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TC350 RF PCB Based On 20mil Substrate With Immersion Tin For Power Amplifier

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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TC350 RF PCB Based On 20mil Substrate With Immersion Tin For Power Amplifier

TC350 RF PCB Based On 20mil Substrate With Immersion Tin For Power Amplifier
TC350 RF PCB Based On 20mil Substrate With Immersion Tin For Power Amplifier TC350 RF PCB Based On 20mil Substrate With Immersion Tin For Power Amplifier

Large Image :  TC350 RF PCB Based On 20mil Substrate With Immersion Tin For Power Amplifier

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
High Light:

20mil PCB Substrate


Power Amplifier PCB Materials


Immersion Tin RF PCB Board

Today, we are happy to share our newly shipped PCB with you. A cutting-edge solution supplied to meet the demanding requirements of high-performance applications. With its woven fiberglass reinforced, ceramic filled, PTFE-based composite material, this PCB offers exceptional thermal conductivity, dielectric stability, and reliability across a wide temperature range.


Key Features:
- "Best in Class" Thermal Conductivity (1.0 W/mK) and Dielectric Constant Stability (-9 ppm/°C) ensure efficient heat dissipation and reliable signal transmission even in challenging environments.


- Very Low Loss Tangent provides higher amplifier or antenna efficiency, enabling superior performance in critical applications.

- Priced affordably for commercial applications, making it an accessible solution without compromising on quality or performance.

- Easier to drill than traditional commercial-based laminates, thanks to its thick and dense style woven glass construction.

- High Peel Strength ensures reliable copper adhesion, crucial for thermally stressed applications.


Construction Details:
This 2-layer rigid PCB features a TC350 Core with copper layers on both sides. The board dimensions are 98mm x 81mm, allowing for compact and efficient designs. With a finished board thickness of 0.6mm and a finished copper weight of 1oz (1.4 mils) on the outer layers, this PCB strikes the perfect balance between performance and flexibility. The PCB is finished with immersion tin surface coating, providing excellent solderability and corrosion resistance.



- Heat Dissipation and Management: The exceptional thermal conductivity of this PCB enables efficient heat dissipation, preventing overheating and ensuring optimal performance even in demanding applications.

- Improved Processing and Reliability: With its low loss tangent and dielectric stability, this PCB enhances signal integrity, reduces loss, and improves overall system reliability.

- Large Panel Sizes for Multiple Circuit Layout: This PCB allows for multiple circuit layouts within a single panel, reducing processing costs and maximizing efficiency.


Typical Applications:
- Power Amplifiers, Filters, and Couplers: This PCB is ideal for high-power applications that require efficient heat dissipation and reliable signal transmission.


- Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB): With its excellent thermal management properties, this PCB ensures reliable performance in tower-mounted applications.

- Thermally Cycled Antennas: The PCB's dielectric stability makes it suitable for antennas sensitive to dielectric drift caused by temperature variations.

- Microwave Combiner and Power Dividers: This PCB provides the performance and reliability needed for microwave combiners and power dividers in demanding environments.


Quality and Support:
Our PCBs adhere to IPC-Class-2 quality standards, ensuring high reliability and performance. We provide worldwide availability and offer technical support for any inquiries or assistance required. For technical questions, please contact Ivy at


