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HASL UL 94-V0 Aluminum Based PCB Dual Layer 2.1mm

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HASL UL 94-V0 Aluminum Based PCB Dual Layer 2.1mm

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-751.V1.0

Base Material:

Aluminum

Layer Count:

2 Layers

PCB Thickness:

2.1mm ±0.2

PCB Size:

500 X 150mm=10PCS

Solder Mask:

White

Silkscreen:

Black

Copper Weight:

Surface Finish:

Hot Air Soldering Leveling(HASL),lead Free

Highlight:

2.1mm Aluminum Based PCB

UL 94-V0 Aluminum Based PCB

Product Description

Double Layer Aluminum Printed Circuit Board Dual Layer Aluminum Based PCB 2-Layer MCPCB

1.1 Data Sheet

PCB SIZE	500 x 150mm=10PCS
BOARD TYPE	IMS mcpcb
Number of Layers	Double sided PCB, Metal core PCB
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 70um(2oz)
	dielectric material 75um
	copper ------- 70um(2oz)
	dielectric material 75um
	Aluminum backed 1.8mm
TECHNOLOGY
Minimum Trace and Space:	5.98mil/6.18mil
Minimum / Maximum Holes:	0.3/2.2mm
Number of Different Holes:	5
Number of Drill Holes:	548
Number of Milled Slots:	11
Number of Internal Cutouts:	0
Impedance Control	no
BOARD MATERIAL
Thermal conductivity	2W / MK
Final foil external:	2oz
Final foil internal:	2oz
Final height of PCB:	2.1mm ±0.2
PLATING AND COATING
Surface Finish	Hot Air Soldering Leveling(HASL),lead free, Sn>=2.54µm
Solder Mask Apply To:	Top, 12micon Minimum.
Solder Mask Color:	Super White for LED
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP
Colour of Component Legend	Black
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	via tented.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

1.2 Layer up
The most common MCPCB construction consists of the following 3 layers:

1) A metal substrate, typically aluminum. In some applications, a copper substrate is more appropriate due to its high thermal conductivity than aluminum (401W/MK versus 237 W/MK) but more expensive.

2) Epoxy dielectric layer. This is the most important layer in the MCPCB construction as it affects the thermal performance, electrical breakdown strength, and, in some cases, the solder joint performance of the MCPCB system. The typical thermal conductivity of the dielectric layer on a MCPCB is 1W/MK. A higher value is better for good thermal performance. A thinner dielectric layer is better for thermal performance as well but can negatively impact the ability of the MCPCB to withstand a high potential test to meet minimum electrical safety standards as required in certain lighting markets. The typical dielectric thickness layer is 100μm.

3) Top copper layer. A thicker copper layer improves heat spreading into the PCB but may pose challenges for PCB manufacturers when fabricating narrow traces or spaces. A copper thickness of 1oz (35μm) or 2oz (70μm) is common.

1.3 Metal Core PCB Capability 2021

NO.	Parameter	Value
1	Type of Metal Core	Aluminum, Copper, Iron
2	Model of Metal Core	A1100, A5052, A6061, A6063, C1100
3	Surface Finish	HASL, Immersion Gold, Immersion Silver, OSP
4	Thickness of Surface plating	HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm
5	Layer Count	1-2 Layers
6	Maximum of Board Size	23" x 46" (584mm×1168mm)
7	Mininum of Board Size	0.1969" x 0.1969" (5mm×5mm)
8	Board Thickness	0.0157" x 0.2362" (0.4-6.0mm)
9	Copper Thickness	0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),3OZ(105µm),4OZ(140µm) to 10oz (350µm)
10	Minimum Track Width	5mil (0.127mm)
11	Minimum Space	5mil (0.127mm)
12	Minimum Hole Size	0.0197" (0.5mm)
13	Maximum Hole Size	No limit
14	Minimum Holes Punched	PCB thickness <1.0mm: 0.0394" (1.0mm)
14	Minimum Holes Punched	PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15	PTH Wall Thickness	>20µm
16	Tolerance of PTH	±0.00295" (0.075mm)
17	Tolerance of NPTH	±0.00197" (0.05mm)
18	Deviation of Hole Position	±0.00394" (0.10mm)
19	Outline Tolerance	Routing: ±0.00394" (0.1mm)
19	Outline Tolerance	Punching: ±0.00591" (0.15mm)
20	Angle of V-cut	30°, 45°, 60°
21	V-cut Size	0.1969" x 47.24" (5mm×1200mm)
22	Thickness of V-cut Board	0.0236" x 0.1181" (0.6-3mm)
23	Tolerance of V-cut Angle	±5º
24	V-CUT Verticality	≤0.0059" (0.15mm)
25	Minimum Square Slots Punched	PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm)
25	Minimum Square Slots Punched	PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm)
26	Minimum BGA PAD	0.01378" (0.35mm)
27	Minimum Width of Solder Mask Bridge.	8mil (0.2032mm)
28	Minimum Thickness of Solder Mask	>13µm (0.013mm)
29	Insulation Resistance	1012ΩNormal
30	Peel-off Strength	2.2N/mm
31	Solder float	260℃ 3min
32	E-test Voltage	50-250V
33	Thermal Conductivity	0.8-8W/M.K
34	Warp or Twist	≤0.5%
35	Flammability	FV-0
36	Minimum Height of Component indicator	0.0059"(0.15mm)
37	Minimum Open Solder Mask on Pad	0.000394" (0.01mm)

