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| Highlight: | RF PCB Board 1oz,25mil High Frequency PCB,Immersion Gold High Frequency PCB Material |
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We are happy to share the newly shipped PCB, featuring RT/duroid 6010.2LM ceramic PTFE composites, renowned for their exceptional performance. With a dielectric constant of 10.2 at 10 GHz and 23°C, circuit size reduction is facilitated while maintaining optimal functionality. An ultra-low dissipation factor of 0.0023 at 10 GHz ensures efficient operation, particularly in X-band or lower frequency applications. The Z-axis expansion remains minimal, ensuring reliable plated through holes in multilayer boards. Operating within a temperature range of -40°C to +85°C, this PCB is designed to withstand varying environmental conditions.
Key features and benefits include:
- Circuit size reduction facilitated by a high dielectric constant
- Efficient operation with minimal signal loss, ideal for X-band or below
- Reliable plated through holes due to low Z-axis expansion
- Reduced impact of moisture on electrical loss through low moisture absorption
- Consistent circuit performance with tight εr and thickness control
The PCB is a 2-layer rigid design with a finished copper weight of 35um. It utilizes RT/duroid 6010.2LM dielectric material, measuring 25 mil (0.635mm) in thickness. Both sides of the PCB have a finished copper weight of 35um. With a finished board thickness of 0.8mm, it offers a compact and lightweight solution. The minimum trace/space is 8/9 mils, and the minimum hole size is 0.4mm. No blind or buried vias are present. Immersion Gold surface finish ensures high-quality and reliable performance. Silkscreen, solder mask, and electrical tests are not applied. The track/gap ratio of 13.39mil/10.24mil ensures controlled 50-ohm impedance.
Statistically, the PCB comprises 21 components, 35 total pads, 18 through-hole pads, 17 top SMT pads, and no bottom SMT pads. It offers 43 vias and 5 nets, providing versatile connectivity options.
The PCB adheres to the IPC-Class-2 standard, ensuring superior manufacturing and performance. For any technical inquiries or further information, please contact Ivy at sales10@bichengpcb.com. We pride ourselves on delivering exceptional customer support.
Our service area covers customers worldwide, allowing individuals from diverse locations to benefit from our high-performance PCB.
This PCB finds its applications in various fields, including patch antennas, satellite communications systems, power amplifiers, aircraft collision avoidance systems, and ground radar warning systems.
Upgrade your electronic designs with our reliable and high-performance PCB. Rely on our expertise and quality manufacturing to meet your specific requirements.
| Dielectric Constant,εProcess | 10.2±0.25 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline | |
| Dielectric Constant,εDesign | 10.7 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0023 | Z | 10 GHz/A | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -425 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 5 x 105 | Mohm.cm | A | IPC 2.5.17.1 | |
| Surface Resistivity | 5 x 106 | Mohm | A | IPC 2.5.17.1 | |
| Tensile Properties | ASTM D638 (0.1/min. strain rate) | ||||
| Young's Modulus | 931(135) 559(81) | X Y | MPa(kpsi) | A | |
| Ultimate Stress | 17(2.4) 13(1.9) | X Y | MPa(kpsi) | A | |
| Ultimate Strain | 9 to 15 7 to 14 | X Y | % | A | |
| Compressive Properties | ASTM D695 (0.05/min. strain rate) | ||||
| Young's Modulus | 2144 (311) | Z | MPa(kpsi) | A | |
| Ultimate Stress | 47(6.9) | Z | MPa(kpsi) | A | |
| Ultimate Strain | 25 | Z | % | ||
| Flexural Modulus | 4364 (633) 3751 (544) | X | MPa(kpsi) | A | ASTM D790 |
| Ultimate Stress | 36 (5.2) 32 (4.4) | X Y | MPa(kpsi) | A | |
| Deformation under load | 0.26 1.3 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |
| Moisture Absorption | 0.01 | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 | |
| Thermal Conductivity | 0.86 | W/m/k | 80℃ | ASTM C518 | |
| Coefficient of Thermal Expansion | 24 24 47 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | ℃ TGA | ASTM D3850 | ||
| Density | 3.1 | g/cm3 | ASTM D792 | ||
| Specific Heat | 1.00(0.239) | j/g/k (BTU/ib/OF) |
Calculated | ||
| Copper Peel | 12.3 (2.1) | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
| PCB Material: | Ceramic-PTFE composite |
| Designator: | RT/duroid 6010LM |
| Dielectric constant: | 10.2 ±0.25 (process); 10.7 (design) |
| Layer count: | 1 Layer, 2 Layer |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness: | 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.90mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP. |
Exploring the Advancements of RT duroid 6010 in High-Performance PCBs
RT duroid 6010 has emerged as a game-changer in the world of PCB technology, taking electronic design to new heights of efficiency and reliability. Let's delve into the key features and benefits that make RT duroid 6010 a preferred choice for high-performance PCB applications.
