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Rogers 32mil RO4003C ENIG PCB Via Filled By Resin And Capped

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Rogers 32mil RO4003C ENIG PCB Via Filled By Resin And Capped

Detailed Product Description
High Light:



Resin Capped Filled PCB Material



We are excited to introduce our latest shipment, an exceptional printed circuit board (PCB) meticulously supplied for meet the needs of modern electronic applications. Crafted with precision and reliability in mind, this PCB offers outstanding performance and top-notch quality. Let's delve into the key details of this remarkable PCB.


PCB Material and Stackup:
This PCB is built with RO4003C hydrocarbon ceramic laminates, renowned for their superior electrical properties and stability. It proceeding with a lead-free process, aligning with environmental standards and regulations. The PCB is designed to operate flawlessly within a temperature range of -40℃ to +85℃, making it suitable for a wide range of environmental conditions.


Construction Details:
The PCB features a 2-layer rigid design with a finished copper thickness of 35um, ensuring excellent electrical conductivity. The RO4003C dielectric layer provides a thickness of 32mil, ensuring reliable insulation and exceptional signal integrity. The second layer also boasts a finished copper thickness of 35um to maintain consistent performance.


The PCB's dimensions measure 139mm x 100mm (6PCS), and we ensure high precision with an accuracy level of +/- 0.15mm. You can achieve intricate and precise circuitry with a minimum trace/space of 4/4 mils. The minimum hole size of 0.5mm allows compatibility with a wide range of components.There are no blind or buried vias.


To ensure durability and stability, its finished board thickness of 0.9mm. The PCB features a 1 oz (1.4 mils) copper weight across all layers to optimize conductivity. For reliable electrical connections, we employ 1 mil via plating thickness. The surface finish is Electroless Nickel Immersion Gold (ENIG), which offers exceptional solderability and corrosion resistance.

The PCB do not require top and bottom silkscreen and solder mask, resulting in a clean and minimalistic appearance. Silkscreen is absent on solder pads to ensure precise component placement. To guarantee functionality and reliability, the PCBs are 100% electrical test. Additionally, the 0.5mm vias are filled with resin and capped according to IPC-4761 Type VII standards to enhance structural integrity.


PCB Statistics:
The PCB accommodates 97 components and provides a total of 130 pads for secure component attachment. It includes 49 thru-hole pads and 81 top SMT pads, offering versatile component mounting options. The configuration does not include bottom SMT pads. With 151 vias, seamless electrical connections are achieved, supporting 17 unique nets for efficient signal routing.


Artwork Format and Accepted Standard:
We accept the Gerber RS-274-X format, ensuring compatibility with industry-standard PCB design software. PCB processes adhere to the IPC-Class-2 standard, guaranteeing high-quality production and reliability.


Service Area:
Our services are available worldwide, allowing customers from any corner of the globe to access our exceptional products and support.


Contact Information:
For technical inquiries or further details, please reach out to Ivy at We are dedicated to providing exceptional customer service and technical support tailored to your specific requirements.


RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
Z   10 GHz/23℃
2.5 GHz/23℃
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650
Surface Resistivity 4.2 x 109   COND A IPC-TM-650
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650
Tensile Modulus 19,650(2,850)
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
MPa(ksi) RT ASTM D 638
Flexural Strength 276
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        


Rogers 32mil RO4003C ENIG PCB Via Filled By Resin And Capped 0


Revolutionizing High-Performance PCBs with RO4003C Hydrocarbon Ceramic Laminates


In the rapidly evolving landscape of electronic applications, the demand for high-performance printed circuit boards (PCBs) continues to soar. RO4003C hydrocarbon ceramic laminates have emerged as a game-changing PCB material, renowned for its exceptional quality and outstanding performance. In this article, we will delve deep into the features, benefits, and applications of RO4003C, shedding light on its potential to revolutionize the world of PCBs.


Advantages and Features of RO4003C for High-Performance PCBs:
RO4003C hydrocarbon ceramic laminates offer a host of advantages that make them an ideal choice for high-performance PCBs. With a dielectric constant of 3.38±0.05, RO4003C ensures reliable electrical properties and signal integrity. Its low dissipation factor (tan, δ) of 0.0027 at 10 GHz/23℃ and 0.0021 at 2.5 GHz/23℃ further enhances its performance in high-frequency applications.


