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Rogers TMM10 Double-Sided PCB High-Dk Thermoset Microwave Circuit Board

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China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Rogers TMM10 Double-Sided PCB High-Dk Thermoset Microwave Circuit Board

Rogers TMM10 Double-Sided PCB High-Dk Thermoset Microwave Circuit Board
Rogers TMM10 Double-Sided PCB High-Dk Thermoset Microwave Circuit Board Rogers TMM10 Double-Sided PCB High-Dk Thermoset Microwave Circuit Board

Large Image :  Rogers TMM10 Double-Sided PCB High-Dk Thermoset Microwave Circuit Board

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-341.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month

Rogers TMM10 Double-Sided PCB High-Dk Thermoset Microwave Circuit Board

Description
Base Material: Rogers TMM10 Thermoset Microwave Substrate Layer Count: 2 Layers
PCB Thickness: 5.1mm PCB Size: 63.9mm × 48mm (±0.15mm Tolerance, 1PCS)
Solder Mask: No Silkscreen: NO
Copper Weight: 1oz Surface Finish: ENIG
Highlight:

Adhesiveless Flexible Printed Circuit FPC

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Tracking Flexible Printed Circuit FPC

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Transparent Thin Glueless Polyimide FPC

Built to serve demanding microwave and precision RF projects, this custom double-sided rigid PCB uses Rogers TMM10 thermoset ceramic substrate. The material brings together advantages found in PTFE and ceramic dielectrics while overcoming mechanical limitations that plague many traditional high-frequency laminates. Measuring 63.9mm × 48mm with a tight ±0.15mm dimensional tolerance and a finished board thickness of 5.1mm, this board features ENIG surface finish with no solder mask or silkscreen applied to either side. It relies purely on through-hole construction and contains no blind vias, supporting fine 4/7 mil trace/space routing alongside 0.25mm microvias to accommodate compact, high-precision circuit layouts. Every finished unit undergoes full electrical testing before shipment, adheres to IPC-Class-2 specifications, and is available for custom orders and delivery across the globe.

 

PCB Specifications

This TMM10 double-sided PCB is precision manufactured for high-Dk microwave circuit designs. Its carefully defined structural parameters deliver robust mechanical integrity and consistent electrical performance. The straightforward through-hole architecture minimizes signal interference between layers, making it a solid choice for RF circuits requiring dependable signal transmission.

Specification Item Parameter Details
Base Material Rogers TMM10 thermoset microwave substrate
Layer Configuration Double-sided (2-layer rigid PCB)
Board Dimensions 63.9mm × 48mm (±0.15mm tolerance, 1PCS)
Minimum Trace / Space 4/7 mils
Minimum Hole Size 0.25mm
Via Type Through-hole only, no blind vias
Finished Board Thickness 5.1mm
Outer Copper Weight 1oz (1.4 mils)
Via Plating Thickness 20μm
Surface Finish ENIG
Silkscreen Top & Bottom: No
Solder Mask Top & Bottom: No
Pre-Shipment Test 100% electrical test prior to shipment

 

PCB Stack-up Structure

This PCB employs a symmetrical double-sided stack-up. At its core sits a thick 5.08mm (200mil) Rogers TMM10 core, with 35μm copper cladding laminated to both the top and bottom faces. The balanced build matches copper’s thermal expansion rate, which prevents circuit warping and signal drift triggered by temperature fluctuations, securing stable operation for high-frequency circuits over time.

Layer Structure Material & Thickness
Copper_layer_1 35 μm
TMM10 Core 5.08 mm (200mil)
Copper_layer_2 35 μm

 

PCB Statistic

Designed for precision microwave assembly and testing, this board hosts 26 components with thoughtfully arranged pads and vias to meet high-Dk circuit footprint constraints. All manufacturing files are exported as standard Gerber RS-274-X artwork. This universal format works seamlessly with most PCB fabrication and inspection equipment, supporting accurate prototyping and consistent volume production.

Statistical Item Quantity
Components 26
Total Pads 38
Thru Hole Pads 21
Top SMT Pads 17
Bottom SMT Pads 0
Vias 13
Nets 2

 

Rogers TMM10 Double-Sided PCB High-Dk Thermoset Microwave Circuit Board

 

Introduction of Rogers TMM10 Material

TMM10 stands out as a premium thermoset microwave composite substrate. It captures the performance benefits of PTFE and ceramic dielectric materials without the mechanical drawbacks and complicated processing requirements typical of conventional high-frequency substrates. Available across a broad thickness range from 0.0015 to 0.500 inches with tight thickness tolerance, it offers flexible implementation across many high-frequency circuits and precision microwave applications.

 

Rogers TMM10 Double-Sided PCB High-Dk Thermoset Microwave Circuit Board

 

Properties

TMM10 Typical Value
Property TMM10 Direction Units Condition Test Method
Dielectric Constant,εProcess 9.20±0.23 Z   10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 9.8 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.0022 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant -38 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 108 - Mohm.cm - ASTM D257
Surface Resistivity 4 x 107 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 285 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 21 X ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 21 Y ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 20 Z ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.76 Z W/m/K 80 ℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.0 (0.9) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 13.62 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.79 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.09 - % D/24/23 ASTM D570
3.18mm (0.125") 0.2
Specific Gravity 2.77 - - A ASTM D792
Specific Heat Capacity 0.74 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

 

Product Benefits

Unlike ordinary high-frequency substrates, TMM10 combines strong mechanical endurance and good process compatibility. It lowers manufacturing risks while preserving long-term circuit reliability:

 

High mechanical strength resists creep and cold flow, maintaining structural integrity under sustained operational stress.

 

Good resistance against common fabrication chemicals, protecting the substrate from damage during production and assembly.

 

Sodium napthanate pre-treatment is unnecessary before electroless plating, simplifying processing workflows and boosting production efficiency.

 

Its thermoset resin chemistry supports stable wire-bonding, satisfying strict requirements for high-precision packaging and assembly.

 

Thermal expansion matched to copper enhances plated through-hole reliability and reduces failure risks during thermal cycling.

 

Typical Applications

Thanks to its high Dk stability, low signal loss and robust mechanical performance, this TMM10 double-sided PCB is widely adopted in precision microwave and satellite communication sectors:

 

  • Precision chip testers
  • Dielectric polarizers
  • Satellite communication systems
  • GPS antennas and patch antennas

 

Conclusion

Finished with reliable ENIG surface treatment, this custom Rogers TMM10 double-sided PCB delivers high Dk, low-loss and thermally stable performance for microwave and RF systems. Its resistance to creep, chemical stability and wire-bonding capability make it suitable for the rigorous production and operating conditions of satellite communication, precision test hardware and antenna systems. Every board passes full electrical inspection and conforms to IPC-Class-2 standards. It delivers custom PCB solutions and global shipping to engineering teams working on high-frequency electronics worldwide.

 

Rogers TMM10 Double-Sided PCB High-Dk Thermoset Microwave Circuit Board

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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