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6 Layer Ultrathin 0.6mm Automotive Printed Circuit Board for GPS Tracking

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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6 Layer Ultrathin 0.6mm Automotive Printed Circuit Board for GPS Tracking

6 Layer Ultrathin 0.6mm Automotive Printed Circuit Board for GPS Tracking
6 Layer Ultrathin 0.6mm Automotive Printed Circuit Board for GPS Tracking 6 Layer Ultrathin 0.6mm Automotive Printed Circuit Board for GPS Tracking 6 Layer Ultrathin 0.6mm Automotive Printed Circuit Board for GPS Tracking 6 Layer Ultrathin 0.6mm Automotive Printed Circuit Board for GPS Tracking 6 Layer Ultrathin 0.6mm Automotive Printed Circuit Board for GPS Tracking 6 Layer Ultrathin 0.6mm Automotive Printed Circuit Board for GPS Tracking 6 Layer Ultrathin 0.6mm Automotive Printed Circuit Board for GPS Tracking 6 Layer Ultrathin 0.6mm Automotive Printed Circuit Board for GPS Tracking

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Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-478.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: FR-4 Layer Count: 6 Layers
PCB Thickness: 0.6mm ±0.1 PCB Size: 100 X 103mm=1PCS
Solder Mask: Green Silkscreen: NO
Copper Weight: 1oz Surface Finish: Immersion Gold
High Light:

GPS Tracking Automotive Printed Circuit Board

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0.6mm Automotive Printed Circuit Board

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0.6mm 6 Layer PCB Board

 
Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking
 
1.1 General description
This is a type of 6 layer ultrathin printed circuit board built on FR-4 substrate with Tg 135°C for the application of GPS Tracking. It's only 0.6 mm thick without silkscreen on green solder mask (Taiyo) and immersion gold on pads. The base material is from Taiwan ITEQ supplying 1 up PCB per panel. Vias with 0.25mm are resin filled and capped (via in pad). They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 50 panels are packed for shipment.
 
1.2 Features and benifits
RoHS compliant and suitable for thermal reliability needs
High solderability, no stressing of circuit boards and less contamination of PCB surface.
Comprehensive equipment management and maintenance and process control
Products and Manufacturing are certified by authorized organizations.
Small quantity order is accepted
Delivery on time: >98%
 
6 Layer Ultrathin 0.6mm Automotive Printed Circuit Board for GPS Tracking 0
 
1.3 Applications
Led Lighting
Intercom System
Portable WiFi Router
GSM Tracker
Commercial Led Lighting
Modem WiFi 4G
Honeywell Access Control
Electronic Access Control
Audio Frequency Amplifier
File servers
 
1.4 Parameter and data sheet
PCB SIZE 100 x 103mm=1PCS
BOARD TYPE Multilayer PCB
Number of Layers 6 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 18um(0.5oz)+plate TOP CS
4mil prepreg
copper ------- 18um(0.5oz) GND Plane
4mil FR-4
copper ------- 18um(0.5oz) PWR Plane
4mil prepreg
copper ------- 18um(0.5oz) PWR Plane
4mil FR-4
copper ------- 18um(0.5oz) SIG
4mil prepreg
copper ------- 18um(0.5oz) BOT PS
TECHNOLOGY  
Minimum Trace and Space: 3mil/3mil
Minimum / Maximum Holes: 0.22/3.50mm
Number of Different Holes: 25
Number of Drill Holes: 2315
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control no
BOARD MATERIAL  
Glass Epoxy: FR-4, ITEQ IT140 TG>135, er<5.4
Final foil external: 1oz
Final foil internal: 0.5oz
Final height of PCB: 0.6mm ±0.1
PLATING AND COATING  
Surface Finish Immersion gold 0.025µm over 3µm Nickel (14.4% area)
Solder Mask Apply To: TOP and Bottom, 12micron Minimum
Solder Mask Color: Green, TAIYO PSR-2000 GT600D
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend No silkscreen requried.
Colour of Component Legend No silkscreen requried.
Manufacturer Name or Logo: No silkscreen requried.
VIA Plated through hole(PTH), Blind via and via capping on CS and PS, vias not be visible.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.
 
1.5 Design For Manufacture (2)
Serial NO. Procedure Item Manufacturing capability
Large volume (S<100 m²) Middle volume (S<10 m²) Prototype(S<1m²)
14 Laminating Tolerance of laminate thickness ±10% PCB thick ±10% PCB thick ±8% PCB thick
15 Maximum laminate thickness 4.0mm 6.0mm 7.0mm
16 Laminate alignment accuracy ≤±5 mil ≤±4 mil ≤±4 mil
17 Drill (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.drill bit diameter 0.2 mm 0.2 mm 0.2 mm
18 Min.slot router diameter 0.60 mm 0.60 mm 0.60 mm
19 Min.tolerance of PTH slots ±0.15mm ±0.15mm ±0.1mm
20 Max.aspect ratio 1:08 1:12 1:12
21 Hole tolerance ±3mil ±3mil ±3mil
22 Space of via to via 6mil(same net),12mil(different net) 6mil(same net),14mil(different net) 4mil(same net),12mil(different net)
23 Space of component hole to component hole 12mil(same net),16mil(different net) 12mil(same net),16mil(different net) 10mil(same net),14mil(different net)
24 Etching Min.width of etching logo 10mil(18um),12 mil (35um),12 mil(70um) 8mil(18um),10mil(35um),12 mil(70um) 6mil(18um),8 mil(35um),12mil(70um)
25 Etch factor 1.6-2.2 1.6-2.2 1.6-2.2
26 Outer layer(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.via pad diameter 20mil 16mil 16mil
27 Min.BGA pad diameter 12mil 12mil 10mil
28 Min.track and spacing 5/5mil(18um) 4/4mil(18um) 3/3.5mil(18um)
5/5mil(35um) 4/4mil(35um) 3/4mil(35um)
7/9mil(70um) 6/8mil(70um) 6/7mil(70um)
9/11mil(105um) 8/10mil(105um) 8/9mil(105um)
13/13mil(140um) 12/12mil(140um) 12/11mil(140um)
29 Minimum grid 10/10mil(35um) 8/8mil(35um) 4/8mil(35um)
30 Min.space (conductor to pad, pad to pad) 6mil(18um) 5mil(18um) 4mil(18um)
6mil(35um) 5mil(35um) 4mil(35um)
9mil(70um) 8mil(70um) 7mil(70um)
11mil(105um) 10mil(105um) 9mil(105um)
13mil(140um) 12mil(140um) 11mil(140um)

 

6 Layer Ultrathin 0.6mm Automotive Printed Circuit Board for GPS Tracking 1

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Tel: +8613481420915

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