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1-4 Layers ISO9001 Metal Core PCB IMS Copper Based

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Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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1-4 Layers ISO9001 Metal Core PCB IMS Copper Based

Large Image : 1-4 Layers ISO9001 Metal Core PCB IMS Copper Based

Product Details:

Place of Origin:	CHINA
Brand Name:	Bicheng
Certification:	UL, ISO9001, IATF16949
Model Number:	BIC-757.V1.0

Payment & Shipping Terms:

Minimum Order Quantity:	1PCS
Price:	USD9.99-99.99
Packaging Details:	Vacuum bags+Cartons
Delivery Time:	8-9 working days
Payment Terms:	T/T
Supply Ability:	5000PCS per month

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Detailed Product Description

Base Material:	Aluminum, Copper, Iron	Layer Count:	1-4 Layers
PCB Thickness:	0.0157" X 0.2362" (0.4-6.0mm)	Copper Weight:	0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),3OZ(105µm),4OZ(140µm) To 10oz (350µm)
Surface Finish:	HASL, Immersion Gold, Immersion Silver, OSP
High Light:	Copper Based Metal Core PCB , ISO9001 Metal Core PCB , ISO9001 Copper Based PCB

Copper Based PCB Manufacturing Printed Circuit Board On Copper Core Insulated Metal Substrate (IMS PCB) and Metal core PCB (MCPCB)

1. Copper Based PCB
Copper core PCB is one of the most expensive metal substrates, and its thermal conductivity is many times better than that of aluminum and iron substrates. It is suitable for high frequency circuits, high and low temperature changing regions and the heat dissipation.

2. Layer up
The circuit layer of copper substrate is required to have a large current-carrying capacity, so a thick copper foil should be used, the thickness of which is generally 35 μ m ~ 280 μ m;

Thermal insulation layer is the core technology of copper substrate too. The core thermal conductivity is composed of aluminum trioxide and silicon powder and polymer filled with epoxy resin, the thermal resistance is low (0.15), viscoelasticity is excellent, and it has the ability to resist thermal aging. It is able to withstand mechanical and thermal stress.

Metal base is the support member of copper PCB. It is required to have high thermal conductivity, generally copper sheet is used because copper can provide better thermal conductivity, suitable for drilling, punching, shearing and cutting and other conventional machining.

1.3 Metal Core PCB Capability 2021

Metal Core PCB Capability
NO.	Parameter	Value
1	Type of Metal Core	Aluminum, Copper, Iron
2	Model of Metal Core	A1100, A5052, A6061, A6063, C1100
3	Surface Finish	HASL, Immersion Gold, Immersion Silver, OSP
4	Thickness of Surface plating	HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm
5	Layer Count	1-4 Layers
6	Maximum of Board Size	23" x 46" (584mm×1168mm)
7	Mininum of Board Size	0.1969" x 0.1969" (5mm×5mm)
8	Board Thickness	0.0157" x 0.2362" (0.4-6.0mm)
9	Copper Thickness	0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),3OZ(105µm),4OZ(140µm) to 10oz (350µm)
10	Minimum Track Width	5mil (0.127mm)
11	Minimum Space	5mil (0.127mm)
12	Minimum Hole Size	0.0197" (0.5mm)
13	Maximum Hole Size	No limit
14	Minimum Holes Punched	PCB thickness <1.0mm: 0.0394" (1.0mm)
14	Minimum Holes Punched	PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15	PTH Wall Thickness	>20µm
16	Tolerance of PTH	±0.00295" (0.075mm)
17	Tolerance of NPTH	±0.00197" (0.05mm)
18	Deviation of Hole Position	±0.00394" (0.10mm)
19	Outline Tolerance	Routing: ±0.00394" (0.1mm)
19	Outline Tolerance	Punching: ±0.00591" (0.15mm)
20	Angle of V-cut	30°, 45°, 60°
21	V-cut Size	0.1969" x 47.24" (5mm×1200mm)
22	Thickness of V-cut Board	0.0236" x 0.1181" (0.6-3mm)
23	Tolerance of V-cut Angle	±5º
24	V-CUT Verticality	≤0.0059" (0.15mm)
25	Minimum Square Slots Punched	PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm)
25	Minimum Square Slots Punched	PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm)
26	Minimum BGA PAD	0.01378" (0.35mm)
27	Minimum Width of Solder Mask Bridge.	8mil (0.2032mm)
28	Minimum Thickness of Solder Mask	>13µm (0.013mm)
29	Insulation Resistance	1012ΩNormal
30	Peel-off Strength	2.2N/mm
31	Solder float	260℃ 3min
32	E-test Voltage	50-250V
33	Thermal Conductivity	0.8-8W/M.K
34	Warp or Twist	≤0.5%
35	Flammability	FV-0
36	Minimum Height of Component indicator	0.0059"(0.15mm)
37	Minimum Open Solder Mask on Pad	0.000394" (0.01mm)