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60mil TLY-5 RF PCB Board 1OZ 1.6mm No Soldermask And No Silkscreen With ENIG Finished

60mil TLY-5 RF PCB Board 1OZ 1.6mm No Soldermask And No Silkscreen With ENIG Finished

MOQ: 1PCS
Price: USD9.99/PCS-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Highlight:

RF PCB Board No Silkscreen

,

RF PCB Board 60mil

,

1.6mm Radio Frequency Circuit Board

Product Description

Introducing our newly shipped PCB which built on TLY-5 high frequency laminates. The TLY-5 High-Performance substrate is an advanced circuit material designed to meet the demanding requirements of various high-frequency applications. With its exceptional stability, low dissipation factor, and reliable construction, this PCB offers unparalleled performance and reliability. Let's explore the features, benefits, and applications that set the TLY-5 apart from the rest.

 

TLY-5 Introduction:
The TLY-5 laminates are manufactured using lightweight woven fiberglass, resulting in a dimensionally stable PCB material. The woven matrix in the TLY-5 material provides enhanced mechanical stability, making it suitable for high-volume manufacturing. The low dissipation factor makes it ideal for automotive radar applications designed at 77 GHz and other antennas operating in millimeter-wave frequencies.

 

Features:

Dielectric Constant (DK): The TLY-5 offers a dielectric constant of 2.2 with an impressive tolerance of 0.02 at 10 GHz and 23°C, ensuring precise and consistent electrical characteristics.
 

Low Loss Tangent: With a low loss tangent of 0.0009 at 10 GHz, this PCB minimizes signal loss and distortion, enabling high-quality signal transmission.
 

Density: The TLY-5 material has a specific gravity of 2.19 g/cm^3, providing a lightweight yet durable solution for various applications.
Moisture Absorption: The PCB exhibits a low moisture absorption rate of 0.02%, contributing to its excellent dimensional stability and resistance to moisture-related issues.

 

Coefficient of Thermal Expansion (CTE): The TLY-5 PCB features a CTE of 26 ppm/°C (X-axis), 15 ppm/°C (Y-axis), and 217 ppm/°C (Z-axis), ensuring stability and minimizing dimensional changes across a wide temperature range.
 

TLY TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK at 10 GHz IPC-650 2.5.5.5   2.2   2.2
Df at 10 GHz IPC-650 2.5.5.5   0.0009   0.0009
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Dielectric Strength ASTM D 149 V/mil 2,693 V/mil 106,023
Volume Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms/cm 1010 Mohms/cm 1010
Volume Resistivity IPC-650 2.5.17.1(after humidity) Mohms/cm 1010 Mohms/cm 109
Surface Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms 108 Mohms 108
Surface Resistivity IPC-650 2.5.17.1(after humidity) Mohms 108 Mohms 108
Flex Strength(MD) IPC-650 2.4.4 psi 14,057 N/mm2 96.91
Flex Strength(CD) IPC-650 2.4.4 psi 12,955 N/mm2 89.32
Peel Stength(½ oz.ed copper) IPC-650 2.4.8 Ibs./inch 11 N/mm 1.96
Peel Stength(1 oz.CL1 copper) IPC-650 2.4.8 Ibs./inch 16 N/mm 2.86
Peel Stength(1 oz..CV1 copper) IPC-650 2.4.8 Ibs./inch 17 N/mm 3.04
Peel Stength IPC-650 2.4.8(after elevated temp.) Ibs./inch 13 N/mm 2.32
Young's Modulus(MD) ASTM D 3039/IPC-650 2.4.19 psi 1.4 x 106 N/mm2 9.65 x 103
Poisson's Ratio(MD) ASTM D 3039/IPC-650 2.4.19   0.21   0.21
Thermal Conductivity ASTM F 433 W/M*K 0.22 W/M*K 0.22
Dimensional Stability(MD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.038   -0.038
Dimensional Stability(CD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.031   -0.031
Density(Specific Gravity) ASTM D 792 g/cm3 2.19 g/cm3 2.19
CTE(X axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 26 ppm/℃ 26
CTE(Y axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 15 ppm/℃ 15
CTE(Z axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 217 ppm/℃ 217
NASA Outgassing(% TML)     0.01   0.01
NASA Outgassing(% CVCM)     0.01   0.01
NASA Outgassing(% WVR)     0.00   0.00
UL-94 Flammability Rating UL-94   V-0   V-0

