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Highlight: | 50mil High Frequency PCB Board,High Frequency PCB 1.27mm,Immersion Silver Printed Circuit Board |
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Introducing our newly shipped PCB, an advanced solution crafted to meet the rigorous demands of modern electronic applications. Built with precision using RT/duroid 6010.2LM ceramic PTFE composites, this 2-layer rigid PCB offers outstanding performance and unwavering reliability.
With an array of impressive features and benefits, it is the perfect choice for a diverse range of applications, including patch antennas, satellite communications systems, power amplifiers, aircraft collision avoidance systems, and ground radar warning systems.
Built with a dielectric constant of 10.2 at 10 GHz and a dissipation factor of 0.0023 at 10 GHz, this PCB ensures low loss and high signal integrity, making it suitable for operating at X-band or below. Its high dielectric constant allows for circuit size reduction, while the low moisture absorption minimizes the effects of moisture on electrical loss.
The PCB's stackup consists of finished copper layers with a weight of 35um, sandwiching the RT/duroid 6010.2LM dielectric, which has a thickness of 50 mil (1.27mm). This low Z-axis expansion design guarantees reliable plated through holes in multilayer boards. The board itself measures 40mm x 23mm, with a finished thickness of 1.4mm, ensuring a compact and durable solution for your electronic designs.
With a minimum trace/space of 7/8 mils and a minimum hole size of 0.3mm, this PCB provides precise and efficient routing options. The 100% electrical test used during production ensures the highest level of quality control. The board's impedance is carefully controlled at 50 ohms, with a track/gap size of 15mil/14mil.
The artwork for this PCB is supplied in Gerber RS-274-X format, adhering to the IPC-Class-2 standard. It is suitable for worldwide use, and our service area extends globally to cater to your needs.
In case of any technical inquiries or questions, please feel free to contact Ivy at sales10@bichengpcb.com. We are dedicated to providing excellent customer support and ensuring your satisfaction.
Property | RT/duroid 6010 | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 10.2±0.25 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline | |
Dielectric Constant,εDesign | 10.7 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor,tanδ | 0.0023 | Z | 10 GHz/A | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | -425 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 5 x 105 | Mohm.cm | A | IPC 2.5.17.1 | |
Surface Resistivity | 5 x 106 | Mohm | A | IPC 2.5.17.1 | |
Tensile Properties | ASTM D638 (0.1/min. strain rate) | ||||
Young's Modulus | 931(135) 559(81) | X Y | MPa(kpsi) | A | |
Ultimate Stress | 17(2.4) 13(1.9) | X Y | MPa(kpsi) | A | |
Ultimate Strain | 9 to 15 7 to 14 | X Y | % | A | |
Compressive Properties | ASTM D695 (0.05/min. strain rate) | ||||
Young's Modulus | 2144 (311) | Z | MPa(kpsi) | A | |
Ultimate Stress | 47(6.9) | Z | MPa(kpsi) | A | |
Ultimate Strain | 25 | Z | % | ||
Flexural Modulus | 4364 (633) 3751 (544) | X | MPa(kpsi) | A | ASTM D790 |
Ultimate Stress | 36 (5.2) 32 (4.4) | X Y | MPa(kpsi) | A | |
Deformation under load | 0.26 1.3 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |
Moisture Absorption | 0.01 | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 | |
Thermal Conductivity | 0.86 | W/m/k | 80℃ | ASTM C518 | |
Coefficient of Thermal Expansion | 24 24 47 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
Td | 500 | ℃ TGA | ASTM D3850 | ||
Density | 3.1 | g/cm3 | ASTM D792 | ||
Specific Heat | 1.00(0.239) | j/g/k (BTU/ib/OF) |
Calculated | ||
Copper Peel | 12.3 (2.1) | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
Unleashing the Power of RT Duroid 6010: Revolutionizing PCB Performance and Reliability
Introduction:
RT duroid 6010 is a groundbreaking ceramic PTFE composite material that has redefined the capabilities of printed circuit boards (PCBs). With its exceptional dielectric properties, thermal stability, and reliability, RT duroid 6010 has become the go-to choice for demanding electronic applications. In this article, we delve into the remarkable features and benefits of RT duroid 6010, exploring its impact on circuit size reduction, signal integrity, and overall performance.
I. Understanding the Dielectric Constant and Dissipation Factor
- Exploring the Dielectric Constant: Unveiling the impressive dielectric constant of 10.2 at 10 GHz/23°C, as determined by IPC-TM-650 2.5.5.5 Clamped stripline method.
- Unraveling the Dissipation Factor: Analyzing the ultra-low dissipation factor of 0.0023 at 10 GHz, ensuring minimal signal loss and improved overall performance.
II. Thermal Stability and Reliability
- Thermal Coefficient of ε: Examining the thermal coefficient of ε, with a range of -425 ppm/°C, ensuring stability across a wide temperature range (-50°C to 170°C).
- Moisture Absorption: Highlighting the low moisture absorption rate of 0.01%, reducing the impact of moisture on electrical loss and maintaining consistent performance, as per IPC-TM-650 2.6.2.1.
PCB Material: | Ceramic-PTFE composite |
Designator: | RT/duroid 6010LM |
Dielectric constant: | 10.2 ±0.25 (process); 10.7 (design) |
Layer count: | 1 Layer, 2 Layer |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Dielectric thickness: | 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.90mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP. |
III. Enhanced Design Flexibility
- Tight DK and Thickness Control: Showcasing the precise control over dielectric constant (DK) and thickness, enabling repeatable circuit performance and design consistency.
- Minimum Trace/Space and Hole Size: Exploring the design flexibility provided by a minimum trace/space of 7/8 mils and minimum hole size of 0.3mm, allowing for intricate and compact PCB layouts.
IV. Superior Mechanical Properties
- Tensile and Compressive Properties: Examining the impressive Young's modulus, ultimate stress, and strain values, demonstrating the material's mechanical strength and durability.
- Flexural Modulus: Highlighting the high flexural modulus, ensuring resistance to bending and deformation under load, as per ASTM D790 and ASTM D261 standards.
V. Uncompromising Performance in Challenging Environments
- Thermal Conductivity: Assessing the thermal conductivity of 0.86 W/m/K at 80°C, facilitating efficient heat dissipation and thermal management.
- Coefficient of Thermal Expansion: Investigating the material's coefficient of thermal expansion (CTE) in X, Y, and Z directions, ensuring dimensional stability and reliability.
VI. Applications and Future Possibilities
- Patch Antennas: Exploring how RT duroid 6010 is revolutionizing the performance of patch antennas.
- Satellite Communications Systems: Discussing the advantages of RT duroid 6010 in satellite communication applications.
- Power Amplifiers: Highlighting the impact of RT duroid 6010 on power amplifier designs for enhanced performance.
- Aircraft Collision Avoidance Systems: Showcasing the reliability and stability of RT duroid 6010 in aircraft collision avoidance systems.
- Ground Radar Warning Systems: Discussing the benefits of RT duroid 6010 in ground radar warning systems.
Conclusion:
RT duroid 6010 has emerged as a game-changer in the world of PCBs, offering exceptional performance, reliability, and design flexibility. With its impressive dielectric properties, thermal stability, and mechanical strength, RT duroid 6010 opens up new possibilities for advanced electronic applications. Whether it's reducing circuit size, ensuring low loss, or maintaining reliable performance in challenging environments, RT duroid 6010 continues to push the boundaries of PCB technology. Embrace the power of RT duroid 6010 and unlock the full potential of your electronic designs.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848