HASL UL 94-V0 Aluminum Based PCB Dual Layer 2.1mm 0

HASL UL 94-V0 Aluminum Based PCB Dual Layer 2.1mm 1

Tags:

Products

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Detail Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-751.V1.0

Base Material:

Aluminum

Layer Count:

2 Layers

PCB Thickness:

2.1mm ±0.2

PCB Size:

500 X 150mm=10PCS

Solder Mask:

White

Silkscreen:

Black

Copper Weight:

2oz

Surface Finish:

Hot Air Soldering Leveling(HASL),lead Free

Minimum Order Quantity:

1PCS

Price:

USD9.99-99.99

Packaging Details:

Vacuum bags+Cartons

Delivery Time:

8-9 working days

Payment Terms:

T/T

Supply Ability:

5000PCS per month

Highlight

2.1mm Aluminum Based PCB

UL 94-V0 Aluminum Based PCB

Product Description

Double Layer Aluminum Printed Circuit Board Dual Layer Aluminum Based PCB 2-Layer MCPCB

1.1 Data Sheet

PCB SIZE	500 x 150mm=10PCS
BOARD TYPE	IMS mcpcb
Number of Layers	Double sided PCB, Metal core PCB
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 70um(2oz)
	dielectric material 75um
	copper ------- 70um(2oz)
	dielectric material 75um
	Aluminum backed 1.8mm
TECHNOLOGY
Minimum Trace and Space:	5.98mil/6.18mil
Minimum / Maximum Holes:	0.3/2.2mm
Number of Different Holes:	5
Number of Drill Holes:	548
Number of Milled Slots:	11
Number of Internal Cutouts:	0
Impedance Control	no
BOARD MATERIAL
Thermal conductivity	2W / MK
Final foil external:	2oz
Final foil internal:	2oz
Final height of PCB:	2.1mm ±0.2
PLATING AND COATING
Surface Finish	Hot Air Soldering Leveling(HASL),lead free, Sn>=2.54µm
Solder Mask Apply To:	Top, 12micon Minimum.
Solder Mask Color:	Super White for LED
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP
Colour of Component Legend	Black
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	via tented.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

1.2 Layer up
The most common MCPCB construction consists of the following 3 layers:

1) A metal substrate, typically aluminum. In some applications, a copper substrate is more appropriate due to its high thermal conductivity than aluminum (401W/MK versus 237 W/MK) but more expensive.

1.3 Metal Core PCB Capability 2021

NO.	Parameter	Value
1	Type of Metal Core	Aluminum, Copper, Iron
2	Model of Metal Core	A1100, A5052, A6061, A6063, C1100
3	Surface Finish	HASL, Immersion Gold, Immersion Silver, OSP
4	Thickness of Surface plating	HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm
5	Layer Count	1-2 Layers
6	Maximum of Board Size	23" x 46" (584mm×1168mm)
7	Mininum of Board Size	0.1969" x 0.1969" (5mm×5mm)
8	Board Thickness	0.0157" x 0.2362" (0.4-6.0mm)
9	Copper Thickness	0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),3OZ(105µm),4OZ(140µm) to 10oz (350µm)
10	Minimum Track Width	5mil (0.127mm)
11	Minimum Space	5mil (0.127mm)
12	Minimum Hole Size	0.0197" (0.5mm)
13	Maximum Hole Size	No limit
14	Minimum Holes Punched	PCB thickness <1.0mm: 0.0394" (1.0mm)
14	Minimum Holes Punched	PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15	PTH Wall Thickness	>20µm
16	Tolerance of PTH	±0.00295" (0.075mm)
17	Tolerance of NPTH	±0.00197" (0.05mm)
18	Deviation of Hole Position	±0.00394" (0.10mm)
19	Outline Tolerance	Routing: ±0.00394" (0.1mm)
19	Outline Tolerance	Punching: ±0.00591" (0.15mm)
20	Angle of V-cut	30°, 45°, 60°
21	V-cut Size	0.1969" x 47.24" (5mm×1200mm)
22	Thickness of V-cut Board	0.0236" x 0.1181" (0.6-3mm)
23	Tolerance of V-cut Angle	±5º
24	V-CUT Verticality	≤0.0059" (0.15mm)
25	Minimum Square Slots Punched	PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm)
25	Minimum Square Slots Punched	PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm)
26	Minimum BGA PAD	0.01378" (0.35mm)
27	Minimum Width of Solder Mask Bridge.	8mil (0.2032mm)
28	Minimum Thickness of Solder Mask	>13µm (0.013mm)
29	Insulation Resistance	1012ΩNormal
30	Peel-off Strength	2.2N/mm
31	Solder float	260℃ 3min
32	E-test Voltage	50-250V
33	Thermal Conductivity	0.8-8W/M.K
34	Warp or Twist	≤0.5%
35	Flammability	FV-0
36	Minimum Height of Component indicator	0.0059"(0.15mm)
37	Minimum Open Solder Mask on Pad	0.000394" (0.01mm)

HASL UL 94-V0 Aluminum Based PCB Dual Layer 2.1mm 0

HASL UL 94-V0 Aluminum Based PCB Dual Layer 2.1mm 1

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HASL UL 94-V0 Aluminum Based PCB Dual Layer 2.1mm

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Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

2.1mm Aluminum Based PCB

UL 94-V0 Aluminum Based PCB

Single Sided Metal Core PCB,

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