 

Benefits:
Dimensional Stability: The TLY-5 PCB maintains its shape and size, even under challenging conditions, ensuring reliable operation and precise circuit alignment.

 

Lowest Dissipation Factor: The low dissipation factor minimizes signal loss and distortion, resulting in high-quality signal transmission and improved system performance.
 

Low Moisture Absorption: The low moisture absorption rate enhances the PCB's durability and resistance to moisture-related issues, ensuring long-term reliability.
 

High Copper Peel Strength: The TLY-5 PCB boasts high copper peel strength, ensuring secure adhesion between layers and excellent mechanical reliability.
 

Uniform & Consistent DK: The TLY-5 material offers uniform and consistent dielectric constant, enabling predictable and accurate circuit performance.
 

PCB Material: Lightweight Woven Fiberglass
Designation: TLY-5
Dielectric Constant: 2.2
Dissipation Factor 0.0009 10GHz
Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper Weight: 1oz (35µm), 2oz (70µm)
Laminate Thickness: 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB Size: ≤400mm X 500mm
Solder Mask: Green, Black, Blue, Yellow, Red etc.
Surface Finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

PCB Stackup:
This PCB is a 2-layer rigid board with a copper layer of 35 μm on both sides. With a TLY-5 core thickness of 1.524 mm (60 mils), providing a sturdy and reliable design.

 

PCB Construction Details:
This PCB comes in a size of 127.72mm x 97.07mm with a tolerance of +/- 0.15mm. It supports a minimum trace/space of 5/6 mils and a minimum hole size of 0.4mm. The finished board thickness is 1.6mm, and the finished copper weight is 1oz (1.4 mils) on the outer layers. The PCB features a via plating thickness of 20 μm and is finished with immersion gold for optimal performance. The PCB does not have top or bottom silkscreen or solder mask. Each PCB undergoes a rigorous 100% electrical test before shipment, ensuring uncompromised functionality.

 

PCB Statistics:
This PCB contains 91 components and features a total of 238 pads, including 96 thru-hole pads and 142 top surface mount technology (SMT) pads. There are no bottom SMT pads. It also includes 161 vias, facilitating efficient electrical connections, and supports 5 nets, allowing for versatile circuit configurations.

 

Type of Artwork Supplied: The TLY-5 PCB is compatible with Gerber RS-274-X, a widely used standard for PCB artwork.

 

Quality Standard: This PCB adheres to the IPC-Class-2 standard, ensuring high-quality manufacturing and assembly.

 

Availability: The TLY-5 High-Performance PCB is available worldwide, making it accessible to customers across the globe.

 

60mil TLY-5 RF PCB Board 1OZ 1.6mm No Soldermask And No Silkscreen With ENIG Finished 0

 

Typical Applications:
The TLY-5 PCB is ideally suited for a wide range of applications, including:

Automotive Radar
Satellite/Cellular Communications
Power Amplifiers
LNBs, LNAs, LNCs
Aerospace
Ka, E and W band Applications

 

The TLY-5 High-Performance PCB enables engineers and designers in various industries to develop cutting-edge systems for high-frequency applications. With its unmatched stability, low dissipation factor, and reliable construction, the TLY-5 empowers users to create innovative solutions with confidence.