Property Units Value Test Merthod
1. Electrical Properties  
Dielectric Constant (may vary by thickness)      
@1 MHz 3.50 IPC TM-650
@10 GHz 3.50 IPC TM-650
Dissipation Factor      
@1 MHz 0.0015 IPC TM-650
@10 GHz 0.0020 IPC TM-650
Temperature Coefficient of Dielectric    
TC r @ 10 GHz (-40-150°C) ppm/ºC -9 IPC TM-650
Volume Resistivity      
C96/35/90 MΩ-cm 7.4x106 IPC TM-650
E24/125 MΩ-cm 1.4x108  
Surface Resistivity      
C96/35/90 3.2x107 IPC TM-650
E24/125 4.3x108 IPC TM-650
Electrical Strength Volts/mil (kV/mm) 780 (31) IPC TM-650
Dielectric Breakdown kV 40 IPC TM-650 2.5.6
Arc Resistance sec >240 IPC TM-650 2.5.1
2.Thermal Properties  
Decomposition Temperature (Td)      
Initial °C 520 IPC TM-650
5% °C 567 IPC TM-650
T260 min >60 IPC TM-650
T288 min >60 IPC TM-650
T300 min >60 IPC TM-650
Thermal Expansion, CTE (x,y) 50-150ºC ppm/ºC 7, 7 IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC ppm/ºC 12 IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC) % 1.2 IPC TM-650 2.4.24
3. Mechanical Properties  
Peel Strength to Copper (1 oz/35 micron)      
After Thermal Stress lb/in (N/mm) 7 (1.2) IPC TM-650 2.4.8
At Elevated Temperatures (150ºC) lb/in (N/mm) 9 (1.6) IPC TM-650
After Process Solutions lb/in (N/mm) 7 (1.2) IPC TM-650 2.4.8
Young’s Modulus kpsi (MPa)   IPC TM-650
Flexural Strength (Machine/Cross) kpsi (MPa) 14/10 (97/69) IPC TM-650 2.4.4
Tensile Strength (Machine/Cross) kpsi (MPa) 11/8 (76/55) IPC TM-650
Compressive Modulus kpsi (MPa)   ASTM D-3410
Poisson’s Ratio   ASTM D-3039
4. Physical Properties  
Water Absorption % 0.05 IPC TM-650
Density, ambient 23ºC g/cm3 2.30 ASTM D792 Method A
Thermal Conductivity W/mK 0.72 ASTM D5470
Specific Heat J/gK 0.90 ASTM D5470
Flammability class V0 UL-94
NASA Outgassing, 125ºC, ≤10- 6 torr      
Total Mass Loss % 0.02 NASA SP-R-0022A
Collected Volatiles % 0.01 NASA SP-R-0022A
Water Vapor Recovered % 0.01 NASA SP-R-0022A

Unleashing the Power of TC350 PCB: Redefining High-Frequency Performance


Welcome to the world of TC350, an exceptional PCB designed to revolutionize high-frequency applications. In this article, we will explore the key features, benefits, and applications of TC350, backed by the data sheet. With its advanced electrical and thermal properties, TC350 sets a new benchmark for performance and reliability. Let's dive into the details and discover how TC350 can empower your high-frequency projects.


TC350 is a cutting-edge PCB that combines innovative design and advanced materials to deliver superior performance in high-frequency applications. With its exceptional electrical properties, TC350 ensures reliable signal transmission, minimal signal loss, and reduced crosstalk.


Let's see the following key properties of TC350:


1. Electrical Properties
TC350 exhibits a consistent dielectric constant of 3.50 across a wide frequency range, ensuring precise signal propagation and minimal distortions. Its low dissipation factor of 0.0015 at 1 MHz minimizes energy losses and enhances signal integrity even at high frequencies.


2. Thermal Properties
TC350 excels in thermal management with a high thermal conductivity of 0.72 W/mK. This property allows for efficient heat transfer, preventing overheating and ensuring optimal performance. The PCB also demonstrates exceptional thermal expansion properties, with a low z-axis expansion of 1.2% from 50 to 260oC, guaranteeing dimensional stability even in challenging thermal environments.


3. Mechanical Properties
TC350 boasts impressive mechanical strength, making it suitable for demanding applications. It exhibits excellent peel strength of 7 lb/in after thermal stress and meets industry standards for young's modulus. The PCB's flexural and tensile strengths of 14/10 kpsi (97/69 MPa) and 11/8 kpsi (76/55 MPa) respectively further enhance its mechanical integrity.


TC350 RF PCB Based On 20mil Substrate With Immersion Tin For Power Amplifier 0


4. Physical Properties
In addition to its electrical and thermal prowess, TC350 showcases remarkable physical properties. With a water absorption rate of only 0.05%, it remains dimensionally stable, even in humid conditions. The PCB's density of 2.30 g/cm3 and low flammability rating of V0 according to UL-94 ensure safety and compliance in various environments.


TC350 finds versatile applications in high-frequency projects where performance and reliability are paramount. It enables engineers to push the boundaries of high-frequency technology in power amplifiers, filters, couplers, tower-mounted amplifiers, thermally cycled antennas, and microwave combiners. Whether in telecommunication, aerospace, or industrial sectors, TC350 empowers engineers to design cutting-edge solutions.


In conclusion, TC350 PCB stands as a game-changer in high-frequency applications, offering exceptional electrical, thermal, and mechanical performance. With its stable dielectric constant, efficient heat dissipation, and reliable signal transmission, TC350 enables engineers to design cutting-edge solutions.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)