Double Sided RF-60TC PCB Board Built On 25mil Substrates With Immersion Gold

Today, I'm happy to be the host as we delve into the world of RF-60TC high-frequency PCBs, which offer enhanced heat dissipation and remarkably low loss.

RF-60TC is a high-performance PCB material that combines PTFE and ceramic-filled fiberglass substrates. It is specifically designed for high-power RF and microwave applications, delivering superior dielectric heat dissipation and minimal losses. This unique material enables lower operating temperatures for high-power applications and enhances performance and efficiency for miniaturized antenna applications in the 6.15 DK market segment.

Now, let's explore the detailed properties of RF-60TC.

RF-60TC Typical Properties

The dielectric constant (Dk) of RF-60TC is 6.15 ± 0.15 at 10 GHz, while the dielectric loss tangent (Df) is an impressive 0.002.

In terms of electrical properties, RF-60TC boasts a dielectric breakdown voltage of 55 kV and a dielectric strength of 550 V/mil.

Furthermore, RF-60TC exhibits excellent arc resistance, lasting for over 180 seconds. Even after exposure to humidity, the surface resistivity and volume resistivity remain at a remarkable 1.0 x 10^8 Mohm.

Shifting our focus to mechanical properties, the flexural strength in the machine direction (MD) is 10,000 psi, while in the cross direction (CD), it is 9,000 psi.

For tensile strength, RF-60TC demonstrates 9,000 psi in the MD and 7,000 psi in the CD.

The Young's modulus in the MD is measured at 721 kpsi, and the Poisson's ratio in the MD is 0.155.

Regarding dimensional stability, RF-60TC showcases a minimal dimensional change of 0.01 mils/in in the MD after bake, while in the CD, it is 0.69 mils/in. After thermal stress, the dimensional stability reaches 0.06 mils/in in the MD and 0.8 mils/in in the CD.

Moving on to thermal properties, RF-60TC exhibits excellent thermal conductivity. For unclad material, the thermal conductivity is 0.9 W/MK, while for half ounces and 1oz copper, it reaches 1 W/MK and 1.05 W/MK, respectively.

The thermal coefficient of dielectric constant (TCDk) for RF-60TC is -3.581 ppm/°C, and the coefficient of thermal expansion (CTE) is 9.9 ppm/°C for the X and Y axes, with a slightly higher value of 40 ppm/°C for the Z axis.

In terms of physical properties, RF-60TC exhibits a moisture absorption rate of only 0.03%. The peel strength is excellent, with 8 lbs/in for 1 oz. ED copper. It has a density of 2.84 g/cm3 and a specific heat of 0.94 J/gK. The material's thermal decomposition temperature (Td) is 500°C for 2% weight loss and 515°C for 5% weight loss. It also holds a flammability rating of V-0 according to UL 94.

PCB Capability (RF-60TC)

At Bicheng PCB, we offer a comprehensive range of PCBs, including single-layer, double-layer, multi-layer, and hybrid options, all utilizing RF-60TC.

RF-60TC PCBs are available in various thicknesses, starting from the thinnest at 5 mils and incrementing in 5-mil steps, such as 10 mils, 20 mils, 25 mils, 30 mils, and 60 mils, among others.

You can choose between 1oz and 2oz finished copper for the track lines.

Our PCBs can reach a maximum size of 400mm x 500mm, accommodating single boards or multiple designs within a single panel.

For customization, we offer a selection of solder mask colors, including green, black, blue, red, and yellow.

In addition, we provide various surface finish options to meet diverse PCB requirements. These options include HASL, immersion gold, immersion silver, immersion tin, OSP, ENEPIG, pure gold, and bare copper.

RF-60TC PCBs find application in a wide range of fields, including high-power amplifiers, miniaturized antennas, GPS devices, patch antennas, RFID readers, filters, couplers, and satellites, among others.

Conclusion

RF-60TC PCBs are mechanically supported laminates with high thermal conductivity, offering three to five times the thermal conductivity of FR-4 alternatives. These PCBs excel in heat dissipation and are ideal for high-power RF and microwave applications requiring efficient and reliable performance.