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Double-Sided RO3010 PCB 50mil Substrate with Black Silkscreen

Double-Sided RO3010 PCB 50mil Substrate with Black Silkscreen

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
PCB Material:
RO3010
Layer Count:
2-layer
PCN Thickness:
1.3mm
PCB Size:
89.65mm X 94.3mm (per Piece)
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
EPIG (nickel Free)
Highlight:

TLX-6 high frequency laminates

,

copper clad laminate sheets

,

high frequency copper clad substrate

Product Description

This PCB is a double-sided rigid circuit board made of Rogers RO3010 ceramic-filled PTFE composite material, a high-performance base material known for its excellent dielectric stability and mechanical reliability. This PCB features a board thickness of 1.3mm, 1 oz copper weight on outer layers, and EPIG (nickel free) surface finish, ensuring reliable performance and compatibility for various professional electronic applications that require precision and stability.

 

PCB Details

Item Specification
Base material RO3010
Layer count Double sided
Board dimensions 89.65mm x 94.3mm (per piece)
Minimum Trace/Space 5/6 mils
Minimum Hole Size 0.25mm
Blind vias None
Finished board thickness 1.3mm
Finished Cu weight (outer layers) 1 oz (1.4 mils)
Via plating thickness 20 μm
Surface finish EPIG (nickel free)
Top Silkscreen Black
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None
Electrical test 100% electrical test conducted prior to shipment

 

PCB Stack-up

This is a 2-layer rigid PCB with the following stack-up structure (from top to bottom):

Layer Type Specification
Copper_layer_1 35 μm
Rogers RO3010 Substrate 50mil (1.27mm)
Copper_layer_2 35 μm

 

Double-Sided RO3010 PCB 50mil Substrate with Black Silkscreen 0

 

Artwork and Quality Standard

The artwork supplied for this PCB follows the Gerber RS-274-X format, which is the industry-standard file format for PCB manufacturing. Additionally, the PCB adheres to the IPC-Class-2 standard, a widely recognized quality standard that specifies acceptable performance and reliability requirements for electronic components, ensuring the PCB meets the necessary criteria for commercial and industrial applications.

 

Availability

This PCB is offered for global availability, encompassing all major regions and markets worldwide. Its worldwide accessibility ensures that customers across various countries and industries can obtain the product with consistent reliability and timely delivery, catering to both small-batch prototyping requirements and large-volume production orders.

 

Introduction to RO3010

Rogers RO3010 high-performance circuit materials are PTFE composites filled with ceramics, featuring a higher dielectric constant while maintaining outstanding stability. These competitively priced products deliver excellent mechanical and electrical reliability. Their inherent stability streamlines the design of broadband components and enables the materials to perform effectively across an extensive frequency range and a wide variety of applications. These characteristics make RO3010 laminates an ideal choice for circuit miniaturization.

 

Benefits of RO3010 Substrate

The RO3010 substrate demonstrates excellent dimensional stability, with a coefficient of thermal expansion (CTE) precisely matched to copper, ensuring minimal thermal warpage and long-term structural integrity.

 

The laminate features cost-effective pricing, making it well-suited for high-volume manufacturing processes without compromising performance or quality.

 

The RO3010 material is manufactured in compliance with ISO 9001 quality management system standards, ensuring consistent product quality and traceability.

 

The substrate is fully compatible with multi-layer printed circuit board (PCB) designs, providing enhanced flexibility for complex circuit integration.

 

Typical Applications

  • Automotive radar applications
  • Global positioning satellite antennas
  • Cellular telecommunications systems - power amplifiers and antennas
  • Patch antenna for wireless communications
  • Direct broadcast satellites
  • Datalink on cable systems
  • Remote meter readers
  • Power backplanes

 

RO3010 High Frequency Laminates

RO3010 high frequency circuit materials are ceramic-filled PTFE composites designed specifically for commercial microwave and RF applications. This product series combines outstanding electrical and mechanical stability with competitive pricing. RO3000 series laminates are PTFE-based circuit materials filled with ceramics. Their mechanical properties remain consistent regardless of the chosen dielectric constant, enabling designers to develop multilayer boards that incorporate different dielectric constant materials on individual layers—without risk of warpage or reliability issues.

 

RO3010 laminates can be processed into printed circuit boards using standard PTFE circuit board fabrication techniques.

 

Double-Sided RO3010 PCB 50mil Substrate with Black Silkscreen 1

 

Property RO3010 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 11.2 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0022 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -395 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.35
0.31
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105   COND A IPC 2.5.17.1
Tensile Modulus 1902
1934
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.05   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.8   j/g/k   Calculated
Thermal Conductivity 0.95   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
13
11
16
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.8   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 9.4   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Standard Thicknesses Standard Panel Sizes Standard Cladding

 

RO3010:

0.005” (0.13mm) +/- 0.0005”

0.010” (0.25mm) +/- 0.0007”

0.025” (0.64mm) +/- 0.0010”

0.050” (1.28mm) +/- 0.0020”

 

 

RO3010

 

12”X 18”(305 X 457mm)

24”X 18”(610 X 457mm)

24”X 21”(610 X 533mm)

RO3010

Electrodeposited Copper Foil ½ oz. (18μm)

