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| Based Material: | Non-woven Fiberglass / PTFE Composites | Dielectric Constant:: | 2.17 Or 2.20 (10 GHz) |
|---|---|---|---|
| Dissipation Factor: | 0.0013 (10 GHz) | Copper Weight: | 1oz (35µm), 2oz (70µm) |
| High Light: | Non Woven Fiberglass High Frequency PCB,PTFE High Frequency PCB,IsoClad High Speed PCB |
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High Frequency PCB Built on Rogers IsoClad 917 non-woven fiberglass/PTFE Materials
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
Rogers IsoClad 917 laminates are non-woven fiberglass/PTFE composites using a low ratio of fiberglass/PTFE to achieve the lowest 2.17 or 2.20 dielectric constant and 0.0013 dissipation factor. Longer random fibers and proprietary process of IsoClad 917 provide greater dimensional stability and dielectric constant uniformity than competitors in similar classes.It is non-woven fiberglass reinforcement, less rigid than woven fiberglass, so it’s used in applications where the final PCB may be bent in shape, including conformal antennas or wrap-around antennas.
Here are some features of Isoclad 917 material. Such as low dielectric constant (Dk) of 2.17 or 2.20, low dissipation factor of .0013 at 10GHz, extremely low loss, low moisture absorption, highly Isotropic in X, Y and Z Directions etc.
It often used in conformal Antennas, stripline and Microstrip Circuits, guidance Systems, radar Systems, and more.
Our PCB Capability (IsoClad 917)
| PCB Material: | Non-woven Fiberglass / PTFE Composites |
| Designation: | IsoClad 917 |
| Dielectric constant: | 2.17 or 2.20 (10 GHz) |
| Dissipation factor | 0.0013 (10 GHz) |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 20mil (0.508mm), 31mil (0.787mm), 62mil (1.575mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
Our Advantages
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 19 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.
We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We also actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.
Appendix: Typical Values of IsoClad 917
| Property | IsoClad 917 | Condition | Test Method |
| Dielectric Constant @ 10 GHz | 2.17, 2.20 | C23/50 | IPC TM-650 2.5.5.5 |
| Dissipation Factor @ 10 GHz | 0.0013 | C23/50 | IPC TM-650 2.5.5.5 |
| Thermal Coefficient of Er (ppm/°C) | -157 | -10°C to +140°C | IPC TM-650 2.5.5.5 Adapted |
| Peel Strength (lbs.per inch) | 10 | After Thermal | IPC TM-650 2.4.8 |
| Volume Resistivity (MΩ-cm) | 1.5 x 10 10 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Surface Resistivity (MΩ) | 1.0 x 10 9 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Arc Resistance (seconds) | >180 | D48/50 | ASTM D-495 |
| Tensile Modulus (kpsi) | 133, 120 | A, 23°C | ASTM D-638 |
| Tensile Strength (kpsi) | 4.3, 3.8 | A, 23°C | ASTM D-882 |
| Compressive Modulus (kpsi) | 182 | A, 23°C | ASTM D-695 |
| Flexural Modulus (kpsi) | 213 | A, 23°C | ASTM D-790 |
| Dielectric Breakdown (kv) | >45 | D48/50 | ASTM D-149 |
| Density (g/cm3) | 2.23 | A, 23°C | ASTM D-792 Method A |
| Water Absorption (%) | 0.04 | E1/105 + D24/23 | MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 |
| Coefficient of Thermal | 0°C to 100°C | IPC TM-650 2.4.24 | |
| Expansion (ppm/°C) | Mettler 3000 | ||
| X Axis | 46 | Thermomechanical | |
| Y Axis | 47 | Analyzer | |
| Z Axis | 236 | ||
| Thermal Conductivity (W/mK) | 0.263 | 100°C | ASTM E-1225 |
| Outgassing | 125°C, ≤10-6 torr | ||
| Total Mass Loss (%) | 0.02 | Maximum 1.00% | |
| Collected Volatile | 0.00 | Maximum 0.10% | |
| Condensable Material (%) | |||
| Water Vapor Regain (%) | 0.02 | ||
| Visible Condensate (±) | NO | ||
| Flammability | Meets requirements of UL94-V0 |
C48/23/50, E24/125 | UL 94 Vertical Burn IPC TM-650 2.3.10 |
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