Introduction to RT duroid 6010: A High-Performance PCB Material
RT duroid 6010 is a cutting-edge material specifically designed for high-performance PCBs. Its unique composition and advanced properties make it a game-changer in the field of electronic design. Let's explore the exceptional features and benefits that set RT duroid 6010 apart from traditional PCB materials.
Key Features and Benefits of RT duroid 6010
RT duroid 6010 offers a range of key features and benefits that make it a top choice for high-performance PCB applications. Its exceptional dielectric properties, thermal stability, and mechanical strength are just a few of the advantages that set it apart. Let's delve deeper into these features and understand how they contribute to the overall performance of RT duroid 6010.
Understanding the Dielectric Constant and Dissipation Factor of RT duroid 6010
The dielectric constant and dissipation factor are crucial parameters for high-frequency applications. RT duroid 6010 excels in both areas, exhibiting exceptional stability and low losses. In this section, we explore the significance of these properties and how RT duroid 6010 outperforms other materials in terms of signal integrity and performance.
Thermal Properties and Reliability of RT duroid 6010 in Harsh Environments
PCBs often face challenging thermal environments, and their performance can be greatly affected by temperature variations. RT duroid 6010 boasts impressive thermal stability and a low coefficient of thermal expansion, ensuring reliable operation even in extreme conditions. In this section, we delve into the thermal properties of RT duroid 6010 and its ability to withstand demanding environments.
Electrical and Mechanical Properties of RT duroid 6010 for Enhanced Performance
RT duroid 6010 offers exceptional electrical and mechanical properties that contribute to superior PCB performance. Its high volume and surface resistivity, along with excellent tensile and flexural properties, make it an ideal choice for high-frequency and high-speed applications. In this section, we explore the specific attributes of RT duroid 6010 that enhance its electrical and mechanical performance.
Exploring the Compressive and Flexural Properties of RT duroid 6010
PCBs often undergo significant stress and mechanical loads during their lifetime. RT duroid 6010 exhibits remarkable compressive and flexural properties, ensuring structural integrity and reliability. In this section, we examine the compressive and flexural strength of RT duroid 6010 and its impact on PCB performance.
Moisture Absorption and Thermal Conductivity of RT duroid 6010
Moisture absorption and thermal conductivity are important considerations in PCB design. RT duroid 6010 excels in both aspects, offering low moisture absorption and high thermal conductivity. In this section, we delve into the moisture absorption characteristics and thermal conductivity of RT duroid 6010, highlighting their significance in maintaining the performance and longevity of PCBs.
Coefficient of Thermal Expansion and Tg of RT duroid 6010
The coefficient of thermal expansion (CTE) and glass transition temperature (Tg) play key roles in determining the reliability and stability of PCBs. RT duroid 6010 exhibits a low CTE and a high Tg, making it highly resistant to thermal stress and ensuring long-term performance. In this section, we explore the CTE and Tg of RT duroid 6010 and their impact on the reliability of PCBs.
Compatibility with Lead-Free Processes: RT duroid 6010's Environmental Advantage
As environmental regulations become more stringent, the compatibility of PCB materials with lead-free processes becomes crucial. RT duroid 6010 is fully compatible with lead-free processes, providing an eco-friendly solution without compromising on performance. In this section, we discuss the lead-free compatibility of RT duroid 6010 and its environmental advantages.
RT duroid 6010 represents a significant advancement in high-performance PCB materials. Its unique combination of properties, ranging from dielectric performance to thermal stability, makes it an ideal choice for demanding electronic applications. By harnessing the power of RT duroid 6010, designers can unlock new levels of performance, reliability, and efficiency in their PCB projects.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
