RO3003 Materials RF PCB Board,
Lead Free RF PCB Board,
PCB Material 5mil
Today, we are glad to be here and share our newly shipped PCB with you. Our latest shipment of PCBs has been crafted with the utmost attention to quality and performance. The PCB is composed of Rogers RO3003 materials, processed with lead-free techniques and designed for operation within a temperature range of -40℃ to +85℃. The 6-layer high-frequency stackup features dielectric RO3003 of 5mil and base copper of 17um, separated by prepreg bondply 2929. The board dimensions are 20 x 15 mm with a tolerance of +/- 0.15mm, and the design includes blind vias from layer 1 to layer 2.
The finished PCB has a thickness of 0.7 mm and features a finished Cu weight of 1 oz (1.4 mils) on the outer layers and 0.5 oz on the inner layers, ensuring optimal performance. The via plating thickness is 1 mil, and the surface finish is achieved through the use of Immersion Nickle Immersion Palladium and Immersion Gold (ENEPIG), providing a high-quality finish.
The latest PCB shipment is designed for electronic products that require precise performance and reliability, with no top or bottom silkscreen or top/bottom solder mask, and no silkscreen on solder pads. The PCB undergoes 100% electrical testing to ensure it meets the highest standards of quality.
With 11 components, 39 total pads, 21 thru-hole pads, 15 top SMT pads, 3 bottom SMT pads, 51 vias, and 9 nets, the PCB is designed to meet the most rigorous performance standards.
If you have any technical questions or inquiries, please contact Ivy at firstname.lastname@example.org. Our PCBs are the ideal choice for your next project.
|RO3003 Typical Value
|IPC-TM-650 22.214.171.124 Clamped Stripline
|8GHz to 40 GHz
|Differential Phase Length Method
|Thermal Coefficient of ε
|10 GHz -50℃to 150℃
|ASTM D 638
|ASTM D 5470
|Coefficient of Thermal Expansion
(-55 to 288℃)
|ASTM D 3850
|ASTM D 792
|Copper Peel Stength
|1oz,EDC After Solder Float
|Lead-free Process Compatible
A Comprehensive Guide to RO3003: From Properties to Applications
---Introduction: What is RO3003 and How Does it Work?
High-frequency PCB design is a constantly evolving field, and engineers and designers are always on the lookout for innovative and reliable materials to incorporate into their designs. One such material that has gained significant attention in recent years is RO3003, a high-frequency laminate that offers exceptional electrical and mechanical properties.
In this comprehensive guide to RO3003, we will delve into its properties and advantages, manufacturing process, and applications. Whether you are a seasoned PCB designer or a newcomer to the industry, this guide will provide valuable insights into the world of high-frequency PCB design.
Introduction: Unveiling RO3003 and Its Functionality
RO3003 is a high-frequency laminate crafted for use in applications that demand outstanding electrical and mechanical performance. It comprises a ceramic-filled PTFE material, which offers a low dielectric constant and a low loss tangent, making it ideal for high-speed digital and RF applications where signal integrity and reliability are of utmost importance.
The Properties of RO3003: Dielectric Constant, Thermal Conductivity, and More
RO3003 boasts exceptional electrical properties, making it an ideal choice for high-frequency PCB design. Its dielectric constant is 3.0±0.04, which is much lower than many other high-frequency PCB materials. This translates to faster signal transmission and less attenuation, resulting in improved signal integrity and higher performance.
RO3003 also has high thermal conductivity, which helps to dissipate heat and improve reliability. It exhibits a thermal coefficient of ε of -3 ppm/℃, making it stable over a wide range of temperatures. The material also has low dissipation factor, with a tanδ of 0.001 at 10 GHz/23℃.
Advantages of Incorporating RO3003 in High-Frequency PCB Design
The advantages of RO3003 in high-frequency PCB design are numerous. Its low dielectric constant and low loss tangent make it ideal for high-speed digital and RF applications, where signal integrity and reliability are critical. RO3003 also offers excellent thermal conductivity and stability over a wide range of temperatures, making it suitable for use in harsh environments.
RO3003 vs. Other High-Frequency PCB Materials: A Comparative Analysis
When it comes to high-frequency PCB design, there are several materials to choose from. However, RO3003 stands out from the rest due to its superior electrical and mechanical properties. In this section, we will compare RO3003 to other popular high-frequency PCB materials.
Manufacturing RO3003 PCBs: The Process Demystified
Manufacturing RO3003 PCBs necessitates specialized equipment and techniques due to the material's unique properties. In this section, we will explore the manufacturing process of RO3003 PCBs, including the materials and equipment used, and the challenges involved.
Designing High-Performance PCBs with RO3003: Tips and Tricks
Designing high-performance PCBs with RO3003 requires careful consideration of the material's properties and characteristics. In this section, we will provide tips and tricks for designing high-performance PCBs with RO3003, including signal routing, layer stacking, and thermal management.
The Impact of Thermal Properties on RO3003 PCB Design
Thermal properties play a crucial role in high-frequency PCB design, and RO3003 is no exception. In this section, we will explore the impact of thermal properties on RO3003 PCB design, including thermal management techniques and the importance of thermal stability.
RO3003 and Signal Loss Management: Best Practices
Signal loss is a common problem in high-frequency PCB design, and RO3003 offers several advantages when it comes to managing signal loss. In this section, we will explore best practices for managing signal loss with RO3003 PCBs, including the use of controlled impedance and proper layer stacking.
Applications of RO3003 in RF/Microwave Technologies
RO3003 is an ideal material for RF and microwave applications due to its low dielectric constant and low loss tangent. In this section, we will explore the applications of RO3003 in RF and microwave technologies, including antennas, filters, and amplifiers.
RO3003 and 5G: A Match Made in Heaven
The emergence of 5G technology has increased the demand for high-frequency PCB materials that can support high-speed data transfer rates. RO3003 is an ideal material for 5G applications due to its low dielectric constant and low loss tangent. In this section, we will explore the role of RO3003 in 5G technology and its potential applications.
Conclusion: Unleashing the Power of RO3003 for High-Frequency PCB Design
RO3003 is a high-performance material that offers exceptional electrical and mechanical properties for high-frequency PCB design. Its low dielectric constant, low loss tangent, and high thermal conductivity make it ideal for a wide range of applications, from RF and microwave to 5G and beyond. By understanding the properties and advantages of RO3003, designers and engineers can unleash the power of this material and create high-performance PCBs that meet the most rigorous standards of quality and reliability.
Contact Person: Ms. Ivy Deng