Impedance Controlled PCB 50 Ohm Impedance Circuit Board Matt Blue PCB for Audio Adapter
1.1 General description
This is a type of matt blue PCB built on FR-4 substrate with Tg 170°C for the application of bluetooth audio adapter. It's a 4 layer board at 1.60 mm thick with 1oz outer layer and half ounce inner layer. White silkscreen over matt blue solder mask on both top and bottom side. Surface finish is immersion gold on pads. There's 50 ohm coplanar impedance with 15mil track /12mil space on top layer. The base material is used from ITEQ IT-180, entire board supplying 1 up per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed for shipment.
1.2 Features and benifits
Industrial standard material with high Tg (175℃ by DSC) and excellent thermal reliability;
Excellent thermal reliability and CAF resistance providing long-term reliability for industrial and automobile application;
RoHS compliant and suitable for high thermal reliability needs;
High solderability, no stressing of circuit boards and less contamination of PCB surface;
SMT process is resistant to reflow soldering, resistant to rework;
Comprehensive equipment management and maintenance and process control;
Strict WIP inspection and monitoring as well as working instruction;
AOI inspection;
Money-saving, Worry-saving and Labor-saving;
UL, ISO14001, IATF16949 certified;
1.3 Applications
Tracker GPS
Electronics Components
DSL Wireless Router
AC To DC Rectifier
Embedded Computer Systems
1.4 Parameter and data sheet
| PCB SIZE |
250x 130=1 PCS |
| BOARD TYPE |
Multilayer PCB |
| Number of Layers |
4 layers |
| Surface Mount Components |
YES |
| Through Hole Components |
YES |
| LAYER STACKUP |
copper ------- 17.8um(0.5oz)+plate TOP layer |
| Prepreg 0.203mm (8mil) thick, FR-4 |
| copper ------- 17.8um(0.5oz) MidLayer 1 |
| Core 1.0mm (39mil) FR-4 |
| copper ------- 17.8um(0.5oz) MidLayer 2 |
| Prepreg 0.203mm (8mil) thick, FR-4 |
| copper ------- 17.8um(0.5oz)+plate BOT layer |
| TECHNOLOGY |
|
| Minimum Trace and Space: |
5.9 mil / 5.0 mil |
| Minimum / Maximum Holes: |
0.8 mm / 3.85 mm |
| Number of Different Holes: |
11 |
| Number of Drill Holes: |
527 |
| Number of Milled Slots: |
0 |
| Number of Internal Cutouts: |
0 |
| Impedance Control: |
50 ohm coplanar impedance with 15mil track /12mil space on top layer |
| Number of Gold finger: |
0 |
| BOARD MATERIAL |
|
| Glass Epoxy: |
FR-4 Tg170℃, er<5.4.IT-180, ITEQ Supplied |
| Final foil external: |
1 oz |
| Final foil internal: |
0.5 oz |
| Final height of PCB: |
1.6 mm ±0.16 |
| PLATING AND COATING |
|
| Surface Finish |
Immersion gold (22.1% ) 0.05µm over 3µm nickel |
| Solder Mask Apply To: |
TOP and Bottom, 12micron Minimum |
| Solder Mask Color: |
Matt Blue, KSM-6189BLM1 |
| Solder Mask Type: |
LPSM |
| CONTOUR/CUTTING |
Routing, v-groove |
| MARKING |
|
| Side of Component Legend |
TOP and Bottom. |
| Colour of Component Legend |
White, IJR-4000 MW300, Taiyo brand |
| Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
| VIA |
Plated through hole(PTH), minimum size 0.8mm. |
| FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE |
|
| Outline dimension: |
0.0059" |
| Board plating: |
0.0029" |
| Drill tolerance: |
0.002" |
| TEST |
100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA |
Worldwide, Globally. |
1.5 Impedance PCB- Impedance match
If there is signal transmission in the circuit board, it is expected to be smoothly transmitted from the sending end to the receiving end under the condition of minimum energy loss, and the receiving end can completely absorbs it without any reflection. To achieve this kind of transmission, the impedance of the circuit must be equal to the internal impedance of the sending end, which is called "impedance match."
So when the signal is transmitted in the PCB, the characteristic impedance of the PCB board must be matched with the electronic impedance of the head and tail components. Once the impedance value exceeds the tolerance, the transmitted signal energy will be reflected, scattered, attenuated or delayed, resulting in incomplete signal and signal distortion.
Impedance match is one of the design elements when designing high-speed PCB circuits. However, the impedance value is absolutely related with wiring mode. For example, whether wiring on the surface layer or inner layer, the distance from the reference power layer or ground layer, the width of wiring, the PCB material, etc. will affect the characteristic impedance of wiring. That is to say, the impedance value can be determined only after wiring layout, while the characteristic impedance produced by different PCB manufacturers is also slightly different. The wiring layout condition of impedance discontinuity cannot be completely considered in general simulation software due to the limitation of the circuit model or the mathematical algorithm used. In this case, only some temninators, such as series resistors, can be reserved on the schematic diagram to mitigate the effect of discontinuous wiring impedance. The method to completely solve the problem is still trying to avoid the occurrence of impedance discontinuities when wiring layout.
