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TC600 Hybrid Microwave PCB Board 15mil Thickness With Immersion Silver

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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TC600 Hybrid Microwave PCB Board 15mil Thickness With Immersion Silver

TC600 Hybrid Microwave PCB Board 15mil Thickness With Immersion Silver
TC600 Hybrid Microwave PCB Board 15mil Thickness With Immersion Silver TC600 Hybrid Microwave PCB Board 15mil Thickness With Immersion Silver TC600 Hybrid Microwave PCB Board 15mil Thickness With Immersion Silver

Large Image :  TC600 Hybrid Microwave PCB Board 15mil Thickness With Immersion Silver

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-195.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: Ceramic Filled PTFE/Woven Fiberglass Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB
PCB Thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 500mil (12.7mm) PCB Size: ≤400mm X 500mm
Solder Mask: Green, Black, Blue, Yellow, Red Etc. Copper Weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish: Bare Copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP, Pure Gold Plated Etc..
High Light:

15mil Microwave Oven Pcb Board

,

Hybrid Microwave Oven Circuit Board

,

TC600 Microwave Printed Circuit Boards

 

TC600 Microwave PCB with 15mil 20mil 30mil 50mil 60mil Thickness TC600 High Frequency PCB with Immersion Silver

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

Rogers' (Arlon) TC600 is a woven fiberglass reinforced, enhanced thermal conductivity ceramic filled, PTFE-based composite. It is designed to provide enhanced heat-transfer through“Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. The increased thermal conductivity (1.1 W/mk) provides higher power handling, reduces hot-spots and improves device reliability. Lower losses result in higher amplifier and antenna gains/efficiencies. Stable dielectric constant is across a wide temperature range (-75 ppm/oC -40°C to 140°C). It helps power amplifier and antenna designers maximize gain and minimize dead bandwidth lost to dielectric constant drift as operating temperature changes. It has low Z-Direction CTE and mechanical robustness is also greatly improved for the 6.15 dielectric constant market.

 

Features

1. Very Low Loss Tangent (0.002 at 10 GHz) provides Higher Amplifier or Antenna Efficiency

2. Mechanically Robustness improves processing and reliability, replaces brittle laminates that cannot withstand processing, impact or High Gain forces

3. Low coefficient of thermal expansion on X,Y and Z axis (9, 9 and 35 ppm/°C) matches active components for low stress solder joints

4. High Peel Strength for Reliable narrow lines

 

Benefits

1. Reduced Heat Generated through Transmission Line Loss

2. Heat Dissipation and Management

3. Replace Ceramic in Some Applications

4. Large Panel Sizes for Multiple Circuit Layout for lowered Processing Costs

 

TC600 Hybrid Microwave PCB Board 15mil Thickness With Immersion Silver 0

 

Our PCB Capability (TC600)

PCB Material: Ceramic Filled PTFE/Woven Fiberglass
Designation: TC600
Dielectric constant: 6.15 (10 GHz)
Dissipation Factor 0.002 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 500mil (12.7mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

Typical Applications:

1. Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)

2. GPS & Hand-held RFID Reader Antennas

3. Microwave Combiner and Power Divider Boards in Avionics Applications

4. Power Amplifiers, Filters and Couplers

5. Small Footprint Antennas

 

Appendix: Typical Properties TC600

1. Electrical Properties
Dielectric Constant (may vary by thickness)      
@1.8 MHz - 6.15 Resonant Cavity
@10 GHz - 6.15 IPC TM-650 2.5.5.5
Dissipation Factor      
@1.8 GHz - 0.0017 Resonant Cavity
@10 GHz - 0.002 IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric -    
TCεr @ 10 GHz (-40-150°C) ppm/ºC -75 IPC TM-650 2.5.5.5
Volume Resistivity      
C96/35/90 MΩ-cm 1.6x109 IPC TM-650 2.5.17.1
E24/125 MΩ-cm 2.4x108 IPC TM-650 2.5.17.1
Surface Resistivity      
C96/35/90 3.1x109 IPC TM-650 2.5.17.1
E24/125 9.0x108 IPC TM-650 2.5.17.1
Electrical Strength Volts/mil (kV/mm) 850 (34) IPC TM-650 2.5.6.2
Dielectric Breakdown kV 62 IPC TM-650 2.5.6
Arc Resistance sec >240 IPC TM-650 2.5.1
 
2. Thermal Properties
Decomposition Temperature (Td)      
Initial °C 512 IPC TM-650 2.4.24.6
5% °C 572 IPC TM-650 2.4.24.6
T260 min >60 IPC TM-650 2.4.24.1
T288 min >60 IPC TM-650 2.4.24.1
T300 min >60 IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºC ppm/ºC 9, 9 IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC ppm/ºC 35 IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC) % 1.5 IPC TM-650 2.4.24
 
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)      
After Thermal Stress lb/in (N/mm) 10 (1.8) IPC TM-650 2.4.8
At Elevated Temperatures (150ºC) lb/in (N/mm) 10 (1.8) IPC TM-650 2.4.8.2
After Process Solutions lb/in (N/mm) 9 (1.6) IPC TM-650 2.4.8
Young’s Modulus kpsi (MPa) 280 (1930) IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross) kpsi (MPa) 9.60/9.30 (66/64) IPC TM-650 2.4.4
Tensile Strength (Machine/Cross) kpsi (MPa) 5.0/4.30 (34/30) IPC TM-650 2.4.18.3
Compressive Modulus kpsi (MPa)   ASTM D-3410
Poisson’s Ratio -   ASTM D-3039
 
4. Physical Properties
Water Absorption % 0.02 IPC TM-650 2.6.2.1
Density, ambient 23ºC g/cm3 2.9 ASTM D792 Method A
Thermal Conductivity (z-axis) W/mK 1.1 ASTM E1461
Thermal Conductivity (x, y) W/mK 1.4 ASTM E1461
Specific Heat J/gK 0.94 ASTM E1461
Flammability class V0 UL-94
NASA Outgassing, 125ºC, ≤10-6 torr      
Total Mass Loss % 0.02 NASA SP-R-0022A
Collected Volatiles % 0 NASA SP-R-0022A
Water Vapor Recovered % 0 NASA SP-R-0022A

 

TC600 Hybrid Microwave PCB Board 15mil Thickness With Immersion Silver 1

 

Contact Details
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Contact Person: i.deng

Tel: +8613481420915

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