RT duroid 6035HTC PCB Rogers 30mil Substrate with Immersion Silver

Engineered for demanding high-power RF and microwave environments, this double-sided rigid PCB utilizes Rogers RT/duroid 6035HTC—an advanced ceramic-filled PTFE composite—to provide superior heat dissipation, exceptionally low transmission losses, and enduring operational reliability. Built to exacting manufacturing tolerances, it satisfies the critical performance requirements of sophisticated RF components, ensuring robust functionality in challenging industrial and telecommunications applications worldwide.

PCB Specifications

PCB Stack-Up

Quality Compliance & Availability

In terms of manufacturing compliance and availability, the PCB adopts the Gerber RS-274-X format for fabrication artwork, which is the industry-standard protocol for transmitting PCB manufacturing data. It strictly adheres to the IPC-Class 2 standard, a globally recognized benchmark that defines rigorous requirements for PCB quality, reliability, and performance. Additionally, this PCB is available for worldwide supply, capable of supporting both small-batch prototyping and high-volume production to meet the diverse needs of global clients.

Rogers RT/duroid 6035HTC Material Introduction

Rogers RT/duroid 6035HTC is a ceramic-filled PTFE composite substrate specifically developed for high-power RF and microwave applications. It offers distinct advantages over standard laminates, including 2.4 times the thermal conductivity of the RT/duroid 6000 series, ED/reverse-treated copper foil for long-term thermal stability, and an advanced filler system that enhances drill-ability—reducing manufacturing costs compared to alumina-filled high-thermal laminates.

Key Features

Benefits

The core performance benefits of the Rogers RT/duroid 6035HTC substrate translate to tangible advantages for the PCB, including:

-High thermal conductivity, which enables efficient heat dissipation for high-power components.

-Improved dielectric heat dissipation, effectively reducing operating temperatures in high-power applications.

-Superior high-frequency performance with minimal insertion loss, ensuring optimal signal integrity.

-Excellent thermal stability of copper traces, supporting consistent long-term operation and enhanced reliability.

Target Applications

Leveraging the advanced properties of Rogers RT/duroid 6035HTC, this double-sided PCB is the ideal solution for high-power RF and microwave systems, including:

-High-power RF and microwave amplifiers: Suitable for various high-power amplification scenarios in communication and industrial fields.

-RF components: Applicable to core RF system components, including power amplifiers, couplers, filters, combiners, and power dividers.

Conclusion

In conclusion, this double-sided rigid PCB is a high-reliability technical solution for high-power RF and microwave applications. With global availability, it supports small-batch prototyping and large-volume production, providing a robust, cost-effective option for professional RF projects while meeting the stringent performance requirements of demanding communication and industrial microwave systems.