Rogers RO4003C Low Profile PCB 0.5mm 20um Via Plating

This double-layer rigid PCB uses Rogers RO4003C Low Profile (LoPro) substrate and ENEPIG surface finish. With 1 oz (1.4 mils) outer copper cladding, 0.5mm finished thickness, and 20 μm via plating, it delivers stable electrical performance, superior signal integrity, and high-precision manufacturing. Its advanced low-loss properties make it ideal for high-frequency digital applications, cellular base station components, satellite LNBs, and RFID tags.

PCB Details

PCB Stack-up

Artwork Type

The artwork provided for PCB fabrication strictly complies with the Gerber RS-274-X format, which is the industry-recognized standard protocol for transmitting PCB manufacturing data.

Quality Standard

This PCB strictly adheres to the IPC-Class-2 standard, a globally recognized industry benchmark for printed circuit boards. The IPC-Class-2 standard defines rigorous specifications for PCB quality, electrical performance, and operational reliability, making it well-suited for the majority of commercial and industrial applications that demand consistent operational stability and moderate dependability.

Availability

This PCB is offered for global supply. We provide reliable logistics and shipping services to ensure the timely delivery of products to clients across various countries and regions, with the capability to fulfill the requirements of both small-batch and large-volume orders.

Introduction to RO4003C Low Profile Base Material

Rogers RO4003C LoPro laminates utilize proprietary Rogers technology, which allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss, improving insertion loss and signal integrity while preserving all favorable characteristics of the standard RO4003C laminate system. As hydrocarbon ceramic laminates, RO4003C LoPro is designed to deliver superior high-frequency performance and cost-efficient circuit fabrication. It is a low-loss material compatible with standard epoxy/glass (FR-4) manufacturing processes and eliminates the necessity for specialized via preparation (e.g., sodium etch), thereby lowering manufacturing costs.

Key Features of RO4003C Low Profile

Core Benefits

-Lower insertion loss supports the design of higher operating frequency systems (exceeding 40 GHz)

-Reduced passive intermodulation (PIM) performance, making it ideal for base station antennas

-Improved thermal performance due to reduced conductor loss

-Enables multilayer PCB fabrication

-Offers exceptional design flexibility to meet diverse application requirements

-Compatible with high-temperature processing procedures

-Complies with relevant environmental regulations and requirements

-Exhibits resistance to Conductive Anodic Filament (CAF) formation

Typical Applications

-Digital applications: servers, routers, and high-speed backplanes

-Cellular base station antennas and power amplifiers

-Low Noise Blocks (LNBs) for direct broadcast satellites

-Radio Frequency Identification (RFID) Tags

Conclusion

This double-layer PCB represents a pinnacle of engineering precision, combining Rogers' proprietary RO4003C LoPro material science with rigorous manufacturing standards to deliver unmatched performance in mission-critical communication and signal processing applications.