 

60mil TLY-5 RF PCB Board 1OZ 1.6mm No Soldermask And No Silkscreen With ENIG Finished 1

 

products
PRODUCTS DETAILS
60mil TLY-5 RF PCB Board 1OZ 1.6mm No Soldermask And No Silkscreen With ENIG Finished
MOQ: 1PCS
Price: USD9.99/PCS-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Minimum Order Quantity:
1PCS
Price:
USD9.99/PCS-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

RF PCB Board No Silkscreen

,

RF PCB Board 60mil

,

1.6mm Radio Frequency Circuit Board

Product Description

Introducing our newly shipped PCB which built on TLY-5 high frequency laminates. The TLY-5 High-Performance substrate is an advanced circuit material designed to meet the demanding requirements of various high-frequency applications. With its exceptional stability, low dissipation factor, and reliable construction, this PCB offers unparalleled performance and reliability. Let's explore the features, benefits, and applications that set the TLY-5 apart from the rest.

 

TLY-5 Introduction:
The TLY-5 laminates are manufactured using lightweight woven fiberglass, resulting in a dimensionally stable PCB material. The woven matrix in the TLY-5 material provides enhanced mechanical stability, making it suitable for high-volume manufacturing. The low dissipation factor makes it ideal for automotive radar applications designed at 77 GHz and other antennas operating in millimeter-wave frequencies.

 

Features:

Dielectric Constant (DK): The TLY-5 offers a dielectric constant of 2.2 with an impressive tolerance of 0.02 at 10 GHz and 23°C, ensuring precise and consistent electrical characteristics.
 

Low Loss Tangent: With a low loss tangent of 0.0009 at 10 GHz, this PCB minimizes signal loss and distortion, enabling high-quality signal transmission.
 

Density: The TLY-5 material has a specific gravity of 2.19 g/cm^3, providing a lightweight yet durable solution for various applications.
Moisture Absorption: The PCB exhibits a low moisture absorption rate of 0.02%, contributing to its excellent dimensional stability and resistance to moisture-related issues.

 

Coefficient of Thermal Expansion (CTE): The TLY-5 PCB features a CTE of 26 ppm/°C (X-axis), 15 ppm/°C (Y-axis), and 217 ppm/°C (Z-axis), ensuring stability and minimizing dimensional changes across a wide temperature range.
 

TLY TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK at 10 GHz IPC-650 2.5.5.5   2.2   2.2
Df at 10 GHz IPC-650 2.5.5.5   0.0009   0.0009
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Dielectric Strength ASTM D 149 V/mil 2,693 V/mil 106,023
Volume Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms/cm 1010 Mohms/cm 1010
Volume Resistivity IPC-650 2.5.17.1(after humidity) Mohms/cm 1010 Mohms/cm 109
Surface Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms 108 Mohms 108
Surface Resistivity IPC-650 2.5.17.1(after humidity) Mohms 108 Mohms 108
Flex Strength(MD) IPC-650 2.4.4 psi 14,057 N/mm2 96.91
Flex Strength(CD) IPC-650 2.4.4 psi 12,955 N/mm2 89.32
Peel Stength(½ oz.ed copper) IPC-650 2.4.8 Ibs./inch 11 N/mm 1.96
Peel Stength(1 oz.CL1 copper) IPC-650 2.4.8 Ibs./inch 16 N/mm 2.86
Peel Stength(1 oz..CV1 copper) IPC-650 2.4.8 Ibs./inch 17 N/mm 3.04
Peel Stength IPC-650 2.4.8(after elevated temp.) Ibs./inch 13 N/mm 2.32
Young's Modulus(MD) ASTM D 3039/IPC-650 2.4.19 psi 1.4 x 106 N/mm2 9.65 x 103
Poisson's Ratio(MD) ASTM D 3039/IPC-650 2.4.19   0.21   0.21
Thermal Conductivity ASTM F 433 W/M*K 0.22 W/M*K 0.22
Dimensional Stability(MD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.038   -0.038
Dimensional Stability(CD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.031   -0.031
Density(Specific Gravity) ASTM D 792 g/cm3 2.19 g/cm3 2.19
CTE(X axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 26 ppm/℃ 26
CTE(Y axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 15 ppm/℃ 15
CTE(Z axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 217 ppm/℃ 217
NASA Outgassing(% TML)     0.01   0.01
NASA Outgassing(% CVCM)     0.01   0.01
NASA Outgassing(% WVR)     0.00   0.00
UL-94 Flammability Rating UL-94   V-0   V-0

