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0.8mm RO3210 Double Sided RF PCB with 1OZ Copper and Immersion Tin

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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0.8mm RO3210 Double Sided RF PCB with 1OZ Copper and Immersion Tin

0.8mm RO3210 Double Sided RF PCB with 1OZ Copper and Immersion Tin
0.8mm RO3210 Double Sided RF PCB with 1OZ Copper and Immersion Tin 0.8mm RO3210 Double Sided RF PCB with 1OZ Copper and Immersion Tin 0.8mm RO3210 Double Sided RF PCB with 1OZ Copper and Immersion Tin

Large Image :  0.8mm RO3210 Double Sided RF PCB with 1OZ Copper and Immersion Tin

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description

Introduction:
It's delighted to share a new RF PCB which made of RO3210 25mil laminates. The RO3210 high-frequency circuit materials are a game-changer in the world of PCBs. These ceramic-filled laminates, reinforced with woven fiberglass, offer exceptional electrical performance and mechanical stability. Designed with the aim of providing improved mechanical stability, RO3210 laminates combine the surface smoothness of a non-woven PTFE laminate with the rigidity of a woven-glass PTFE laminate. This article dives deep into the features, benefits, construction details, and applications of the newly shipped RO3210-based PCB.

 

Features:
The RO3210 material boasts an impressive array of features that set it apart from conventional circuit materials. These include:
1. Dielectric constant (Dk) of 10.2 +/- 0.5, ensuring precise signal transmission.
2. Dissipation factor of .0027 at 10GHz, minimizing signal loss.
3. Coefficient of thermal expansion matched to copper, promoting excellent thermal stability.
4. Decomposition Temperature (Td) of 500°C TGA, ensuring high-temperature resilience.
5. Coefficient of Thermal Expansion (CTE) of 13 ppm/°C (x and y axes) and 34 ppm/°C (z axis), providing dimensional stability.
6. Thermal Conductivity of 0.81W/mK, facilitating efficient heat dissipation.
7. Flammability rating of V0 UL 94 standard, ensuring safety and compliance.

 

Property Typical Value RO3210 Direction Unit Condition Test Method
Dielectric Constant, r Process 10.2± 0.50 Z - 10 GHz 23°C IPC-TM-650 2.5.5.5
Clamped Stripline
Dielectric Constant, r Design 10.8 Z - 8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor, tan  0.0027 Z - 10 GHz 23°C IPC-TM-650 2.5.5.5
Thermal Coefficient of r -459 Z ppm/°C 10 GHz 0-100°C IPC-TM-650 2.5.5.5
Dimensional Stability 0.8 X,Y mm/m COND A ASTM D257
Volume Resistivity 103   M•cm COND A IPC 2.5.17.1
Surface Resistivity 103   M COND A IPC 2.5.17.1
Tensile Modulus 579
517
MD CMD kpsi 23°C ASTM D638
Water Absorption <0.1 - % D24/23 IPC-TM-650 2.6.2.1
Specific Heat 0.79   J/g/K   Calculated
Thermal Conductivity 0.81 - W/m/K 80°C ASTM C518
Coefficient of Thermal Expansion (-55 to 288 °C) 13
34
X,Y, Z ppm/°C 23°C/50% RH IPC-TM-650 2.4.41
Td 500   °C TGA ASTM D3850
Color Off White        
Density 3.0   gm/cm3    
Copper Peel Strength 11.0   pli 1 oz. EDC
After Solder Float
IPC-TM-2.4.8
Flammability V-0       UL 94
Lead Free Process Compatible YES        

 

Benefits:
The RO3210 substrate offers a range of benefits that enhance its performance and usability:

 

1. Woven glass reinforcement improves rigidity, making it easier to handle during fabrication.
 

2. Uniform electrical and mechanical performance makes it ideal for complex multi-layer high-frequency structures.
 

3. Low in-plane expansion coefficient matched to copper enables use with epoxy multi-layer board hybrid designs and reliable surface-mounted assemblies.
 

4. Excellent dimensional stability ensures high production yields.
 

5. Surface smoothness allows for finer line etching tolerances, expanding design possibilities.

 

PCB Stackup and Construction Details:
This PCB construction details encompass various specifications to ensure optimal performance and adherence to high-quality standards. These include the board dimensions of 20mm x 20mm with a tolerance of +/- 0.15mm, a minimum trace/space requirement of 6/6 mils, and a minimum hole size of 0.25mm. The PCB does not include blind vias and has a finished board thickness of 0.8mm. The outer layers have a finished copper weight of 1oz (1.4 mils), and the via plating thickness measures 20 μm. The surface finish is achieved through immersion tin, while there is no top or bottom silkscreen or solder mask. Additionally, a comprehensive 100% electrical test is conducted prior to shipment, ensuring the PCB's reliability and functionality.

 

PCB Statistics:
This PCB incorporates three components and a total of six pads, including four thru-hole pads and two top surface mount technology (SMT) pads. Additionally, it features six vias and two nets, enabling efficient electrical connectivity.

 

Quality Standard and Availability:
This PCB adheres to the IPC-Class-2 quality standard, guaranteeing its superior manufacturing quality and reliability. It is available worldwide, allowing engineers and designers from various regions to access this cutting-edge technology.

 

0.8mm RO3210 Double Sided RF PCB with 1OZ Copper and Immersion Tin 0

 

Typical Applications:
The versatility of the RO3210 PCB makes it suitable for a wide range of applications, including:
- Automotive collision avoidance systems
- Automotive global positioning satellite antennas
- Wireless telecommunications systems
- Microstrip patch antennas for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes
- LMDS and wireless broadband
- Base station infrastructure

 

Conclusion:
The introduction of the RO3210 high-frequency PCB marks a significant milestone in the industry. With its exceptional features, benefits, and adherence to quality standards, this PCB offers unmatched performance and reliability. Whether in automotive, wireless communications, or satellite systems, the RO3210 PCB ensures superior signal integrity, thermal stability, and dimensional accuracy. Its availability worldwide makes it accessible to engineers and designers globally. Embrace the future of PCB technology by incorporating the RO3210 PCB into your next project.

 

0.8mm RO3210 Double Sided RF PCB with 1OZ Copper and Immersion Tin 1

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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