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Thermoset Microwave Material Printed Circuit Board,
TMM10 High Frequency PCB,
150mil High Frequency PCB
Today, we want to talk about an impressive thermoset microwave material called TMM10 PCB.
Rogers TMM10 PCB is a ceramic thermoset polymer composite specifically designed to ensure high reliability of plated-through-hole (PTH) connections in strip-line and micro-strip applications. It combines the advantages of both PTFE and ceramic substrates while surpassing them in terms of mechanical properties and production techniques.
Let's dive into the details by reviewing the TMM10 data sheet.
TMM10 offers a high dielectric constant, with a process Dk value of 9.2. This characteristic makes it especially useful for compact devices like filters and couplers that require minimal size.
The dissipation factor of TMM10 is impressively low, measuring only 0.0022 at 10 GHz.
Next, let's consider the thermal coefficient of dielectric constant, also known as the temperature coefficient of dielectric constant (TCDk). TMM10 boasts a TCDk of 38 (absolute value), indicating excellent stability in varying temperature environments. This feature makes it ideal for applications in automotive electronics and 5G base stations where PCBs are exposed to significant temperature changes.
TMM10 demonstrates favorable volume and surface resistivity.
With a decomposition temperature (Td) capable of withstanding 425℃ (determined through Thermogravimetric Analysis - TGA), TMM10 ensures a safe assembly process during PCB manufacturing.
TMM10's coefficient of thermal expansion in the X, Y, and Z directions is similar to that of copper, providing resistance against creep and cold flow, thus preserving its mechanical properties.
As a thermal management board, TMM10 exhibits a thermal conductivity of 0.76 W/m/K.
Moving on, TMM10 has a copper peel strength of 5.0 lbs/inch (0.9 N/mm) after thermal stress.
Its flexural strength in both the machine and cross directions is 13.62 Kpsi, and the flexural modulus measures 1.79 Mpsi.
For 1.27mm thickness, the material's moisture absorption is 0.09%, while it increases to 0.2% for 3.18mm thickness.
TMM10's specific gravity is 2.77, and its specific heat capacity is 0.74 J/g/K.
Moreover, TMM10 is compatible with lead-free processes.
|TMM10 Typical Value|
|Dielectric Constant, εProcess||9.20±0.23||Z||10 GHz||IPC-TM-650 220.127.116.11|
|Dielectric Constant, εDesign||9.8||-||-||8GHz to 40 GHz||Differential Phase Length Method|
|Dissipation Factor (process)||0.0022||Z||-||10 GHz||IPC-TM-650 18.104.22.168|
|Thermal Coefficient of dielectric constant||-38||-||ppm/℃||-55℃-125℃||IPC-TM-650 22.214.171.124|
|Volume Resistivity||2 x 108||-||Mohm.cm||-||ASTM D257|
|Surface Resistivity||4 x 107||-||Mohm||-||ASTM D257|
|Decomposition Temperature(Td)||425||425||℃TGA||-||ASTM D3850|
|Coefficient of Thermal Expansion - X Y Z||21,21,20||X,Y,Z||ppm/℃||0 to 140 ℃||ASTM E 831 IPC-TM-650, 2.4.41|
|Thermal Conductivity||0.76||Z||W/m/K||80 ℃||ASTM C518|
|Copper Peel Strength after Thermal Stress||5.0 (0.9)||X,Y||lbs/inch (N/mm)||after solder float 1 oz. EDC||IPC-TM-650 Method 2.4.8|
|Flexural Strength (MD/CMD)||13.62||X,Y||kpsi||A||ASTM D790|
|Flexural Modulus (MD/CMD)||1.79||X,Y||Mpsi||A||ASTM D790|
|Moisture Absorption||1.27mm (0.050")||0.09||-||%||D/24/23||ASTM D570|
|Specific Gravity||2.77||-||-||A||ASTM D792|
|Specific Heat Capacity||0.74||-||J/g/K||A||Calculated|
|Lead-Free Process Compatible||YES||-||-||-||-|
Now, let's take a look at our PCB capabilities with TMM10 material. We offer single-layer, double-layer, multi-layer, and hybrid designs. The finished copper on tracks can be 1oz or 2oz.
TMM10 PCBs are available in various thicknesses, including commonly used options like 20 mils, 30 mils, 50 mils, and 60 mils. We also provide high thicknesses such as 200 mils, 300 mils, 500 mils, and more.
Our maximum PCB size on high-frequency materials is 400mm by 500mm, accommodating single boards or multiple designs on a panel.
We offer solder masks in green, black, blue, red, yellow, and other colors in-house.
In terms of surface finishes, we provide immersion gold, HASL, immersion silver, immersion tin, OSP, ENEPIG, and pure gold to protect the SMD pads.
|PCB material:||Ceramic, Hydrocarbon, Thermoset Polymer Composites|
|Dielectric constant:||9.20 ±0.23|
|Layer count:||Double layer, Multi-layer, Hybrid PCB|
|Copper weight:||1oz (35µm), 2oz (70µm)|
|PCB thickness:||15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)|
|PCB size:||≤400mm X 500mm|
|Solder mask:||Green, Black, Blue, Red, Yellow etc.|
|Surface finish:||Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold etc..|
Now, let's take a moment to appreciate a TMM10 PCB example on the screen. This particular board is 150 mils thick and features immersion gold finish. Its elegant craftsmanship and simplicity make it suitable for various applications, including power amplifiers and combiners, filters and couplers, satellite communication systems, global positioning system antennas, and patch antennas.
In conclusion, TMM10 materials are highly resistant to process chemicals, reducing damage during the circuit fabrication process. They eliminate the need for sodium napthanate treatment before electroless plating and enable reliable wire bonding due to their thermoset resin.
Thank you for your reading, and we'll see you next time!
Contact Person: Ms. Ivy Deng