Thermal Considerations: Coefficient of Thermal Expansion and Dimensional Stability:
RO4003C exhibits excellent thermal stability with a thermal coefficient of ε of +40 ppm/℃ in the range of -50℃ to 150℃. This ensures that the PCB maintains its structural integrity and electrical properties across a wide temperature range. Additionally, its dimensional stability of less than 0.3 mm/m (mil/inch) after etch+E2/150℃ guarantees reliable performance even in demanding thermal environments.


Electrical Properties of RO4003C: Dielectric Constant and Dissipation Factor:
The dielectric constant (ε) of RO4003C, measured using the IPC-TM-650 Clamped Stripline process, is 3.38±0.05. This low dielectric constant ensures minimal signal loss and excellent impedance control, making RO4003C suitable for high-speed digital and RF applications. The dissipation factor (tan, δ) of RO4003C, measured at 10 GHz/23℃ and 2.5 GHz/23℃, is 0.0027 and 0.0021, respectively. These low values indicate low signal attenuation and efficient power transmission.


Ensuring Signal Integrity: Electrical Strength and Surface Resistivity of RO4003C:
RO4003C boasts impressive electrical strength, with a value of 31.2 (780) Kv/mm (v/mil) at a thickness of 0.51mm (0.020"). This high electrical strength enables RO4003C to withstand high voltages and prevent electrical breakdown. Additionally, the surface resistivity of RO4003C is 4.2 x 10^9 MΩ, ensuring effective insulation and minimizing leakage currents.


Mechanical Strength: Tensile Modulus and Strength Analysis of RO4003C:

RO4003C exhibits remarkable mechanical strength, with a tensile modulus of 19,650 MPa (2,850 ksi) in the X direction and 19,450 MPa (2,821 ksi) in the Y direction. Its tensile strength is 139 MPa (20.2 ksi) in the X direction and 100 MPa (14.5 ksi) in the Y direction. These properties make RO4003C highly resistant to deformation and ensure the structural integrity of PCBs even under demanding conditions.


Applications of RO4003C in Various Industries:
The versatility of RO4003C opens up a wide range of applications across various industries. Its exceptional electrical properties, combined with high thermal stability, make it an excellent choice for telecommunications, aerospace, automotive, and wireless communication systems. RO4003C can be used in high-frequency PCBs, microwave circuits, power amplifiers, antennas, and radar systems, among others.


Sustainability and Lead-Free Compatibility of RO4003C:
As the industry moves towards more sustainable practices, RO4003C stands out as an environmentally friendly choice. It is compatible with lead-free processes, ensuring compliance with regulations and reducing the environmental impact of PCB manufacturing. By choosing RO4003C, companies can contribute to a greener future and meet the demands of eco-conscious customers.


High-Frequency Performance: RO4003C for GHz Range Applications:
RO4003C's exceptional electrical properties and low loss tangent make it particularly suitable for high-frequency applications in the GHz range. With a dielectric constant of 3.55 (measured using the Differential Phase Length Method), RO4003C provides precise impedance control and minimizes signal distortions. It enables the design and manufacturing of high-performance RF and microwave circuits that operate in the GHz frequency range.


Thermal Management with RO4003C: Thermal Conductivity and Cooling Efficiency:
Efficient thermal management is crucial for electronicdevices, especially those operating at high power levels. RO4003C excels in this aspect with its thermal conductivity of 0.71 W/M/oK at 80℃. This high thermal conductivity facilitates effective heat dissipation, reducing the risk of component overheating and ensuring reliable performance. The superior cooling efficiency of RO4003C makes it an excellent choice for power amplifiers, high-power RF modules, and other heat-sensitive applications.


RO4003C hydrocarbon ceramic laminates offer a myriad of features and benefits that make them a top choice for high-performance PCBs. With exceptional electrical properties, outstanding thermal stability, and impressive mechanical strength, RO4003C enables the design and manufacturing of reliable and efficient electronic systems. Its compatibility with lead-free processes and sustainability aspects further enhance its appeal. Whether in telecommunications, aerospace, automotive, or other industries, RO4003C empowers engineers and designers to push the boundaries of innovation and achieve unprecedented performance in their PCB applications.


Rogers 32mil RO4003C ENIG PCB Via Filled By Resin And Capped 1

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)