 

Benefits:
Dimensional Stability: The TLY-5 PCB maintains its shape and size, even under challenging conditions, ensuring reliable operation and precise circuit alignment.

 

Lowest Dissipation Factor: The low dissipation factor minimizes signal loss and distortion, resulting in high-quality signal transmission and improved system performance.
 

Low Moisture Absorption: The low moisture absorption rate enhances the PCB's durability and resistance to moisture-related issues, ensuring long-term reliability.
 

High Copper Peel Strength: The TLY-5 PCB boasts high copper peel strength, ensuring secure adhesion between layers and excellent mechanical reliability.
 

Uniform & Consistent DK: The TLY-5 material offers uniform and consistent dielectric constant, enabling predictable and accurate circuit performance.
 

PCB Material: Lightweight Woven Fiberglass
Designation: TLY-5
Dielectric Constant: 2.2
Dissipation Factor 0.0009 10GHz
Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper Weight: 1oz (35µm), 2oz (70µm)
Laminate Thickness: 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB Size: ≤400mm X 500mm
Solder Mask: Green, Black, Blue, Yellow, Red etc.
Surface Finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

PCB Stackup:
This PCB is a 2-layer rigid board with a copper layer of 35 μm on both sides. With a TLY-5 core thickness of 1.524 mm (60 mils), providing a sturdy and reliable design.

 

PCB Construction Details:
This PCB comes in a size of 127.72mm x 97.07mm with a tolerance of +/- 0.15mm. It supports a minimum trace/space of 5/6 mils and a minimum hole size of 0.4mm. The finished board thickness is 1.6mm, and the finished copper weight is 1oz (1.4 mils) on the outer layers. The PCB features a via plating thickness of 20 μm and is finished with immersion gold for optimal performance. The PCB does not have top or bottom silkscreen or solder mask. Each PCB undergoes a rigorous 100% electrical test before shipment, ensuring uncompromised functionality.

 

PCB Statistics:
This PCB contains 91 components and features a total of 238 pads, including 96 thru-hole pads and 142 top surface mount technology (SMT) pads. There are no bottom SMT pads. It also includes 161 vias, facilitating efficient electrical connections, and supports 5 nets, allowing for versatile circuit configurations.

 

Type of Artwork Supplied: The TLY-5 PCB is compatible with Gerber RS-274-X, a widely used standard for PCB artwork.

 

Quality Standard: This PCB adheres to the IPC-Class-2 standard, ensuring high-quality manufacturing and assembly.

 

Availability: The TLY-5 High-Performance PCB is available worldwide, making it accessible to customers across the globe.

 

60mil TLY-5 RF PCB Board 1OZ 1.6mm No Soldermask And No Silkscreen With ENIG Finished 0

 

Typical Applications:
The TLY-5 PCB is ideally suited for a wide range of applications, including:

Automotive Radar
Satellite/Cellular Communications
Power Amplifiers
LNBs, LNAs, LNCs
Aerospace
Ka, E and W band Applications

 

The TLY-5 High-Performance PCB enables engineers and designers in various industries to develop cutting-edge systems for high-frequency applications. With its unmatched stability, low dissipation factor, and reliable construction, the TLY-5 empowers users to create innovative solutions with confidence.

 

60mil TLY-5 RF PCB Board 1OZ 1.6mm No Soldermask And No Silkscreen With ENIG Finished 1

 

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