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RF PCB 60mil TLY-5 1OZ 1.6mm No Soldermask and No Silkscreen with ENIG Finished

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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RF PCB 60mil TLY-5 1OZ 1.6mm No Soldermask and No Silkscreen with ENIG Finished

RF PCB 60mil TLY-5 1OZ 1.6mm No Soldermask and No Silkscreen with ENIG Finished
RF PCB 60mil TLY-5 1OZ 1.6mm No Soldermask and No Silkscreen with ENIG Finished RF PCB 60mil TLY-5 1OZ 1.6mm No Soldermask and No Silkscreen with ENIG Finished

Large Image :  RF PCB 60mil TLY-5 1OZ 1.6mm No Soldermask and No Silkscreen with ENIG Finished

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99/PCS-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description

Introducing our newly shipped PCB which built on TLY-5 high frequency laminates. The TLY-5 High-Performance substrate is an advanced circuit material designed to meet the demanding requirements of various high-frequency applications. With its exceptional stability, low dissipation factor, and reliable construction, this PCB offers unparalleled performance and reliability. Let's explore the features, benefits, and applications that set the TLY-5 apart from the rest.

 

TLY-5 Introduction:
The TLY-5 laminates are manufactured using lightweight woven fiberglass, resulting in a dimensionally stable PCB material. The woven matrix in the TLY-5 material provides enhanced mechanical stability, making it suitable for high-volume manufacturing. The low dissipation factor makes it ideal for automotive radar applications designed at 77 GHz and other antennas operating in millimeter-wave frequencies.

 

Features:

Dielectric Constant (DK): The TLY-5 offers a dielectric constant of 2.2 with an impressive tolerance of 0.02 at 10 GHz and 23°C, ensuring precise and consistent electrical characteristics.
 

Low Loss Tangent: With a low loss tangent of 0.0009 at 10 GHz, this PCB minimizes signal loss and distortion, enabling high-quality signal transmission.
 

Density: The TLY-5 material has a specific gravity of 2.19 g/cm^3, providing a lightweight yet durable solution for various applications.
Moisture Absorption: The PCB exhibits a low moisture absorption rate of 0.02%, contributing to its excellent dimensional stability and resistance to moisture-related issues.

 

Coefficient of Thermal Expansion (CTE): The TLY-5 PCB features a CTE of 26 ppm/°C (X-axis), 15 ppm/°C (Y-axis), and 217 ppm/°C (Z-axis), ensuring stability and minimizing dimensional changes across a wide temperature range.
 

TLY TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK at 10 GHz IPC-650 2.5.5.5   2.2   2.2
Df at 10 GHz IPC-650 2.5.5.5   0.0009   0.0009
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Dielectric Strength ASTM D 149 V/mil 2,693 V/mil 106,023
Volume Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms/cm 1010 Mohms/cm 1010
Volume Resistivity IPC-650 2.5.17.1(after humidity) Mohms/cm 1010 Mohms/cm 109
Surface Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms 108 Mohms 108
Surface Resistivity IPC-650 2.5.17.1(after humidity) Mohms 108 Mohms 108
Flex Strength(MD) IPC-650 2.4.4 psi 14,057 N/mm2 96.91
Flex Strength(CD) IPC-650 2.4.4 psi 12,955 N/mm2 89.32
Peel Stength(½ oz.ed copper) IPC-650 2.4.8 Ibs./inch 11 N/mm 1.96
Peel Stength(1 oz.CL1 copper) IPC-650 2.4.8 Ibs./inch 16 N/mm 2.86
Peel Stength(1 oz..CV1 copper) IPC-650 2.4.8 Ibs./inch 17 N/mm 3.04
Peel Stength IPC-650 2.4.8(after elevated temp.) Ibs./inch 13 N/mm 2.32
Young's Modulus(MD) ASTM D 3039/IPC-650 2.4.19 psi 1.4 x 106 N/mm2 9.65 x 103
Poisson's Ratio(MD) ASTM D 3039/IPC-650 2.4.19   0.21   0.21
Thermal Conductivity ASTM F 433 W/M*K 0.22 W/M*K 0.22
Dimensional Stability(MD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.038   -0.038
Dimensional Stability(CD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.031   -0.031
Density(Specific Gravity) ASTM D 792 g/cm3 2.19 g/cm3 2.19
CTE(X axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 26 ppm/℃ 26
CTE(Y axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 15 ppm/℃ 15
CTE(Z axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 217 ppm/℃ 217
NASA Outgassing(% TML)     0.01   0.01
NASA Outgassing(% CVCM)     0.01   0.01
NASA Outgassing(% WVR)     0.00   0.00
UL-94 Flammability Rating UL-94   V-0   V-0

