Hybrid PCB on RO4350B and RO3010 Substrate Multilayer Circuit Board

12-Layer RO4350B & RO3010 Hybrid High Frequency PCB is a high-precision multi-dielectric RF circuit board engineered for high-density microwave and broadband communication systems. This custom 12-layer hybrid PCB adopts a professional mixed stacking structure, featuring 4mil RO4350B for the top and bottom outer layers, intermediate core layers with5mil / 10mil / 25mil RO3010 high-Dk microwave substrate, and RO4450F prepreg as bonding dielectric material throughout the stack-up.

This PCB applies a standard differentiated copper configuration:1oz copper for outer layers for robust high-frequency signal transmission and current conduction, and 0.5oz copper for inner layers to support ultra-fine line routing and high-density layout. It features green solder mask with white silkscreen and premium nickel-free Palladium Gold surface finish to eliminate nickel-layer signal interference and deliver superior high-frequency conductivity and oxidation resistance. With a board dimension of 107mm × 91.5mm (2 pieces per batch) and sophisticated multi-group blind via structure, this 12-layer hybrid board combines RO4350B low-loss broadband stability and RO3010 high-Dk miniaturization advantages, ideal for compact high-performance RF and microwave device applications.

12-Layer RO4350B & RO3010 Hybrid PCB Specifications

12-layer hybrid PCB stack-up

What Is RO4350B? Low-Loss Broadband High-Frequency Laminate

RO4350B is a premium glass-reinforced hydrocarbon ceramic laminate belonging to the Rogers RO4000 series, widely recognized as a mainstream high-performance substrate for commercial RF and microwave circuits. Delivering a stable dielectric constant (Dk=3.48) and ultra-low dissipation factor (Df=0.0037 @10GHz), RO4350B maintains consistent electrical performance across an extremely broad frequency spectrum, ensuring minimal signal attenuation for broadband high-frequency operation.

Different from traditional PTFE materials that require complex special processing, RO4350B features excellent manufacturability with full compatibility with standard FR-4 fabrication workflows. It requires no specialized via treatment, supports automated PCB processing equipment, and fits high-volume mass production. With high thermal stability and reliable CTE matching with copper foil, RO4350B prevents layer delamination, via cracking and thermal deformation during repeated soldering and thermal cycling. Its outstanding broadband stability, low insertion loss and high power-handling capability make it the preferred outer-layer material for high-frequency hybrid PCB designs.

RO4350B DATASHEET

RO4350B Laminate Applications

Wireless Communication Infrastructure: 5G/6G base station RF front-end modules, broadband antenna boards, power amplifiers (PA) and low-noise amplifiers (LNA)

Microwave & RF Devices: High-frequency filters, couplers, splitters and impedance matching networks for broadband microwave systems

Automotive High-Frequency Systems: 77GHz automotive millimeter-wave radar, adaptive cruise control and vehicle safety monitoring modules

Precision Test & Measurement Equipment: High-frequency test fixtures, signal transceiving and processing circuit boards

Aerospace & Defense Electronics: Low insertion loss RF circuits requiring high thermal stability and broadband consistency

What Is RO3010? High-Dk Ceramic-Filled PTFE Microwave Laminate

RO3010 is a high-performance ceramic-filled PTFE composite laminate from the Rogers RO3000 series, specifically engineered for compact, miniaturized microwave circuit designs. It features a high and stable dielectric constant of Dk=10.2±0.30 and an ultra-low dissipation factor of Df=0.0022 @10GHz, enabling significant circuit size reduction while retaining ultra-low high-frequency signal loss. This high-Dk characteristic allows designers to miniaturize RF components, including antennas, filters and couplers, for space-constrained high-density electronic devices.

RO3010 DATASHEET 

RO3010 Laminate Applications

Miniaturized RF Components: Compact antennas, micro filters and miniature couplers for space-limited wireless devices

High-Density Multi-Layer PCBs: High-layer-count hybrid stacking boards requiring size reduction and stable high-frequency performance

Satellite & Microwave Communication: Narrowband high-precision signal processing and transceiving modules

Industrial High-Frequency Sensors: High-stability microwave sensing and detection equipment working under complex environmental conditions