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Product Details:
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| Base Material: | Aluminum | Layer Count: | Single Side |
|---|---|---|---|
| PCB Thickness: | 1.6mm ±0.16 | PCB Size: | 49 X 49mm=1PCS |
| Solder Mask: | White | Silkscreen: | Black |
| Copper Weight: | 1oz | Surface Finish: | ENIG |
| High Light: | Aluminum 5052 Metal Core PCB,IATF16949 Metal Core PCB,Aluminum 5052 ENIG Surface Finish PCB |
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Aluminum PCB Single Sided Metal Core PCB With 1W / MK for LED Lighting
1.1 General description
This is a type of Aluminum PCB for the application of Led Lighting. It's a single layer MCPCB board at 1.6 mm thick with 1 W/MK thermal conductivity. The aluminum plate is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. 25 boards are packed for shipment.
| PCB SIZE | 49 x 49mm=1PCS |
| BOARD TYPE | MCPCB |
| Number of Layers | Single sided PCB |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 35um(1oz) |
| 1W/MK dielectric material | |
| Aluminum 5052 | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 15mil/14mil |
| Minimum / Maximum Holes: | 2.5/8.5mm |
| Number of Different Holes: | 2 |
| Number of Drill Holes: | 8 |
| Thermal resistance(°C/W) | ≤0.45 |
| Breakdown Voltage(VDC) | 4000 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Thermal conductivity | 1W/MK dielectric material, MCPCB |
| Final foil external: | 1oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Electroless nickel over Immersion Gold (ENIG)( 1 µ" over 100 µ" nickel) |
| Solder Mask Apply To: | Top. 12µm Minimum. |
| Solder Mask Color: | White,PSR400 WT02 |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | Top |
| Colour of Component Legend | Black |
| Manufacturer Name or Logo: | as per requirement |
| VIA | no via |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
1.2 Layer up
The most common MCPCB construction consists of the following layers:
1) A metal substrate, typically aluminum. In some applications, a copper substrate is more appropriate due to its high thermal conductivity than aluminum (401W/MK versus 237 W/MK) but more expensive.
2) Epoxy dielectric layer. This is the most important layer in the MCPCB construction as it affects the thermal performance, electrical breakdown strength, and, in some cases, the solder joint performance of the MCPCB system. The typical thermal conductivity of the dielectric layer on a MCPCB is 1W/MK. A higher value is better for good thermal performance. A thinner dielectric layer is better for thermal performance as well but can negatively impact the ability of the MCPCB to withstand a high potential test to meet minimum electrical safety standards as required in certain lighting markets. The typical dielectric thickness layer is 100μm.
3) Top copper layer. A thicker copper layer improves heat spreading into the PCB but may pose challenges for PCB manufacturers when fabricating narrow traces or spaces. A copper thickness of 1oz (35μm) or 2oz (70μm) is common.
1.3 Features and benefits
Effective heat dissipation reduces the operating temperature of the module and prolongs the service life.
Power density and reliability are improved up 10%.
Reduce the cost of hardware and assembly,
DDU Door to door shipment with competitive shipping cost
Engineering design prevents problems from occurring in pre-production
RoHS materials
UL conformed
1.4 Applications
High frequency amplifier
Automobile
Insulation heat conduction of semiconductor devices
Module aluminum PCB
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
