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1-4 Layers ISO9001 Metal Core PCB IMS Copper Based

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1-4 Layers ISO9001 Metal Core PCB IMS Copper Based

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-757.V1.0

Base Material:

Aluminum, Copper, Iron

Layer Count:

1-4 Layers

PCB Thickness:

0.0157" X 0.2362" (0.4-6.0mm)

Copper Weight:

0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),3OZ(105µm),4OZ(140µm) To 10oz (350µm)

Surface Finish:

HASL, Immersion Gold, Immersion Silver, OSP

Highlight:

Copper Based Metal Core PCB

ISO9001 Metal Core PCB

ISO9001 Copper Based PCB

Product Description

Copper Based PCB Manufacturing Printed Circuit Board On Copper Core Insulated Metal Substrate (IMS PCB) and Metal core PCB (MCPCB)

1. Copper Based PCB
Copper core PCB is one of the most expensive metal substrates, and its thermal conductivity is many times better than that of aluminum and iron substrates. It is suitable for high frequency circuits, high and low temperature changing regions and the heat dissipation.

2. Layer up
The circuit layer of copper substrate is required to have a large current-carrying capacity, so a thick copper foil should be used, the thickness of which is generally 35 μ m ~ 280 μ m;

Thermal insulation layer is the core technology of copper substrate too. The core thermal conductivity is composed of aluminum trioxide and silicon powder and polymer filled with epoxy resin, the thermal resistance is low (0.15), viscoelasticity is excellent, and it has the ability to resist thermal aging. It is able to withstand mechanical and thermal stress.

Metal base is the support member of copper PCB. It is required to have high thermal conductivity, generally copper sheet is used because copper can provide better thermal conductivity, suitable for drilling, punching, shearing and cutting and other conventional machining.

1.3 Metal Core PCB Capability 2021

Metal Core PCB Capability
NO.	Parameter	Value
1	Type of Metal Core	Aluminum, Copper, Iron
2	Model of Metal Core	A1100, A5052, A6061, A6063, C1100
3	Surface Finish	HASL, Immersion Gold, Immersion Silver, OSP
4	Thickness of Surface plating	HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm
5	Layer Count	1-4 Layers
6	Maximum of Board Size	23" x 46" (584mm×1168mm)
7	Mininum of Board Size	0.1969" x 0.1969" (5mm×5mm)
8	Board Thickness	0.0157" x 0.2362" (0.4-6.0mm)
9	Copper Thickness	0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),3OZ(105µm),4OZ(140µm) to 10oz (350µm)
10	Minimum Track Width	5mil (0.127mm)
11	Minimum Space	5mil (0.127mm)
12	Minimum Hole Size	0.0197" (0.5mm)
13	Maximum Hole Size	No limit
14	Minimum Holes Punched	PCB thickness <1.0mm: 0.0394" (1.0mm)
14	Minimum Holes Punched	PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15	PTH Wall Thickness	>20µm
16	Tolerance of PTH	±0.00295" (0.075mm)
17	Tolerance of NPTH	±0.00197" (0.05mm)
18	Deviation of Hole Position	±0.00394" (0.10mm)
19	Outline Tolerance	Routing: ±0.00394" (0.1mm)
19	Outline Tolerance	Punching: ±0.00591" (0.15mm)
20	Angle of V-cut	30°, 45°, 60°
21	V-cut Size	0.1969" x 47.24" (5mm×1200mm)
22	Thickness of V-cut Board	0.0236" x 0.1181" (0.6-3mm)
23	Tolerance of V-cut Angle	±5º
24	V-CUT Verticality	≤0.0059" (0.15mm)
25	Minimum Square Slots Punched	PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm)
25	Minimum Square Slots Punched	PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm)
26	Minimum BGA PAD	0.01378" (0.35mm)
27	Minimum Width of Solder Mask Bridge.	8mil (0.2032mm)
28	Minimum Thickness of Solder Mask	>13µm (0.013mm)
29	Insulation Resistance	1012ΩNormal
30	Peel-off Strength	2.2N/mm
31	Solder float	260℃ 3min
32	E-test Voltage	50-250V
33	Thermal Conductivity	0.8-8W/M.K
34	Warp or Twist	≤0.5%
35	Flammability	FV-0
36	Minimum Height of Component indicator	0.0059"(0.15mm)
37	Minimum Open Solder Mask on Pad	0.000394" (0.01mm)

