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HASL UL 94-V0 Aluminum Based PCB Dual Layer 2.1mm

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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HASL UL 94-V0 Aluminum Based PCB Dual Layer 2.1mm

HASL UL 94-V0 Aluminum Based PCB Dual Layer 2.1mm
HASL UL 94-V0 Aluminum Based PCB Dual Layer 2.1mm HASL UL 94-V0 Aluminum Based PCB Dual Layer 2.1mm HASL UL 94-V0 Aluminum Based PCB Dual Layer 2.1mm HASL UL 94-V0 Aluminum Based PCB Dual Layer 2.1mm HASL UL 94-V0 Aluminum Based PCB Dual Layer 2.1mm

Large Image :  HASL UL 94-V0 Aluminum Based PCB Dual Layer 2.1mm

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-751.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: Aluminum Layer Count: 2 Layers
PCB Thickness: 2.1mm ±0.2 PCB Size: 500 X 150mm=10PCS
Solder Mask: White Silkscreen: Black
Copper Weight: 2oz Surface Finish: Hot Air Soldering Leveling(HASL),lead Free
High Light:

2.1mm Aluminum Based PCB

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UL 94-V0 Aluminum Based PCB

 

Double Layer Aluminum Printed Circuit Board Dual Layer Aluminum Based PCB 2-Layer MCPCB

 

1.1 Data Sheet

PCB SIZE 500 x 150mm=10PCS
BOARD TYPE IMS mcpcb
Number of Layers Double sided PCB, Metal core PCB
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 70um(2oz)
dielectric material 75um
copper ------- 70um(2oz)
dielectric material 75um
Aluminum backed 1.8mm
TECHNOLOGY  
Minimum Trace and Space: 5.98mil/6.18mil
Minimum / Maximum Holes: 0.3/2.2mm
Number of Different Holes: 5
Number of Drill Holes: 548
Number of Milled Slots: 11
Number of Internal Cutouts: 0
Impedance Control no
BOARD MATERIAL  
Thermal conductivity 2W / MK
Final foil external: 2oz
Final foil internal: 2oz
Final height of PCB: 2.1mm ±0.2
PLATING AND COATING  
Surface Finish Hot Air Soldering Leveling(HASL),lead free, Sn>=2.54µm
Solder Mask Apply To: Top, 12micon Minimum.
Solder Mask Color: Super White for LED
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend TOP
Colour of Component Legend Black
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA via tented.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

1.2 Layer up
The most common MCPCB construction consists of the following 3 layers:

 

1) A metal substrate, typically aluminum. In some applications, a copper substrate is more appropriate due to its high thermal conductivity than aluminum (401W/MK versus 237 W/MK) but more expensive.

 

2) Epoxy dielectric layer. This is the most important layer in the MCPCB construction as it affects the thermal performance, electrical breakdown strength, and, in some cases, the solder joint performance of the MCPCB system. The typical thermal conductivity of the dielectric layer on a MCPCB is 1W/MK. A higher value is better for good thermal performance. A thinner dielectric layer is better for thermal performance as well but can negatively impact the ability of the MCPCB to withstand a high potential test to meet minimum electrical safety standards as required in certain lighting markets. The typical dielectric thickness layer is 100μm.

 

3) Top copper layer. A thicker copper layer improves heat spreading into the PCB but may pose challenges for PCB manufacturers when fabricating narrow traces or spaces. A copper thickness of 1oz (35μm) or 2oz (70μm) is common.

 

1.3 Metal Core PCB Capability 2021

NO. Parameter Value
1 Type of Metal Core Aluminum, Copper, Iron
2 Model of Metal Core A1100, A5052, A6061, A6063, C1100
3 Surface Finish HASL, Immersion Gold, Immersion Silver, OSP
4 Thickness of Surface plating HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm
5 Layer Count 1-2 Layers
6 Maximum of Board Size 23" x 46" (584mm×1168mm)
7 Mininum of Board Size 0.1969" x 0.1969" (5mm×5mm)
8 Board Thickness 0.0157" x 0.2362" (0.4-6.0mm)
9 Copper Thickness 0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),3OZ(105µm),4OZ(140µm) to 10oz (350µm)
10 Minimum Track Width 5mil (0.127mm)
11 Minimum Space 5mil (0.127mm)
12 Minimum Hole Size 0.0197" (0.5mm)
13 Maximum Hole Size No limit
14 Minimum Holes Punched PCB thickness <1.0mm: 0.0394" (1.0mm)
PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15 PTH Wall Thickness >20µm
16 Tolerance of PTH ±0.00295" (0.075mm)
17 Tolerance of NPTH ±0.00197" (0.05mm)
18 Deviation of Hole Position ±0.00394" (0.10mm)
19 Outline Tolerance Routing: ±0.00394" (0.1mm)
Punching: ±0.00591" (0.15mm)
20 Angle of V-cut 30°, 45°, 60°
21 V-cut Size 0.1969" x 47.24" (5mm×1200mm)
22 Thickness of V-cut Board 0.0236" x 0.1181" (0.6-3mm)
23 Tolerance of V-cut Angle ±5º
24 V-CUT Verticality ≤0.0059" (0.15mm)
25 Minimum Square Slots Punched PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm)
PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm)
26 Minimum BGA PAD 0.01378" (0.35mm)
27 Minimum Width of Solder Mask Bridge. 8mil (0.2032mm)
28 Minimum Thickness of Solder Mask >13µm (0.013mm)
29 Insulation Resistance 1012ΩNormal
30 Peel-off Strength 2.2N/mm
31 Solder float 260℃ 3min
32 E-test Voltage 50-250V
33 Thermal Conductivity 0.8-8W/M.K
34 Warp or Twist ≤0.5%
35 Flammability FV-0
36 Minimum Height of Component indicator 0.0059"(0.15mm)
37 Minimum Open Solder Mask on Pad 0.000394" (0.01mm)

 

HASL UL 94-V0 Aluminum Based PCB Dual Layer 2.1mm 0

 

HASL UL 94-V0 Aluminum Based PCB Dual Layer 2.1mm 1
 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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