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31mil Rogers RT Duroid 5870 RF PCB Board Immersion Gold Low Dissipation Factor

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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31mil Rogers RT Duroid 5870 RF PCB Board Immersion Gold Low Dissipation Factor

Detailed Product Description
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Low Dissipation Factor e PCB Material


Rogers RT RF PCB Board


31mil RF PCB Board

Today's topic is our newly shipped PCB, a high-quality circuit board crafted with precision and intended to meet your demanding requirements. This 2-layer rigid PCB, made with Rogers RT/duroid 5870 glass microfiber reinforced PTFE composites, offers exceptional performance and reliability for a wide range of applications.


The PCB material, Rogers RT/duroid 5870, ensures superior electrical properties. With a process dielectric constant (DK) of 2.33 at 10 GHz/23°C and a dissipation factor of 0.0012 at the same frequency and temperature, this PCB delivers excellent signal integrity. It can withstand high temperatures, with a thermal decomposition temperature (Td) exceeding 500°C. Operating within a temperature range of -40°C to +85°C, it is suitable for various environments.


The construction details of this PCB are carefully engineered to meet your specific needs. With a 2-layer stackup, each copper layer is 35 μm thick, and the RT/duroid 5870 substrate measures 0.787 mm (31 mils). The finished board thickness is 0.91 mm, ensuring durability and stability. The copper weight is 1 oz (1.4 mils) on the outer layers, and the via plating thickness is 20 μm. The surface finish of immersion gold ensures excellent solderability and long-term reliability.


This PCB offers a generous board size of 315.12 mm x 139.85 mm, available in three types, with a tolerance of +/- 0.15 mm to meet your precise specifications. The minimum trace/space is 5/6 mils, allowing for intricate designs and high-density layouts. The minimum hole size is 0.3 mm, enabling precise component placement and easy assembly. The green solder mask on both the top and bottom layers provides protection and enhances visibility during assembly.


With 102 components and a total of 240 pads, including 126 through-hole pads and 114 top surface-mount technology (SMT) pads, this PCB accommodates a wide range of electronic components. The absence of bottom SMT pads allows for customization and flexibility. The 78 vias and 6 nets ensure efficient signal routing and connectivity.


To ensure the highest quality, each PCB undergoes a 100% electrical test before shipment, guaranteeing optimal performance upon arrival. The artwork supplied is in Gerber RS-274-X format, meeting industry standards. This PCB adheres to IPC-Class-2 standards, ensuring reliability and consistency.


Our PCBs are available worldwide, and we are committed to providing excellent customer support. For any technical inquiries or questions, please contact Ivy at


Experience the exceptional quality and performance of our newly shipped PCB. Trust in our expertise and rely on our reliable solutions for your electronic projects.


RT/duroid 5870 Typical Value
Property RT/duroid 5870 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.33
2.33±0.02 spec.
Z N/A C24/23/50
1 MHz IPC-TM-650
Dielectric Constant,εDesign 2.33 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0005
Z N/A C24/23/50
1 MHz IPC-TM-650
Thermal Coefficient of ε -115 Z ppm/℃ -50℃to 150℃ IPC-TM-650
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1300(189) 490(71) X
1280(185) 430(63) Y
Ultimate Stress 50(7.3) 34(4.8) X
42(6.1) 34(4.8) Y
Ultimate Strain 9.8 8.7 X %
9.8 8.6 Y
Compressive Modulus 1210(176) 680(99) X MPa(kpsi) A ASTM D 695
1360(198) 860(125) Y
803(120) 520(76) Z
Ultimate Stress 30(4.4) 23(3.4) X
37(5.3) 25(3.7) Y
54(7.8) 37(5.3) Z
Ultimate Strain 4 4.3 X %
3.3 3.3 Y
8.7 8.5 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.22 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 22
ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃ TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 27.2(4.8) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A


Unveiling the Properties of RT/duroid 5870: A Comprehensive Guide to Its Electrical, Thermal, and Mechanical Characteristics


For starters, the dielectric constant (ε) during the process is stated as 2.33, with a specified range of 2.33±0.02. Similarly, the design dielectric constant is also 2.33. Moving on, the dissipation factor (tanδ) stands at 0.0005 for a frequency of 1 MHz and 0.0012 for 10 GHz. These figures shed light on the material's ability to handle electrical signals efficiently.


When it comes to thermal behavior, the thermal coefficient of ε is noted as -115 ppm/℃, covering a temperature range from -50℃ to 150℃. This data informs us about the material's response to temperature fluctuations and its stability within the specified range.


On the electrical front, the volume resistivity is measured at 2 x 10^7 Mohm cm, indicating the material's resistance to electrical current flow. Similarly, the surface resistivity is reported as 3 x 10^7 Mohm, further emphasizing its electrical properties.


Considering thermal aspects, the specific heat of the material is determined to be 0.96 j/g/k (0.23 cal/g/c). This value provides insights into the material's heat absorption and dissipation capabilities.


31mil Rogers RT Duroid 5870 RF PCB Board Immersion Gold Low Dissipation Factor 0


Moving on to mechanical strength, the tensile modulus is evaluated under different conditions. At 23℃, the material exhibits a tensile modulus of 1300 MPa (189 kpsi) along the X-axis and 1280 MPa (185 kpsi) along the Y-axis. This information highlights the material's ability to withstand tension forces.


Furthermore, the ultimate stress values for both the X and Y axes are provided, with 50 MPa (7.3 kpsi) and 42 MPa (6.1 kpsi) respectively. These figures indicate the maximum stress the material can handle before failure occurs. Additionally, the ultimate strain is specified as 9.8% for the X-axis and 8.7% for the Y-axis, expressing the material's capacity to stretch under tension.

Similarly, the ultimate stress and strain for compression are outlined, providing a comprehensive understanding of the material's behavior when subjected to compressive forces.


Other notable characteristics include the material's low moisture absorption rate of 0.02% and its thermal conductivity of 0.22 W/m/k at 80℃. These figures illustrate the material's resistance to moisture and its ability to conduct heat effectively.

In summary, the RT/duroid 5870 data sheet serves as a valuable resource, offering in-depth insights into the material's electrical, thermal, and mechanical properties. By referring to this comprehensive information, users can make informed decisions regarding the material's suitability for various applications.


31mil Rogers RT Duroid 5870 RF PCB Board Immersion Gold Low Dissipation Factor 1

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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