1-4 Layers ISO9001 Metal Core PCB IMS Copper Based 0

1-4 Layers ISO9001 Metal Core PCB IMS Copper Based 1

Tags:

Products

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Detail Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-757.V1.0

Base Material:

Aluminum, Copper, Iron

Layer Count:

1-4 Layers

PCB Thickness:

0.0157" X 0.2362" (0.4-6.0mm)

Copper Weight:

0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),3OZ(105µm),4OZ(140µm) To 10oz (350µm)

Surface Finish:

HASL, Immersion Gold, Immersion Silver, OSP

Minimum Order Quantity:

1PCS

Price:

USD9.99-99.99

Packaging Details:

Vacuum bags+Cartons

Delivery Time:

8-9 working days

Payment Terms:

T/T

Supply Ability:

5000PCS per month

Highlight

Copper Based Metal Core PCB

ISO9001 Metal Core PCB

ISO9001 Copper Based PCB

Product Description

Copper Based PCB Manufacturing Printed Circuit Board On Copper Core Insulated Metal Substrate (IMS PCB) and Metal core PCB (MCPCB)

1.3 Metal Core PCB Capability 2021

Metal Core PCB Capability
NO.	Parameter	Value
1	Type of Metal Core	Aluminum, Copper, Iron
2	Model of Metal Core	A1100, A5052, A6061, A6063, C1100
3	Surface Finish	HASL, Immersion Gold, Immersion Silver, OSP
4	Thickness of Surface plating	HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm
5	Layer Count	1-4 Layers
6	Maximum of Board Size	23" x 46" (584mm×1168mm)
7	Mininum of Board Size	0.1969" x 0.1969" (5mm×5mm)
8	Board Thickness	0.0157" x 0.2362" (0.4-6.0mm)
9	Copper Thickness	0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),3OZ(105µm),4OZ(140µm) to 10oz (350µm)
10	Minimum Track Width	5mil (0.127mm)
11	Minimum Space	5mil (0.127mm)
12	Minimum Hole Size	0.0197" (0.5mm)
13	Maximum Hole Size	No limit
14	Minimum Holes Punched	PCB thickness <1.0mm: 0.0394" (1.0mm)
14	Minimum Holes Punched	PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15	PTH Wall Thickness	>20µm
16	Tolerance of PTH	±0.00295" (0.075mm)
17	Tolerance of NPTH	±0.00197" (0.05mm)
18	Deviation of Hole Position	±0.00394" (0.10mm)
19	Outline Tolerance	Routing: ±0.00394" (0.1mm)
19	Outline Tolerance	Punching: ±0.00591" (0.15mm)
20	Angle of V-cut	30°, 45°, 60°
21	V-cut Size	0.1969" x 47.24" (5mm×1200mm)
22	Thickness of V-cut Board	0.0236" x 0.1181" (0.6-3mm)
23	Tolerance of V-cut Angle	±5º
24	V-CUT Verticality	≤0.0059" (0.15mm)
25	Minimum Square Slots Punched	PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm)
25	Minimum Square Slots Punched	PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm)
26	Minimum BGA PAD	0.01378" (0.35mm)
27	Minimum Width of Solder Mask Bridge.	8mil (0.2032mm)
28	Minimum Thickness of Solder Mask	>13µm (0.013mm)
29	Insulation Resistance	1012ΩNormal
30	Peel-off Strength	2.2N/mm
31	Solder float	260℃ 3min
32	E-test Voltage	50-250V
33	Thermal Conductivity	0.8-8W/M.K
34	Warp or Twist	≤0.5%
35	Flammability	FV-0
36	Minimum Height of Component indicator	0.0059"(0.15mm)
37	Minimum Open Solder Mask on Pad	0.000394" (0.01mm)

1-4 Layers ISO9001 Metal Core PCB IMS Copper Based 0

1-4 Layers ISO9001 Metal Core PCB IMS Copper Based 1

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1-4 Layers ISO9001 Metal Core PCB IMS Copper Based

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RF PCB Board

Rogers PCB Board

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High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Copper Based Metal Core PCB

ISO9001 Metal Core PCB

ISO9001 Copper Based PCB

Single Sided Metal Core PCB,

ENIG RGB LED PCB Board,