 

Benefits:
Dimensional Stability: The TLY-5 PCB maintains its shape and size, even under challenging conditions, ensuring reliable operation and precise circuit alignment.

 

Lowest Dissipation Factor: The low dissipation factor minimizes signal loss and distortion, resulting in high-quality signal transmission and improved system performance.
 

Low Moisture Absorption: The low moisture absorption rate enhances the PCB's durability and resistance to moisture-related issues, ensuring long-term reliability.
 

High Copper Peel Strength: The TLY-5 PCB boasts high copper peel strength, ensuring secure adhesion between layers and excellent mechanical reliability.
 

Uniform & Consistent DK: The TLY-5 material offers uniform and consistent dielectric constant, enabling predictable and accurate circuit performance.
 

PCB Material: Lightweight Woven Fiberglass
Designation: TLY-5
Dielectric Constant: 2.2
Dissipation Factor 0.0009 10GHz
Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper Weight: 1oz (35µm), 2oz (70µm)
Laminate Thickness: 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB Size: ≤400mm X 500mm
Solder Mask: Green, Black, Blue, Yellow, Red etc.
Surface Finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

PCB Stackup:
This PCB is a 2-layer rigid board with a copper layer of 35 μm on both sides. With a TLY-5 core thickness of 1.524 mm (60 mils), providing a sturdy and reliable design.

 

PCB Construction Details:
This PCB comes in a size of 127.72mm x 97.07mm with a tolerance of +/- 0.15mm. It supports a minimum trace/space of 5/6 mils and a minimum hole size of 0.4mm. The finished board thickness is 1.6mm, and the finished copper weight is 1oz (1.4 mils) on the outer layers. The PCB features a via plating thickness of 20 μm and is finished with immersion gold for optimal performance. The PCB does not have top or bottom silkscreen or solder mask. Each PCB undergoes a rigorous 100% electrical test before shipment, ensuring uncompromised functionality.

 

PCB Statistics:
This PCB contains 91 components and features a total of 238 pads, including 96 thru-hole pads and 142 top surface mount technology (SMT) pads. There are no bottom SMT pads. It also includes 161 vias, facilitating efficient electrical connections, and supports 5 nets, allowing for versatile circuit configurations.

 

Type of Artwork Supplied: The TLY-5 PCB is compatible with Gerber RS-274-X, a widely used standard for PCB artwork.

 

Quality Standard: This PCB adheres to the IPC-Class-2 standard, ensuring high-quality manufacturing and assembly.

 

Availability: The TLY-5 High-Performance PCB is available worldwide, making it accessible to customers across the globe.

 

RF PCB 60mil TLY-5 1OZ 1.6mm No Soldermask and No Silkscreen with ENIG Finished 0

 

Typical Applications:
The TLY-5 PCB is ideally suited for a wide range of applications, including:

Automotive Radar
Satellite/Cellular Communications
Power Amplifiers
LNBs, LNAs, LNCs
Aerospace
Ka, E and W band Applications

 

The TLY-5 High-Performance PCB enables engineers and designers in various industries to develop cutting-edge systems for high-frequency applications. With its unmatched stability, low dissipation factor, and reliable construction, the TLY-5 empowers users to create innovative solutions with confidence.

 

RF PCB 60mil TLY-5 1OZ 1.6mm No Soldermask and No Silkscreen with ENIG Finished 1

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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