1 oz. (35μm)

Products
PRODUCTS DETAILS
Double-Sided RO3010 PCB 50mil Substrate with Black Silkscreen
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
PCB Material:
RO3010
Layer Count:
2-layer
PCN Thickness:
1.3mm
PCB Size:
89.65mm X 94.3mm (per Piece)
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
EPIG (nickel Free)
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

TLX-6 high frequency laminates

,

copper clad laminate sheets

,

high frequency copper clad substrate

Product Description

This PCB is a double-sided rigid circuit board made of Rogers RO3010 ceramic-filled PTFE composite material, a high-performance base material known for its excellent dielectric stability and mechanical reliability. This PCB features a board thickness of 1.3mm, 1 oz copper weight on outer layers, and EPIG (nickel free) surface finish, ensuring reliable performance and compatibility for various professional electronic applications that require precision and stability.

 

PCB Details

Item Specification
Base material RO3010
Layer count Double sided
Board dimensions 89.65mm x 94.3mm (per piece)
Minimum Trace/Space 5/6 mils
Minimum Hole Size 0.25mm
Blind vias None
Finished board thickness 1.3mm
Finished Cu weight (outer layers) 1 oz (1.4 mils)
Via plating thickness 20 μm
Surface finish EPIG (nickel free)
Top Silkscreen Black
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None
Electrical test 100% electrical test conducted prior to shipment

 

PCB Stack-up

This is a 2-layer rigid PCB with the following stack-up structure (from top to bottom):

Layer Type Specification
Copper_layer_1 35 μm
Rogers RO3010 Substrate 50mil (1.27mm)
Copper_layer_2 35 μm

 

Double-Sided RO3010 PCB 50mil Substrate with Black Silkscreen 0

 

Artwork and Quality Standard

The artwork supplied for this PCB follows the Gerber RS-274-X format, which is the industry-standard file format for PCB manufacturing. Additionally, the PCB adheres to the IPC-Class-2 standard, a widely recognized quality standard that specifies acceptable performance and reliability requirements for electronic components, ensuring the PCB meets the necessary criteria for commercial and industrial applications.

 

Availability

This PCB is offered for global availability, encompassing all major regions and markets worldwide. Its worldwide accessibility ensures that customers across various countries and industries can obtain the product with consistent reliability and timely delivery, catering to both small-batch prototyping requirements and large-volume production orders.

 

Introduction to RO3010

Rogers RO3010 high-performance circuit materials are PTFE composites filled with ceramics, featuring a higher dielectric constant while maintaining outstanding stability. These competitively priced products deliver excellent mechanical and electrical reliability. Their inherent stability streamlines the design of broadband components and enables the materials to perform effectively across an extensive frequency range and a wide variety of applications. These characteristics make RO3010 laminates an ideal choice for circuit miniaturization.

 

Benefits of RO3010 Substrate

The RO3010 substrate demonstrates excellent dimensional stability, with a coefficient of thermal expansion (CTE) precisely matched to copper, ensuring minimal thermal warpage and long-term structural integrity.

 

The laminate features cost-effective pricing, making it well-suited for high-volume manufacturing processes without compromising performance or quality.

 

The RO3010 material is manufactured in compliance with ISO 9001 quality management system standards, ensuring consistent product quality and traceability.

 

The substrate is fully compatible with multi-layer printed circuit board (PCB) designs, providing enhanced flexibility for complex circuit integration.

 

Typical Applications

  • Automotive radar applications
  • Global positioning satellite antennas
  • Cellular telecommunications systems - power amplifiers and antennas
  • Patch antenna for wireless communications
  • Direct broadcast satellites
  • Datalink on cable systems
  • Remote meter readers
  • Power backplanes

 

RO3010 High Frequency Laminates

RO3010 high frequency circuit materials are ceramic-filled PTFE composites designed specifically for commercial microwave and RF applications. This product series combines outstanding electrical and mechanical stability with competitive pricing. RO3000 series laminates are PTFE-based circuit materials filled with ceramics. Their mechanical properties remain consistent regardless of the chosen dielectric constant, enabling designers to develop multilayer boards that incorporate different dielectric constant materials on individual layers—without risk of warpage or reliability issues.

 

RO3010 laminates can be processed into printed circuit boards using standard PTFE circuit board fabrication techniques.

 

Double-Sided RO3010 PCB 50mil Substrate with Black Silkscreen 1

 

Property RO3010 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 11.2 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0022 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -395 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.35
0.31
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105   COND A IPC 2.5.17.1
Tensile Modulus 1902
1934
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.05   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.8   j/g/k   Calculated
Thermal Conductivity 0.95   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
13
11
16
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.8   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 9.4   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Standard Thicknesses Standard Panel Sizes Standard Cladding

 

RO3010:

0.005” (0.13mm) +/- 0.0005”

0.010” (0.25mm) +/- 0.0007”

0.025” (0.64mm) +/- 0.0010”

0.050” (1.28mm) +/- 0.0020”

 

 

RO3010

 

12”X 18”(305 X 457mm)

24”X 18”(610 X 457mm)

24”X 21”(610 X 533mm)

RO3010

Electrodeposited Copper Foil ½ oz. (18μm)

1 oz. (35μm)

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