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TU-872 SLK High-Speed PCB High TG Multilayer Board

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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TU-872 SLK High-Speed PCB High TG Multilayer Board

TU-872 SLK High-Speed PCB High TG Multilayer Board
TU-872 SLK High-Speed PCB High TG Multilayer Board TU-872 SLK High-Speed PCB High TG Multilayer Board

Large Image :  TU-872 SLK High-Speed PCB High TG Multilayer Board

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month

TU-872 SLK High-Speed PCB High TG Multilayer Board

Description
Material: TG200 High-performance TU-872 SLK Modified Low-loss FR-4 PCB Size: 155mm × 79.5mm
Layer Count: 12-layer PCB Thickness: 1.68mm
Solder Mask: Matte Green Silkscreen: White
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Gold
Highlight:

Yellow Coverlay Flexible Circuit

,

FR4 Stiffner Flexible Circuit

,

Immersion Gold Flexible Circuit

12-Layer TU-872 SLK High-Speed Low-Loss PCB is a high-reliability multilayer circuit board based on premium TG200 modified FR-4 substrate. This high-speed PCB caters to high-frequency circuit design, high-precision impedance matching, and low-latency signal transmission scenarios for modern computing, networking, and telecommunication electronic systems. Adopting advanced TU-872 SLK low-dielectric material stacking structure, the board delivers stable electrical performance, minimal signal loss, and superior thermal and mechanical durability for high-layer-count multilayer applications.

 

This custom 12-layer PCB features a professional dual copper thickness structure: 1oz outer copper layers for stable high-current conduction and robust signal transmission, and 0.5oz inner copper layers to support ultra-fine line routing and high-density layout. The finished board thickness reaches 1.68mm, with a standard dimension of 155mm × 79.5mm (1 piece including process edges). It applies high-reliability immersion gold surface finish, paired with matte green solder mask and clear white silkscreen to ensure oxidation resistance, stable solderability, and precise component marking. All through holes adopt full resin plugging and electroplating filling structure. Supported by strict multi-layer impedance control across TOP, L3, L5, L10, and L12 layers, this TU-872 SLK PCB maintains excellent signal integrity with ultra-low transmission loss and consistent impedance accuracy.

 

Precise Multi-Layer Impedance Control Specifications

This 12-layer high-speed PCB supports strict customized impedance matching for single-ended and differential signals on key signal layers. Accurate line width and spacing design eliminate signal reflection, crosstalk, and waveform distortion, fully meeting high-speed circuit integrity requirements:

 

TOP Layer: 90Ω impedance control; 100Ω differential (4.9mil/5.5mil); 50Ω single-end (7mil)

 

Layer 3: 90Ω impedance control; 100Ω differential (4.5mil/4.7mil); 50Ω single-end (6mil)

 

Layer 5: 100Ω differential (5mil/6mil); 50Ω single-end (9mil)

 

Layer 10: 85Ω impedance control (8mil line width)

 

Layer 12: 100Ω differential (5mil/5mil); 50Ω single-end (7mil)

 

TU-872 SLK High-Speed PCB High TG Multilayer Board 0

 

What Is TU-872 SLK? High-Speed Low-Loss Modified FR-4 Material

TU-872 SLK is a high-performance modified epoxy FR-4 laminate with woven E-glass fiber, tailored for high-speed, low-loss, and high-frequency multilayer PCB designs. It offers low dielectric constant (Dk < 4.0) and ultra-low dissipation factor (Df < 0.010), maintaining stable Dk/Df performance across broad frequency ranges to minimize high-speed signal attenuation, delay and waveform distortion.

 

Optimized with unique allyl network compounds, TU-872 SLK outperforms conventional FR-4 materials with lower Z-axis thermal expansion, excellent moisture resistance, chemical stability and CAF resistance. Fully compatible with standard FR-4 processes and lead-free reflow, it suits high-layer-count PCB production with high thermal stability and reliable through-hole performance, acting as a cost-effective low-loss substrate for commercial high-speed and high-frequency electronic applications.

 

12-Layer TU-872 SLK High Speed PCB Specifications

Parameter Item Detailed Specification
PCB Layer Count 12-layer high-speed low-loss multilayer PCB
Base Material TG200 high-performance TU-872 SLK modified low-loss FR-4
Finished Board Thickness 1.68mm
Copper Thickness Outer layer: 1oz; Inner layer: 0.5oz
Surface Treatment Immersion Gold for stable conductivity and long-term oxidation resistance
Solder Mask & Silkscreen Matte green solder mask with white silkscreen
Board Dimension 155mm × 79.5mm, 1 piece (with process edges)
Key Processes Full through-hole resin plugging & electroplating filling; precise multi-layer impedance control
Impedance Control Layers TOP, L3, L5, L10, L12 single-ended & differential impedance matching
Material Characteristics Low Dk/Df, high Tg, low CTE, anti-CAF, moisture resistant, FR-4 process compatible
Quality Standard IPC-Class-2 qualified, lead-free assembly compatible

 

12-Layer TU-872 SLK PCB stack-up

TU-872 SLK High-Speed PCB High TG Multilayer Board 1

 

TU-872 SLK Typical Application Fields

Radio Frequency Systems: High-frequency signal transceiving and processing boards for low-latency RF equipment

 

High Performance Computing & Storage: Server mainboards, line cards, backpanels, and high-speed storage circuit modules

 

Telecom & Base Station Hardware: Communication base station control boards, signal processing and transmission units

 

Network Routing Devices: High-speed industrial switches, office routers, and broadband terminal equipment

 

High-Speed Multilayer Electronics: High-layer-count PCBs for high-frequency, high-temperature, and high-humidity working environments

 

TU-872 SLK High-Speed PCB High TG Multilayer Board 2

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)