Product Details:
Payment & Shipping Terms:
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Based Material: | IsoClad 917 0.508mm | Layer Count: | Double Sided Board |
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PCB Thickness: | 0.6 Mm ±0.1 | Copper Weight: | 1oz |
High Light: | PTFE PCB Material,Non Woven Fiberglass High Speed PCB,917 High Speed Rogers PCB |
High Frequency PCB Built on Rogers IsoClad 917 non-woven fiberglass/PTFE Materials
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers IsoClad 917 laminates are a type of non-woven fiberglass/PTFE composite material. By using a low ratio of fiberglass/PTFE, they achieve the lowest 2.17 or 2.20 dielectric constant and a 0.0013 dissipation factor. The longer random fibers and proprietary process of IsoClad 917 provide greater dimensional stability and dielectric constant uniformity than competitors in similar classes. As a non-woven fiberglass reinforcement, IsoClad 917 is less rigid than woven fiberglass, making it ideal for applications where the final PCB may be bent in shape, such as conformal or wrap-around antennas.
The features of Rogers IsoClad 917 laminates include a low dielectric constant (Dk) of 2.17 or 2.20, a low dissipation factor of 0.0013 at 10GHz, extremely low loss, low moisture absorption, and high isotropic properties in X, Y, and Z directions.
Typical applications for IsoClad 917 laminates include conformal antennas, stripline and microstrip circuits, guidance systems, and radar systems.
PCB Specifications
PCB SIZE | 126mm x 95mm=1 piece |
BOARD TYPE | High Frequency PCB |
Number of Layers | 2 layers |
Surface Mount Components | YES |
Through Hole Components | N/A |
LAYER STACKUP | copper ------- 17um(0.5 oz)+plate top layer |
IsoClad 917 0.508mm | |
copper ------- 17um(0.5 oz)+plate bot layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 4 mil / 4 mil |
Minimum / Maximum Holes: | 0.2 mm / 1.2 mm |
Number of Different Holes: | 8 |
Number of Drill Holes: | 251 |
Number of Milled Slots: | 3 |
Number of Internal Cutouts: | 3 |
Impedance Control: | no |
Number of Gold finger: | 0 |
BOARD MATERIAL | |
Glass Epoxy: | IsoClad 917 0.508mm |
Final foil external: | 1.0 oz |
Final foil internal: | 1.0 oz |
Final height of PCB: | 0.6 mm ±0.1 |
PLATING AND COATING | |
Surface Finish | Immersion Gold, 31.6% |
Solder Mask Apply To: | Both sides |
Solder Mask Color: | Green |
Solder Mask Type: | Glossy |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | Top side |
Colour of Component Legend | White |
Manufacturer Name or Logo: | Kuangshung |
VIA | Plated through hole(PTH), minimum size 0.2mm. via filled and tented. |
FLAMIBILITY RATING | 94V-0 |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" |
Board plating: | 0.0029" |
Drill tolerance: | 0.002" |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Our Advantages
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 19 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.
We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We also actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.
Our PCB Capability (2022)
Parameter | Value |
Layer Counts | 1-32 |
Substrate Materials | RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; RT/duroid 5880LZ; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917; Nelco N4000, N9350, N9240; SCGA-500 GF220, SCGA-500 GF255, SCGA-500 GF265, SCGA-500 GF300; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc. |
Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
Board Outline Tolerance | ±0.0059" (0.15mm) |
PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
Thickness Tolerance(T≥0.8mm) | ±8% |
Thickness Tolerance(t<0.8mm) | ±10% |
Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
Minimum Track | 0.003" (0.075mm) |
Minimum Space | 0.003" (0.075mm) |
Outer Copper Thickness | 35µm--350µm (1oz-10oz) |
Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
Drill Hole(Mechanical) | 0.0079" - 0.25" (0.2mm--6.35mm) |
Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
Registration (Mechanical) | 0.00197" (0.05mm) |
Aspect Ratio | 12:1 |
Solder Mask Type | LPI |
Min Soldermask Bridge | 0.00315" (0.08mm) |
Min Soldermask Clearance | 0.00197" (0.05mm) |
Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
Impedance Control Tolerance | ±10% |
Surface Finish | HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc. |
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848