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| Highlight: | RF PCB Board No Silkscreen,RF PCB Board 60mil,1.6mm Radio Frequency Circuit Board |
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Introducing our newly shipped PCB which built on TLY-5 high frequency laminates. The TLY-5 High-Performance substrate is an advanced circuit material designed to meet the demanding requirements of various high-frequency applications. With its exceptional stability, low dissipation factor, and reliable construction, this PCB offers unparalleled performance and reliability. Let's explore the features, benefits, and applications that set the TLY-5 apart from the rest.
TLY-5 Introduction:
The TLY-5 laminates are manufactured using lightweight woven fiberglass, resulting in a dimensionally stable PCB material. The woven matrix in the TLY-5 material provides enhanced mechanical stability, making it suitable for high-volume manufacturing. The low dissipation factor makes it ideal for automotive radar applications designed at 77 GHz and other antennas operating in millimeter-wave frequencies.
Features:
Dielectric Constant (DK): The TLY-5 offers a dielectric constant of 2.2 with an impressive tolerance of 0.02 at 10 GHz and 23°C, ensuring precise and consistent electrical characteristics.
Low Loss Tangent: With a low loss tangent of 0.0009 at 10 GHz, this PCB minimizes signal loss and distortion, enabling high-quality signal transmission.
Density: The TLY-5 material has a specific gravity of 2.19 g/cm^3, providing a lightweight yet durable solution for various applications.
Moisture Absorption: The PCB exhibits a low moisture absorption rate of 0.02%, contributing to its excellent dimensional stability and resistance to moisture-related issues.
Coefficient of Thermal Expansion (CTE): The TLY-5 PCB features a CTE of 26 ppm/°C (X-axis), 15 ppm/°C (Y-axis), and 217 ppm/°C (Z-axis), ensuring stability and minimizing dimensional changes across a wide temperature range.
| TLY TYPICAL VALUES | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| DK at 10 GHz | IPC-650 2.5.5.5 | 2.2 | 2.2 | ||
| Df at 10 GHz | IPC-650 2.5.5.5 | 0.0009 | 0.0009 | ||
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
| Dielectric Strength | ASTM D 149 | V/mil | 2,693 | V/mil | 106,023 |
| Volume Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms/cm | 1010 | Mohms/cm | 1010 |
| Volume Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms/cm | 1010 | Mohms/cm | 109 |
| Surface Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms | 108 | Mohms | 108 |
| Surface Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms | 108 | Mohms | 108 |
| Flex Strength(MD) | IPC-650 2.4.4 | psi | 14,057 | N/mm2 | 96.91 |
| Flex Strength(CD) | IPC-650 2.4.4 | psi | 12,955 | N/mm2 | 89.32 |
| Peel Stength(½ oz.ed copper) | IPC-650 2.4.8 | Ibs./inch | 11 | N/mm | 1.96 |
| Peel Stength(1 oz.CL1 copper) | IPC-650 2.4.8 | Ibs./inch | 16 | N/mm | 2.86 |
| Peel Stength(1 oz..CV1 copper) | IPC-650 2.4.8 | Ibs./inch | 17 | N/mm | 3.04 |
| Peel Stength | IPC-650 2.4.8(after elevated temp.) | Ibs./inch | 13 | N/mm | 2.32 |
| Young's Modulus(MD) | ASTM D 3039/IPC-650 2.4.19 | psi | 1.4 x 106 | N/mm2 | 9.65 x 103 |
| Poisson's Ratio(MD) | ASTM D 3039/IPC-650 2.4.19 | 0.21 | 0.21 | ||
| Thermal Conductivity | ASTM F 433 | W/M*K | 0.22 | W/M*K | 0.22 |
| Dimensional Stability(MD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.038 | -0.038 | |
| Dimensional Stability(CD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.031 | -0.031 | |
| Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.19 | g/cm3 | 2.19 |
| CTE(X axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 26 | ppm/℃ | 26 |
| CTE(Y axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 15 | ppm/℃ | 15 |
| CTE(Z axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 217 | ppm/℃ | 217 |
| NASA Outgassing(% TML) | 0.01 | 0.01 | |||
| NASA Outgassing(% CVCM) | 0.01 | 0.01 | |||
| NASA Outgassing(% WVR) | 0.00 | 0.00 | |||
| UL-94 Flammability Rating | UL-94 | V-0 | V-0 | ||
Benefits:
Dimensional Stability: The TLY-5 PCB maintains its shape and size, even under challenging conditions, ensuring reliable operation and precise circuit alignment.
Lowest Dissipation Factor: The low dissipation factor minimizes signal loss and distortion, resulting in high-quality signal transmission and improved system performance.
Low Moisture Absorption: The low moisture absorption rate enhances the PCB's durability and resistance to moisture-related issues, ensuring long-term reliability.
High Copper Peel Strength: The TLY-5 PCB boasts high copper peel strength, ensuring secure adhesion between layers and excellent mechanical reliability.
Uniform & Consistent DK: The TLY-5 material offers uniform and consistent dielectric constant, enabling predictable and accurate circuit performance.
| PCB Material: | Lightweight Woven Fiberglass |
| Designation: | TLY-5 |
| Dielectric Constant: | 2.2 |
| Dissipation Factor | 0.0009 10GHz |
| Layer Count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper Weight: | 1oz (35µm), 2oz (70µm) |
| Laminate Thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| PCB Size: | ≤400mm X 500mm |
| Solder Mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface Finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
PCB Stackup:
This PCB is a 2-layer rigid board with a copper layer of 35 μm on both sides. With a TLY-5 core thickness of 1.524 mm (60 mils), providing a sturdy and reliable design.
PCB Construction Details:
This PCB comes in a size of 127.72mm x 97.07mm with a tolerance of +/- 0.15mm. It supports a minimum trace/space of 5/6 mils and a minimum hole size of 0.4mm. The finished board thickness is 1.6mm, and the finished copper weight is 1oz (1.4 mils) on the outer layers. The PCB features a via plating thickness of 20 μm and is finished with immersion gold for optimal performance. The PCB does not have top or bottom silkscreen or solder mask. Each PCB undergoes a rigorous 100% electrical test before shipment, ensuring uncompromised functionality.
PCB Statistics:
This PCB contains 91 components and features a total of 238 pads, including 96 thru-hole pads and 142 top surface mount technology (SMT) pads. There are no bottom SMT pads. It also includes 161 vias, facilitating efficient electrical connections, and supports 5 nets, allowing for versatile circuit configurations.
Type of Artwork Supplied: The TLY-5 PCB is compatible with Gerber RS-274-X, a widely used standard for PCB artwork.
Quality Standard: This PCB adheres to the IPC-Class-2 standard, ensuring high-quality manufacturing and assembly.
Availability: The TLY-5 High-Performance PCB is available worldwide, making it accessible to customers across the globe.
Typical Applications:
The TLY-5 PCB is ideally suited for a wide range of applications, including:
Automotive Radar
Satellite/Cellular Communications
Power Amplifiers
LNBs, LNAs, LNCs
Aerospace
Ka, E and W band Applications
The TLY-5 High-Performance PCB enables engineers and designers in various industries to develop cutting-edge systems for high-frequency applications. With its unmatched stability, low dissipation factor, and reliable construction, the TLY-5 empowers users to create innovative solutions with confidence.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
