT / Duroid 6006 2 layer board Solution For Low Loss Circuit Projects
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RT/duroid 6006
PCB Size:
65.33mm X 59.89 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Silver
Layer Count:
2-Layer
PCB Thickness:
0.7 Mm
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

RT 2 layer board

,

Duroid 6006 2 layer board

,

Low Loss Circuit Projects board

Product Description

In the rapidly advancing world of electronics, the need for high-performance printed circuit boards (PCBs) is paramount. The RT/duroid 6006 PCB stands out as an exceptional solution for microwave and electronic circuit applications, designed specifically to meet the demands of high-frequency environments. This article delves into the features, specifications, and advantages of the RT/duroid 6006, emphasizing its importance in modern circuit design.

 

Material Composition and Characteristics
The RT/duroid 6006 is a ceramic-PTFE composite that provides outstanding dielectric properties. With a dielectric constant (Dk) of 6.15 ± 0.15 at 10 GHz, it enables significant reductions in circuit size while maintaining performance. This high Dk allows engineers to design compact circuits without compromising functionality.

 

Key Electrical Properties
Dissipation Factor: The RT/duroid 6006 boasts a low dissipation factor of 0.0027, ensuring minimal signal loss during operation. This characteristic is crucial for applications that demand high efficiency, particularly in RF and microwave circuits.

 

Thermal Stability: With a thermal stability exceeding 500 °C, the RT/duroid 6006 can withstand extreme temperatures, making it suitable for demanding environments. Its thermal coefficient of dielectric constant is -410 ppm/°C, indicating stable performance across a wide temperature range (-50°C to 170°C).
 

Moisture Absorption: The PCB exhibits a moisture absorption rate of just 0.05%, enhancing its reliability, especially in humid conditions. This low moisture absorption contributes to the longevity and performance consistency of the circuits.

 

Property RT/duroid 6006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped stripline
Dielectric Constant,εDesign 6.45 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0027 Z   10 GHz/A IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -410 Z ppm/℃ -50℃-170℃ IPC-TM-650 2.5.5.5
Volume Resistivity 7 x 107   Mohm.cm A IPC 2.5.17.1
Surface Resistivity 2 x 107   Mohm A IPC 2.5.17.1
Tensile Properties ASTM D638 (0.1/min. strain rate)
Young's Modulus 627(91) 517(75) X Y MPa(kpsi) A
Ultimate Stress 20(2.8) 17(2.5) X Y MPa(kpsi) A
Ultimate Strain 12 to 13 4 to 6 X Y % A
Compressive Properties   ASTM D695 (0.05/min. strain rate)
Young's Modulus 1069 (115) Z MPa(kpsi) A
Ultimate Stress 54(7.9) Z MPa(kpsi) A
Ultimate Strain 33 Z %  
Flexural Modulus 2634 (382) 1951 (283) X MPa(kpsi) A ASTM D790
Ultimate Stress 38 (5.5) X Y MPa(kpsi) A
Deformation under load 0.33 2.1 Z Z % 24hr/50℃/7MPa 24hr/150℃/7MPa ASTM D261
Moisture Absorption 0.05   % D48/50℃ 0.050"(1.27mm) thick IPC-TM-650 2.6.2.1
Thermal Conductivity 0.49   W/m/k 80℃ ASTM C518
Coefficient of Thermal Expansion 47
34
117
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.41
Td 500   ℃ TGA   ASTM D3850
Density 2.7   g/cm3   ASTM D792
Specific Heat 0.97(0.231)   j/g/k
(BTU/ib/OF)
  Calculated
Copper Peel 14.3 (2.5)   pli (N/mm) after solder float IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Mechanical Properties
 

The mechanical characteristics of the RT/duroid 6006 further enhance its applicability:

Young's Modulus: With values of 627 MPa in the X-direction and 517 MPa in the Y-direction, the material provides robust mechanical strength.
 

Ultimate Stress: The ultimate stress values of 20 MPa (X) and 17 MPa (Y) indicate its capacity to withstand significant mechanical loads.
 

Coefficient of Thermal Expansion (CTE): The CTE values are 47 ppm/°C (X), 34 ppm/°C (Y), and 117 ppm/°C (Z), ensuring dimensional stability across varying temperatures.

 

PCB Construction and Specifications
This PCB features a well-engineered construction:

Stackup: 2-layer rigid PCB
Copper Layer 1: 35 μm
RT/duroid 6006 Core Thickness: 0.635 mm (25 mil)
Copper Layer 2: 35 μm
Dimensions: 65.33 mm x 59.89 mm (±0.15 mm)
Finished Thickness: 0.7 mm
Surface Finish: Immersion Silver, enhancing solderability and protecting the copper layers.

 

This PCB supports a minimum trace/space of 5/5 mils and a minimum hole size of 0.5 mm, providing flexibility in design and manufacturing.

 

Advantages of RT/duroid 6006 PCBs
The RT/duroid 6006 offers a plethora of advantages:

High Dielectric Constant: Facilitates compact designs without sacrificing performance.
Low Loss Characteristics: Ideal for high-frequency applications, ensuring reliable signal transmission.
Reliable Plated Through-Holes: Enhances connectivity and mechanical integrity in multi-layer board designs.

 

PCB Material: Ceramic-PTFE Composites
Designation: RT/duroid 6006
Dielectric constant: 6.15
Dissipation Factor 0.0027 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil(0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.905mm), 100mil(2.54mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

RT / Duroid 6006 2 layer board Solution For Low Loss Circuit Projects 0

 

Diverse Applications Across Industries
The versatility of the RT/duroid 6006 PCB makes it suitable for various applications, including:

 

Patch Antennas: Perfect for compact designs in wireless communication.
Satellite Communications Systems: Provides reliable signal transmission in space applications.
Power Amplifiers: Enhances performance in RF and microwave circuits.
Aircraft Collision Avoidance Systems: Critical for safety and reliability in aviation technology.
Ground Radar Warning Systems: Ensures accurate information in defense applications.

 

Quality Assurance and Standards
Each PCB undergoes rigorous testing, including a 100% electrical test prior to shipment, adhering to IPC-Class-2 standards. This commitment to quality ensures that every unit delivered meets the highest performance criteria.

 

Conclusion
The RT/duroid 6006 PCB represents a significant advancement in PCB technology, offering unmatched performance for high-frequency applications. Its exceptional dielectric properties, mechanical strength, and reliability make it an essential choice for engineers and designers in various industries. By integrating RT/duroid 6006 into your projects, you can maximize performance, reliability, and efficiency, paving the way for innovation in microwave and electronic circuit design. Explore the possibilities with RT/duroid 6006 and elevate your designs to new heights!

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